公开(公告)号：US08236666B2

公开(公告)日：2012-08-07

申请号：US12664751

申请日：2007-12-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

IPC分类号： H01L21/00 ,  H01L21/46 ,  H01L21/30

CPC分类号： H01L23/3737 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/19107 ,  H05K1/056 ,  H05K3/041 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2201/09745 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。

公开(公告)号：US20100201002A1

公开(公告)日：2010-08-12

申请号：US12664751

申请日：2007-12-05

申请人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

发明人： Seiki Hiramatsu ,  Kei Yamamoto ,  Atsuko Fujino ,  Takashi Nishimura ,  Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Nobutake Taniguchi ,  Hiroshi Yoshida

IPC分类号： H01L23/36 ,  H01L21/58 ,  H01L23/31

CPC分类号： H01L23/3737 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/19107 ,  H05K1/056 ,  H05K3/041 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2201/09745 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。

公开(公告)号：US08193633B2

公开(公告)日：2012-06-05

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US20100226095A1

公开(公告)日：2010-09-09

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H05K7/20 ,  F28F7/00 ,  B21D53/02

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US6130496A

公开(公告)日：2000-10-10

申请号：US355245

申请日：1999-07-27

申请人： Hideki Takigawa ,  Wataru Bitou ,  Makoto Tsukiji ,  Hiroki Shiota ,  Shiro Takada ,  Nobuo Urakawa

发明人： Hideki Takigawa ,  Wataru Bitou ,  Makoto Tsukiji ,  Hiroki Shiota ,  Shiro Takada ,  Nobuo Urakawa

IPC分类号： H02K3/34 ,  H02K3/40

CPC分类号： H02K3/345 ,  H02K3/40

摘要： A stator coil for a rotating electrical machine having a ground wall insulation of a stator coil impregnated with a resin, maintaining a releasing characteristic between the ground wall insulation and a slot of a stator core, preventing surface corona and exhibiting excellent characteristics for a long time. The stator coil of the rotating electrical machine has a conductor covered with an insulating layer and a surface-corona preventive layer, the stator coil being accommodated in the slot of a stator core and, together with the stator core, impregnated with a thermosetting resin so that the stator coil is integrated with the stator core. The surface-corona preventive layer has a wound semiconductive tape and a composite tape including a fluorine-containing non-bonding material layer on a second semiconductive tape. The slot of a stator core and the insulating layer contact the semiconductive tapes and the non-bonding material is disposed between the semiconductive tapes, forming a gap in a widthwise direction of the non-bonding material layer.

摘要翻译： PCT No.PCT / JP97 / 04668 Sec。 371日期：1999年7月27日 102（e）1999年7月27日PCT 1997年12月18日PCT公布。 公开号WO99 /​​ 31782 日期1999年6月24日用于旋转电机的定子线圈，其具有浸渍有树脂的定子线圈的接地壁绝缘体，保持接地壁绝缘体与定子芯体的槽之间的释放特性，防止表面电晕并表现出优异 特点长期以来。 旋转电机的定子线圈具有覆盖有绝缘层和表面电晕防护层的导体，定子线圈容纳在定子芯的槽中，并与定子芯一起浸渍有热固性树脂，因此 定子线圈与定子芯集成。 表面电晕防护层具有卷绕的半导体带和在第二半导体带上包括含氟非接合材料层的复合带。 定子芯的槽和绝缘层接触半导体带和非接合材料设置在半导体带之间，在非接合材料层的宽度方向上形成间隙。