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公开(公告)号：US20080172872A1
公开(公告)日：2008-07-24
申请号：US12055443
申请日：2008-03-26
申请人： Stephen H. Hall , Bryce D. Horine , Gary A. Brist , Howard Heck
发明人： Stephen H. Hall , Bryce D. Horine , Gary A. Brist , Howard Heck
IPC分类号： H05K3/10
CPC分类号： H05K1/024 , H05K1/0298 , H05K1/0366 , H05K2201/0187 , H05K2201/029 , H05K2201/09236 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，高速互连包括FR4材料层，FR4材料层中的沟槽和位于沟槽附近的一对传输线。 沟槽充满均质材料。 描述和要求保护其他实施例。
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公开(公告)号：US08732942B2
公开(公告)日：2014-05-27
申请号：US12055443
申请日：2008-03-26
申请人： Stephen H. Hall , Bryce D. Horine , Gary A. Brist , Howard Heck
发明人： Stephen H. Hall , Bryce D. Horine , Gary A. Brist , Howard Heck
CPC分类号： H05K1/024 , H05K1/0298 , H05K1/0366 , H05K2201/0187 , H05K2201/029 , H05K2201/09236 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，高速互连包括FR4材料层，FR4材料层中的沟槽和位于沟槽附近的一对传输线。 沟槽充满均质材料。 描述和要求保护其他实施例。
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公开(公告)号：US20090080832A1
公开(公告)日：2009-03-26
申请号：US12313320
申请日：2008-11-18
申请人： Bryce D. Horine , Gary A. Brist , Stephen H. Hall
发明人： Bryce D. Horine , Gary A. Brist , Stephen H. Hall
CPC分类号： H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981 , Y10T156/1002
摘要： In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。
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公开(公告)号：US20070154157A1
公开(公告)日：2007-07-05
申请号：US11322964
申请日：2005-12-30
申请人： Bryce D. Horine , Gary A. Brist , Stephen H. Hall
发明人： Bryce D. Horine , Gary A. Brist , Stephen H. Hall
IPC分类号： G02B6/10
CPC分类号： H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981 , Y10T156/1002
摘要： In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。
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公开(公告)号：US07800459B2
公开(公告)日：2010-09-21
申请号：US11647842
申请日：2006-12-29
CPC分类号： H01P3/00
摘要： In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，互连包括波导和与波导并联耦合的传输线。 描述和要求保护其他实施例。
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公开(公告)号：US20080157903A1
公开(公告)日：2008-07-03
申请号：US11647842
申请日：2006-12-29
IPC分类号： H01P5/00
CPC分类号： H01P3/00
摘要： In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，互连包括波导和与波导并联耦合的传输线。 描述和要求保护其他实施例。
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公开(公告)号：US07480435B2
公开(公告)日：2009-01-20
申请号：US11322601
申请日：2005-12-30
IPC分类号： G02B6/10
CPC分类号： H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981
摘要： In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成嵌入式波导的至少两个侧壁，并且将印刷电路板材料层压到电镀通道。 描述和要求保护其他实施例。
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8.发明申请METHOD OF MAKING A FIBER REINFORCED PRINTED CIRCUIT BOARD PANEL AND A FIBER REINFORCED PANEL MADE ACCORDING TO THE METHOD 有权制造纤维增强印刷电路板的方法和根据该方法制造的纤维增强板公开(公告)号：US20100328919A1
公开(公告)日：2010-12-30
申请号：US12882122
申请日：2010-09-14
申请人： William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
发明人： William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
CPC分类号： H05K1/0366 , H05K1/024 , H05K3/0052 , H05K2201/029 , H05K2201/09145 , H05K2201/09236 , Y10T29/49155 , Y10T29/49227 , Y10T156/1052 , Y10T428/249924 , Y10T428/249939 , Y10T428/24994
摘要： A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.
摘要翻译： 制造印刷电路板面板的方法，根据该方法制造的印刷电路板面板以及设置在面板上的印刷电路板的系统。 印刷电路板面板具有面板顶部边缘，平行于面板顶部边缘的面板底部边缘和两个平行面板侧边缘，并且还包括第一组纤维束，其相对于面板侧边缘以预定角度延伸 以及相对于面板顶部边缘以预定角度延伸的第二组纤维束。
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公开(公告)号：US07249955B2
公开(公告)日：2007-07-31
申请号：US11027128
申请日：2004-12-30
申请人： Bryce D. Horine , Gary A. Brist
发明人： Bryce D. Horine , Gary A. Brist
IPC分类号： H01R12/00
CPC分类号： H05K1/147 , H05K1/141 , H05K2201/094 , H05K2201/10734
摘要： In some embodiments an apparatus includes a board, a package coupled to the board, and a flex cable coupled to the package and extending between the board and the package. Other embodiments are described and claimed.
摘要翻译： 在一些实施例中，一种装置包括板，耦合到板的封装以及耦合到封装并在板和封装之间延伸的柔性电缆。 描述和要求保护其他实施例。
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10.发明授权Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method 有权根据该方法制造纤维增强印刷电路板面板和纤维增强面板的方法公开(公告)号：US08307548B2
公开(公告)日：2012-11-13
申请号：US12882122
申请日：2010-09-14
申请人： William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
发明人： William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
CPC分类号： H05K1/0366 , H05K1/024 , H05K3/0052 , H05K2201/029 , H05K2201/09145 , H05K2201/09236 , Y10T29/49155 , Y10T29/49227 , Y10T156/1052 , Y10T428/249924 , Y10T428/249939 , Y10T428/24994
摘要： A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.
摘要翻译： 制造印刷电路板面板的方法，根据该方法制造的印刷电路板面板以及设置在面板上的印刷电路板的系统。 印刷电路板面板具有面板顶部边缘，平行于面板顶部边缘的面板底部边缘和两个平行面板侧边缘，并且还包括第一组纤维束，其相对于面板侧边缘以预定角度延伸 以及相对于面板顶部边缘以预定角度延伸的第二组纤维束。
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