公开(公告)号：US20200069269A1

公开(公告)日：2020-03-05

申请号：US16468126

申请日：2017-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae Woong HAN ,  Seung Hwan LEE ,  Jin Woo LEE ,  N.V. DEEPAK

IPC: A61B6/00 ,  G01N23/04

Abstract: The present disclosure relates to an X-ray imaging apparatus. The X-ray imaging apparatus includes a first column connected to a main body, a second column connected to the first column and provided to be movable relative to the first column, an arm connected to the second column and slidably provided along the second column, and a weight compensator provided to compensate for the weight of the second column and the arm, wherein the weight compensator, the second column and the arm are connected by a wire, and the second column is provided with an elastic member connected to the arm and providing an elastic force such that the arm is moved by a uniform force regardless of the position of the second column.

公开(公告)号：US20190175124A1

公开(公告)日：2019-06-13

申请号：US16277730

申请日：2019-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ku-Il JANG ,  Jung Min KIM ,  Jae Won NAM ,  Seung Hwan LEE

IPC: A61B6/10 ,  A61B6/00

Abstract: Disclosed herein is a mobile x-ray imaging apparatus having an improved structure to prevent breakage of or damage to an x-ray detector. One or more damping units are installed at base plates of one or more slots. The one or more damping units minimize an impact that may be applied to one or more x-ray detectors in a process of storing the one or more x-ray detector in the one or more slots.

公开(公告)号：US20140312369A1

公开(公告)日：2014-10-23

申请号：US14146689

申请日：2014-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju Heon YOON ,  Sang Yeon KIM ,  Seung Hwan LEE ,  Jin Hyun LEE ,  Wan Tae LIM ,  Hyun Kwon HONG

IPC: H01L33/36

CPC classification number: H01L33/382 ,  H01L33/20 ,  H01L33/22 ,  H01L33/40 ,  H01L33/44 ,  H01L2224/13 ,  H01L2933/0016

Abstract: A semiconductor light emitting device including a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a first electrode connected to the first conductivity type semiconductor layer; a second electrode including a contact layer connected to the second conductivity type semiconductor layer, a capping layer disposed on the contact layer, and a metal buffer layer disposed on the capping layer, the metal buffer layer encompasses an upper and lateral surface of the capping layer; a first insulating layer disposed on the light emitting structure such that the first and second electrodes are exposed; and a second insulating layer disposed on the first insulating layer such that at least a portion of the first electrode and at least a portion of the metal buffer layer are exposed.

Abstract translation: 一种半导体发光器件，包括包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 连接到第一导电类型半导体层的第一电极; 第二电极，包括连接到第二导电类型半导体层的接触层，设置在接触层上的覆盖层和设置在覆盖层上的金属缓冲层，金属缓冲层包围覆盖层的上表面和侧表面 ; 设置在所述发光结构上以使得所述第一和第二电极露出的第一绝缘层; 以及设置在所述第一绝缘层上的第二绝缘层，使得所述第一电极的至少一部分和所述金属缓冲层的至少一部分露出。

公开(公告)号：US20140219303A1

公开(公告)日：2014-08-07

申请号：US14154448

申请日：2014-01-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong In YANG ,  Seung Hwan LEE ,  Hyun Kwon HONG

IPC: H01L33/48 ,  H01S5/20

CPC classification number: H01S5/20 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, a first electrode disposed below the light emitting structure, the first electrode being electrically connected to the first conductivity type semiconductor layer, a second electrode within the light emitting structure, the second electrode being electrically connected to the second conductivity type semiconductor layer, an insulating part electrically separating the second electrode from the first conductivity type semiconductor layer, the active layer, and the first electrode, a first pad electrode electrically connected to the first electrode, and a second pad electrode electrically connected to the second electrode, the second pad electrode being exposed to a top surface of the light emitting structure.

Abstract translation: 半导体发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层;第一电极，设置在发光结构的下方，第一电极与第一导电性电连接 在所述发光结构内的第二电极，所述第二电极与所述第二导电型半导体层电连接;绝缘部，其将所述第二电极与所述第一导电型半导体层，所述有源层和所述第一导电型半导体层 电极，电连接到第一电极的第一焊盘电极和与第二电极电连接的第二焊盘电极，第二焊盘电极暴露于发光结构的顶表面。

公开(公告)号：US20140199796A1

公开(公告)日：2014-07-17

申请号：US14150713

申请日：2014-01-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hun KIM ,  Sung Joon KIM ,  Su Yeol LEE ,  Seung Hwan LEE ,  Tae Sung JANG

IPC: H01L33/46 ,  H01L21/78 ,  H01L33/52

CPC classification number: H01L21/78 ,  H01L24/18 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump; polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices.

Abstract translation: 一种制造半导体发光器件的方法包括在衬底上形成多个半导体发光器件，所述半导体发光器件具有形成在其上表面上的至少一个电极焊盘; 通过在每个半导体发光器件的电极焊盘上形成凸起芯，形成一个导电凸块，并形成一个包围凸块的反射凸块; 在所述多个半导体发光器件上形成含有荧光体的树脂封装部，以包围所述导电凸块; 抛光树脂封装部分以将导电凸块的凸起芯露出到树脂封装部分的上表面; 以及通过在半导体发光器件之间切割树脂封装部分来形成单独的半导体发光器件。

公开(公告)号：US20210020490A1

公开(公告)日：2021-01-21

申请号：US17060800

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kunsil LEE ,  Seung Hwan LEE

IPC: H01L21/683 ,  H01L21/56 ,  H01L23/544 ,  H01L23/31 ,  H01L21/78

Abstract: Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.

公开(公告)号：US20150052185A1

公开(公告)日：2015-02-19

申请号：US14530936

申请日：2014-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hwan LEE

IPC: H04L29/08

CPC classification number: H04L67/10 ,  G06F9/445 ,  G06F17/30194 ,  H04L67/06

Abstract: A method and system is provided for editing a file information system of a host device by using a client device connected to the host device via a Near Field Communication (NFC) channel while maintaining the foreground-running application execution screen of the host device. A method for managing a file information system of a host device by using a client device according to the present invention includes establishing a near field communication channel between the client device and the host device; copying the file information system from the host device to the client device; editing, at the client device, the file information system by means of an application selected in the file information system; and updating the file information system stored in the host device with the edited file information system which is transmitted from the client device to the host device.

Abstract translation: 提供了一种方法和系统，用于通过使用通过近场通信（NFC）信道连接到主机设备的客户端设备来编辑主机设备的文件信息系统，同时保持主机设备的前台运行应用执行屏幕。 通过使用根据本发明的客户端设备来管理主机设备的文件信息系统的方法包括在客户端设备和主机设备之间建立近场通信信道; 将文件信息系统从主机设备复制到客户端设备; 在所述客户端设备处，通过在所述文件信息系统中选择的应用来编辑所述文件信息系统; 以及使用从客户端设备发送到主机设备的编辑文件信息系统更新存储在主机设备中的文件信息系统。

公开(公告)号：US20140101598A1

公开(公告)日：2014-04-10

申请号：US14095511

申请日：2013-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Ok KIM ,  Chan Woo PARK ,  Seung Hwan LEE

IPC: G06F3/0488 ,  G06F3/0481

CPC classification number: G06F3/0488 ,  G06F3/0481 ,  G06F3/04812 ,  G06F3/04892 ,  H04M1/72544 ,  H04M1/72583 ,  H04M2250/56

Abstract: An idle screen arrangement structure and an idle screen display method for a mobile terminal are provided. The idle screen arrangement structure includes a base idle screen; and a plurality of different extended idle screens arranged in four or eight directions around the base idle screen. A first idle screen of the base idle screen and extended idle screens is displayed on the display unit. In response to an input of a screen-switch event, a second idle screen of the base idle screen and extended idle screens different from the first idle screen is displayed instead of the first idle screen. When the pointer is moved into a screen-switch region on the display unit, the first idle screen is switched to the second idle screen. The base and extended idle screens may have shortcuts to particular functions, and be switched one another in a circular or a non-circular manner.

Abstract translation: 提供了一种用于移动终端的空闲屏幕排列结构和空闲屏幕显示方法。 空闲屏幕布置结构包括基本空闲屏幕; 以及围绕基本空闲屏幕以四个或八个方向布置的多个不同的延长空闲屏幕。 基本空闲屏幕和扩展空闲屏幕的第一空闲屏幕显示在显示单元上。 响应于屏幕切换事件的输入，显示基本空闲屏幕的第二空闲屏幕和与第一空闲屏幕不同的扩展空闲屏幕，而不是第一空闲屏幕。 当指针移动到显示单元上的屏幕切换区域时，第一空闲屏幕切换到第二空闲屏幕。 基座和延长的空闲屏幕可以具有特定功能的快捷方式，并且以圆形或非圆形方式彼此切换。

公开(公告)号：US20190088524A1

公开(公告)日：2019-03-21

申请号：US15964294

申请日：2018-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunsil Lee ,  Seung Hwan LEE

IPC: H01L21/683 ,  H01L21/56 ,  H01L21/78 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/544 ,  H01L2221/68381 ,  H01L2223/54433

Abstract: Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.

公开(公告)号：US20140117392A1

公开(公告)日：2014-05-01

申请号：US13948797

申请日：2013-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Hun KIM ,  Sung Joon KIM ,  Yong Il KIM ,  Yung Ho RYU ,  Myeong Rak SON ,  Su Yeol LEE ,  Seung Hwan LEE ,  Tae Sung JANG ,  Su Min HWANGBO

IPC: H01L33/60

CPC classification number: H01L33/007 ,  H01L33/0079

Abstract: A method for manufacturing a semiconductor light emitting device includes forming an isolation pattern on a semiconductor single crystal growth substrate. A first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially grown in one chip unit region of the semiconductor single crystal growth substrate defined by the isolation pattern, and a reflective metal layer is formed to cover the light emitting structure and the isolation pattern. A support substrate is formed on the reflective metal layer, and the semiconductor single crystal growth substrate is removed from the light emitting structure. The support substrate is then cut into individual light emitting devices.

Abstract translation: 一种制造半导体发光器件的方法包括在半导体单晶生长衬底上形成隔离图案。 在由隔离图案限定的半导体单晶生长基板的一个芯片单元区域中依次生长第一导电型半导体层，有源层和第二导电型半导体层，并且形成反射金属层以覆盖 发光结构和隔离图案。 在反射金属层上形成支撑基板，从发光结构去除半导体单晶生长基板。 然后将支撑衬底切割成单个发光器件。