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    Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
    6.
    发明授权
    Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof 失效
    低介电损耗角正切树脂组合物，固化膜和固化产物，使用其的电气部件及其制造方法

    公开(公告)号：US06756441B2

    公开(公告)日：2004-06-29

    申请号：US09951414

    申请日：2001-09-14

    申请人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

    发明人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

    IPC分类号： C08L900

    CPC分类号： C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

    摘要： According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

    摘要翻译： 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2以上的整数，并且还含有至少一种选自具有 重均分子量为5000以上的填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度，低介电常数和介电损耗角正切的固化物。

    Low dielectric loss tangent films and wiring films
    7.
    发明授权
    Low dielectric loss tangent films and wiring films 失效
    低介电损耗角正切膜和布线膜

    公开(公告)号：US07112627B2

    公开(公告)日：2006-09-26

    申请号：US10385720

    申请日：2003-03-12

    申请人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

    发明人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

    IPC分类号： C08L9/00

    CPC分类号： H05K1/032 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T442/2861 ,  Y10T442/3854 ,  Y10T442/3862 ,  Y10T442/3886 ,  Y10T442/3902 ,  Y10T442/3911 ,  Y10T442/678

    摘要： A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R1, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).

    摘要翻译： 提供了使用包含具有优异介电特性的多官能苯乙烯化合物的低介电损耗角正切组合物的固化低介电损耗角正切薄膜和使用其的绝缘层的布线膜。 低介电损耗角正切膜含有高分子量材料和重均分子量为1000以下的具有多个苯乙烯基团的交联成分，所述苯乙烯基团由以下通式表示：（其中R表示烃骨架，R 1可以相同或不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3 O， 和R 4彼此可以相同或不同，各自表示氢原子或1〜6个碳原子的烷基，m表示1〜4的整数，n表示 2以上的整数）。