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公开(公告)号：US20230247823A1
公开(公告)日：2023-08-03
申请号：US18056085
申请日：2022-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongkeun CHO , Jae Seong Park , Youngseok Kim , Young Sin Kim , Daeyoung Moon , Keum Joo Lee , Sung-Wook Jung , Sungduk Hong , Suhwan Hwang
CPC classification number: H01L27/10814 , G11C5/063 , H01L27/10897
Abstract: A semiconductor memory device includes a substrate including a cell area and a peripheral area defined by a periphery of the cell area, the cell area including a dummy cell area and a normal cell area, and an active area defined by a cell element isolation film. The device includes a cell area separation film defining the cell area in the substrate, the dummy cell area defining a boundary with the cell area separation film between the normal cell area and the cell area separation film. The device includes a normal bit-line on the normal cell area and extending in a first direction, a dummy bit-line group on the dummy cell area, the dummy bit-line group including a plurality of dummy bit-lines extending in the first direction, and a plurality of storage contacts connected to the active area and located along a second direction perpendicular to the first direction.
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公开(公告)号：US11189467B2
公开(公告)日：2021-11-30
申请号：US16444590
申请日：2019-06-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-Uk Park , Sun-Ho Kim , Sung-Jin Kim , Jong-Geug Kim , Kyu-Chul Shim , Ji-Hoon Yeo , Shin-Sang Lee , Gyu-Chan Jeoung , Sung-Wook Jung , Jae-Chul Hwang
IPC: H01J37/32 , H01L21/687
Abstract: An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.
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Patent Agency Ranking
公开(公告)号：US10971382B2
公开(公告)日：2021-04-06
申请号：US16245339
申请日：2019-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwang-Nam Kim , Byeong-Hee Kim , Jeongryul Kim , Hae-Joong Park , Jong-Woo Sun , Sang-Rok Oh , Sung-Wook Jung , Nam-Young Cho , Jung-Pyo Hong
IPC: H01L21/67 , H01L21/677 , H01L21/673
Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.
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公开(公告)号：US11501987B2
公开(公告)日：2022-11-15
申请号：US17200032
申请日：2021-03-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwang-nam Kim , Byeong-Hee Kim , Jeongryul Kim , Hae-Joong Park , Jong-Woo Sun , Sang-Rok Oh , Sung-Wook Jung , Nam-Young Cho , Jung-Pyo Hong
IPC: H01L21/67 , H01L21/677 , H01L21/673
Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.
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公开(公告)号：US20210202283A1
公开(公告)日：2021-07-01
申请号：US17200032
申请日：2021-03-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwang-nam Kim , Byeong-Hee Kim , Jeongryul Kim , Hae-Joong Park , Jong-Woo Sun , Sang-Rok Oh , Sung-Wook Jung , Nam-Young Cho , Jung-Pyo Hong
IPC: H01L21/67 , H01L21/677 , H01L21/673
Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.
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公开(公告)号：US20200020555A1
公开(公告)日：2020-01-16
申请号：US16245339
申请日：2019-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwang-nam Kim , Byeong-Hee Kim , Jeongryul Kim , Hae-Joong Park , Jong-Woo Sun , Sang-Rok Oh , Sung-Wook Jung , Nam-Young Cho , Jung-Pyo Hong
IPC: H01L21/67 , H01L21/673 , H01L21/677
Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.
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公开(公告)号：US20200161099A1
公开(公告)日：2020-05-21
申请号：US16444590
申请日：2019-06-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-Uk Park , Sun-Ho Kim , Sung-Jin Kim , Jong-Geug Kim , Kyu-Chul Shim , Ji-Hoon Yeo , Shin-Sang Lee , Gyu-Chan Jeoung , Sung-Wook Jung , Jae-Chul Hwang
IPC: H01J37/32 , H01L21/687
Abstract: An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.
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