Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Abstract:
A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.
Abstract:
A structure includes a channel waveguide and a pocket adjacent to an input facet of the channel waveguide. A laser having an output facet is positioned in the pocket. The structure includes a stop on either the laser or a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.
Abstract:
A structure includes a channel waveguide and a pocket adjacent to an input facet of the channel waveguide. A laser having an output facet is positioned in the pocket. The structure includes a stop on either the laser or a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.
Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Abstract:
A laser is configured to emit light along a substrate-parallel plane along a first surface of the laser. An etched facet is on an emitting end of a lasing cavity and an etched mirror is on another end of the lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substrate-parallel plane. A slider comprises an optical input coupler configured to couple the light from the laser into a waveguide of the slider. At least one protrusion is disposed on the laser and at least one recession is disposed on the slider, the at least one protrusion and the at least one recession configured to align the laser with the slider to allow the light to be coupled into the optical input coupler.
Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Abstract:
Magnetic write heads for heat-assisted magnetic recording (HAMR) are disclosed that include a laser diode having a light emitting edge or surface mounted on a slider, an optical waveguide, and a printed bonding agent disposed in an air gap between the laser diode and the slider. The printed bonding agent can be applied by ink jet printing or aerosol jet printing. Also included is a method that includes attaching a laser diode to a slider of a magnetic write head and depositing a bonding agent into the air gap using a focused stream of bonding agent. A light-emitting edge or surface of the laser diode is adjacent to an optical waveguide. The light-emitting edge or surface of the laser diode and the optical input of the waveguide define an aligned direction and an air gap extends from the light-emitting edge or surface of the laser diode in a direction perpendicular to the aligned direction. The bonding agent can be applied by ink jet printing or aerosol jet printing.
Abstract:
A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.