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公开(公告)号：US20180173602A1
公开(公告)日：2018-06-21
申请号：US15706923
申请日：2017-09-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf CINAR
Abstract: A method for estimating the remaining life of a solid state drive (SSD) device includes generating a sensing value by periodically measuring an environmental variable, generating a load value associated with the SSD device based on the sensing value and a distance between the sensor and the SSD device, calculating stress applied to the SSD device based on the load value, calculating damage of the SSD device based on a stress-life curve and the stress, and determining the remaining life of the SSD device based on a difference between a threshold value and the damage. The stress-life curve may represent a relationship between the stress and life of the SSD device.
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公开(公告)号：US20220418097A1
公开(公告)日：2022-12-29
申请号：US17898907
申请日：2022-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunki YUN , Kwangkyu BANG , Jihong KIM , Eunji YU , Kyungjae KIM , Yusuf CINAR
Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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公开(公告)号：US20220278475A1
公开(公告)日：2022-09-01
申请号：US17743197
申请日：2022-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seon Gyun BAEK , Jae Hong PARK , Yusuf CINAR , Han Hong LEE
IPC: H01R13/50 , H01R13/6585 , H01R13/6581 , H01R13/405
Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
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公开(公告)号：US20240114638A1
公开(公告)日：2024-04-04
申请号：US18529889
申请日：2023-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf CINAR , Jae Hong PARK , Han Hong LEE , Seon Gyun BAEK , Won-Gi HONG
CPC classification number: H05K5/0217 , H01R12/7023 , H01R12/721 , H01R12/73 , H01R13/621 , H05K5/0008 , H05K5/026 , H05K7/20409 , H01L25/18
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号：US20200373221A1
公开(公告)日：2020-11-26
申请号：US16870068
申请日：2020-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yusuf CINAR , Jaehong PARK , Seongyun BAEK , Hanhong LEE
IPC: H01L23/427 , H01L23/00 , H01L25/065 , H01L21/48 , H01L21/52
Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.
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Patent Agency Ranking
公开(公告)号：US20180158492A1
公开(公告)日：2018-06-07
申请号：US15626574
申请日：2017-06-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangsu LEE , Yusuf CINAR , Nam-Hoon KIM , Heeyoub KANG , Young-Rok OH
CPC classification number: G11C7/04 , G06F13/00 , G11C7/1045 , G11C11/1673 , G11C11/1695 , G11C11/40626 , G11C13/0069 , G11C16/10 , G11C16/34 , G11C16/3418
Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.
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公开(公告)号：US20210356084A1
公开(公告)日：2021-11-18
申请号：US17391346
申请日：2021-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongyun BAEK , Jaehong PARK , Yusuf CINAR , Hanhong LEE
Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
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公开(公告)号：US20210006001A1
公开(公告)日：2021-01-07
申请号：US16822872
申请日：2020-03-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seon Gyun BAEK , Jae Hong PARK , Yusuf CINAR , Han Hong LEE
IPC: H01R13/50 , H01R13/405 , H01R13/6581 , H01R13/6585
Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
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公开(公告)号：US20190278343A1
公开(公告)日：2019-09-12
申请号：US16057049
申请日：2018-08-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yusuf CINAR , Jae Hong Park , Han Hong Lee , Jung Hoon Kim , Ki Taek Lee
Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.
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公开(公告)号：US20220124904A1
公开(公告)日：2022-04-21
申请号：US17358800
申请日：2021-06-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunki YUN , Kwangkyu BANG , Jihong KIM , Eunji YU , Kyungjae KIM , Yusuf CINAR
Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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