公开(公告)号：US20090095975A1

公开(公告)日：2009-04-16

申请号：US12332678

申请日：2008-12-11

申请人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

发明人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

摘要翻译： 一种用于防止半导体层之间的电短路并且具有优异的接合强度的发光二极管封装。 发光二极管封装包括封装衬底，结合到封装衬底的上表面的发光二极管芯片，以及用于将发光二极管芯片接合到封装衬底的接合材料。 封装基板具有形成在其接合表面中的凹部以容纳接合材料。

公开(公告)号：US07268014B2

公开(公告)日：2007-09-11

申请号：US11314003

申请日：2005-12-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

IPC分类号： H01L21/00

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2933/0075 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

摘要翻译： 本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。 在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。 然后，将发光装置安装在凹部的底部。 优选地，封装衬底是由Al或Al基金属制成的金属衬底。

公开(公告)号：US08686295B2

公开(公告)日：2014-04-01

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US08610146B2

公开(公告)日：2013-12-17

申请号：US12238663

申请日：2008-09-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

摘要翻译： 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US08586128B2

公开(公告)日：2013-11-19

申请号：US12467513

申请日：2009-05-18

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： B05D5/12

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

公开(公告)号：US20100032705A1

公开(公告)日：2010-02-11

申请号：US12238663

申请日：2008-09-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

摘要翻译： 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US20070221928A1

公开(公告)日：2007-09-27

申请号：US11717154

申请日：2007-03-13

申请人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

摘要： A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

摘要翻译： 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。

公开(公告)号：US20070217221A1

公开(公告)日：2007-09-20

申请号：US11723059

申请日：2007-03-16

申请人： Young Ki Lee ,  Seog Moon Choi ,  Young Bok Yoon ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Young Bok Yoon ,  Sang Hyun Shin

IPC分类号： F21V7/04

CPC分类号： H05K1/053 ,  F21K9/00 ,  F21V29/76 ,  F21V29/89 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/0347 ,  H05K2201/10106 ,  H05K2203/0315 ,  H01L2924/00

摘要： An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.

摘要翻译： 阳极氧化金属基板模块，其散热性能优异，制造成本降低。 提供金属板。 阳极氧化膜形成在金属板上。 发热装置安装在金属板上。 此外，在阳极氧化膜上形成导线。

公开(公告)号：US08047693B2

公开(公告)日：2011-11-01

申请号：US12507356

申请日：2009-07-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

IPC分类号： F21V7/00

CPC分类号： F21V29/63 ,  B61D29/00 ,  F21S41/141 ,  F21S41/143 ,  F21S45/43 ,  F21V29/02 ,  F21W2102/00 ,  F21W2107/10 ,  F21Y2115/10 ,  F28F13/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

摘要翻译： 一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。

公开(公告)号：US07863640B2

公开(公告)日：2011-01-04

申请号：US11710436

申请日：2007-02-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L23/34 ,  H05K1/14

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。