Composite formulation and composite article

    公开(公告)号:US10485149B2

    公开(公告)日:2019-11-19

    申请号:US15275100

    申请日:2016-09-23

    Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

    Conductive Composite Formulation and Article At Least Partially Formed From a Conductive Composite Formulation
    4.
    发明申请
    Conductive Composite Formulation and Article At Least Partially Formed From a Conductive Composite Formulation 审中-公开
    导电复合制剂和导体复合制剂最少部分形成

    公开(公告)号:US20160300636A1

    公开(公告)日:2016-10-13

    申请号:US14684270

    申请日:2015-04-10

    Abstract: A conductive composite formulation and an article at least partially formed from a conductive composite formulation are disclosed. The conductive composite formulation includes a polymer matrix and a colorant blended with the polymer matrix. The conductive composite formulation and the article each have a compound resistivity of between 0.0005 ohm·cm and 0.2 ohm·cm.

    Abstract translation: 公开了导电复合材料制剂和至少部分由导电复合材料制成的制品。 导电复合材料配方包括聚合物基质和与聚合物基体共混的着色剂。 导电复合配方和制品各自具有0.0005欧姆·厘米-2.2欧姆·厘米的复合电阻率。

    Process of Applying a Conductive Composite, Transfer Assembly Having a Conductive Composite, and a Garment with a Conductive Composite
    5.
    发明申请
    Process of Applying a Conductive Composite, Transfer Assembly Having a Conductive Composite, and a Garment with a Conductive Composite 审中-公开
    导电复合材料,导电复合材料的转移组件和导电复合材料的制造工艺

    公开(公告)号:US20160331044A1

    公开(公告)日:2016-11-17

    申请号:US14709169

    申请日:2015-05-11

    Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.

    Abstract translation: 公开了将导电复合材料应用于柔性材料,转移组件和包括导电复合材料的衣服的方法。 该方法包括相对于柔性材料定位导电复合材料,导电复合材料具有树脂基体和导电填料,并用铁加热导电复合材料,从而将导电复合材料直接施加到柔性材料上。 另外或替代地,所述方法包括相对于衣服定位导电复合材料,并且加热导电复合材料,由此将导电复合材料应用于衣服上。 服装包括柔性材料和直接位于柔性材料上的导电复合材料。 转印组件在转印衬底上具有导电复合材料。 转印衬底能够允许导电复合材料通过转印衬底进行加热,加热处于允许将导电复合材料应用于柔性材料的温度。

    Conductive Composite and Circuit Protection Device Including a Conductive Composite
    9.
    发明申请
    Conductive Composite and Circuit Protection Device Including a Conductive Composite 审中-公开
    导电复合材料和电路保护装置包括导电复合材料

    公开(公告)号:US20170004946A1

    公开(公告)日:2017-01-05

    申请号:US14788530

    申请日:2015-06-30

    CPC classification number: H01B1/22

    Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.

    Abstract translation: 公开了导电复合组合物和包括导电复合材料组合物的电路保护装置。 导电性复合组合物包括聚合物材料,多个导电颗粒和高熔点添加剂。 高熔点添加剂包含至少1%的导电复合材料,按总组合物的体积计。 电路保护装置包括主体部分,其包括导电复合材料组合物,所述导电复合材料组合物包含聚合物材料,多个导电颗粒和至少1体积%的装载在聚合物材料中的高熔点添加剂, 以及从主体部分延伸的引线,布置和布置的引线以将电路保护装置电耦合到电气系统。 还提供了形成导电复合材料的方法。

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