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20 条记录 (耗时 0.016 秒)

    Solid-state imaging device and method for manufacturing the same
    1.
    发明授权
    Solid-state imaging device and method for manufacturing the same 有权

    公开(公告)号：US08564033B2

    公开(公告)日：2013-10-22

    申请号：US12345876

    申请日：2008-12-30

    申请人： Toshihiko Hayashi ,  Yoshiharu Kudoh

    发明人： Toshihiko Hayashi ,  Yoshiharu Kudoh

    IPC分类号： H01L31/0216

    CPC分类号： H01L27/14636 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18

    摘要： A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating layer formed over the semiconductor substrate and metal interconnect layers formed as a plurality of layers in the insulating layer. The multilayer interconnect part has a first light-blocking film formed above an area between first metal interconnects of a first metal interconnect layer as one of the metal interconnect layers above the black-level reference pixel part, and a second light-blocking film that is connected to the first light-blocking film and is formed of a second metal interconnect layer over the first metal interconnect layer.

    Polyamideimide inner surface-coated metal container
    3.
    发明授权
    Polyamideimide inner surface-coated metal container 失效
    聚酰胺酰亚胺内表面涂层金属容器

    公开(公告)号：US5750223A

    公开(公告)日：1998-05-12

    申请号：US683205

    申请日：1996-07-18

    申请人： Akira Tada ,  Toshihiko Hayashi

    发明人： Akira Tada ,  Toshihiko Hayashi

    IPC分类号： B65D83/38 ,  B32B15/088 ,  B65D1/12 ,  B65D25/14 ,  C09D179/08 ,  B29D22/00

    CPC分类号： C09D179/08 ,  Y10T428/1355

    摘要： An inner surface-coated container and, particularly, an aerosol-container exhibiting intimate adhesiveness to a metallic base material of the container, inertness to the content and excellent resistance against the corrosion. A thermosetting polyamideimide coating material and, particularly, a composition of a carboxyl group-containing polyamideimide resin and a curing agent consisting chiefly of an epoxy resin, is applied to the inner surface of a metallic aerosol container, and the imide group/amide group absorbancy ratio R is set to be not smaller than 2.5.

    摘要翻译： 特别是内表面包覆的容器，特别是对容器的金属基材表现出亲密的粘合性的气溶胶容器，对内容物的惰性和优异的耐腐蚀性。 将热固性聚酰胺酰亚胺涂料，特别是含羧基的聚酰胺酰亚胺树脂和主要由环氧树脂组成的固化剂的组合物施加到金属气溶胶容器的内表面，酰亚胺基/酰胺基吸收 比率R设定为不小于2.5。

    Coolant reserve tank
    4.
    发明授权
    Coolant reserve tank 失效
    冷却液储备罐

    公开(公告)号：US4537159A

    公开(公告)日：1985-08-27

    申请号：US664020

    申请日：1984-10-23

    申请人： Yoshitomi Matsuzaki ,  Toshihiko Hayashi ,  Keizou Kushibiki

    发明人： Yoshitomi Matsuzaki ,  Toshihiko Hayashi ,  Keizou Kushibiki

    IPC分类号： F01P11/00 ,  F01P11/02 ,  B65D51/16

    CPC分类号： F01P11/029

    摘要： A coolant reserve tank comprises a disk-shaped splash-guard member horizontally disposed adjacent an inner end of a coolant reserve chamber vent and having in the upper surface thereof a plurality of grooves only through which the vent opens into the coolant reserve chamber, whereby the waves of the coolant in the chamber are mostly dashed against the lower surface of the splash-guard member and prevented from dashing into the vent to leak out therethrough.

    摘要翻译： 冷却剂备用箱包括与冷却剂储备室通气口的内端相邻的水平设置的盘形防溅件，并且在其上表面上具有多个槽，通气孔通过该多个凹槽通向冷却剂储备室，由此， 腔室中的冷却剂波浪大部分被击穿在防​​溅部件的下表面上，并防止其冲入通风口以从中泄漏出去。

    Method for manufacturing a semiconductor device and semiconductor device
    5.
    发明授权
    Method for manufacturing a semiconductor device and semiconductor device 有权
    半导体器件和半导体器件的制造方法

    公开(公告)号：US07612452B2

    公开(公告)日：2009-11-03

    申请号：US11850332

    申请日：2007-09-05

    申请人： Yoshiyuki Ohba ,  Toshihiko Hayashi

    发明人： Yoshiyuki Ohba ,  Toshihiko Hayashi

    IPC分类号： H01L23/52

    CPC分类号： H01L21/76831 ,  H01L21/76826 ,  H01L21/76835 ,  H01L21/76844 ,  H01L21/76864 ,  H01L21/76867 ,  H01L21/76873 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for manufacturing a semiconductor device includes: the first step of forming, in an insulating film provided on a substrate, a recess that is porositized at least at inner walls; the second step of forming an alloy layer made of copper and a metal other than copper so as to cover the inner walls of the recess; the third step of burying a conductive layer made primarily of copper in the recess provided with the alloy layer; the fourth step of subjecting the thus treated substrate to thermal treatment to cause the metal in the alloy layer to react with a constituent component of the insulating film to form a barrier film made of a metal compound having Cu diffusion barrier properties.

    摘要翻译： 一种制造半导体器件的方法包括：第一步骤，在设置在基板上的绝缘膜中形成至少在内壁形成孔的凹部; 形成由铜和铜以外的金属制成的合金层以覆盖凹部的内壁的第二步骤; 在设置有合金层的凹部中埋设主要由铜制成的导电层的第三步骤; 对经过处理的基板进行热处理以使合金层中的金属与绝缘膜的构成成分反应的第四步骤形成由具有Cu扩散阻挡性的金属化合物制成的阻挡膜。

    Multi-layer wiring structure, semiconductor apparatus having multi-layer wiring structure, and methods of manufacturing them
    6.
    发明申请
    Multi-layer wiring structure, semiconductor apparatus having multi-layer wiring structure, and methods of manufacturing them 审中-公开
    多层布线结构，具有多层布线结构的半导体装置及其制造方法

    公开(公告)号：US20060019485A1

    公开(公告)日：2006-01-26

    申请号：US11186657

    申请日：2005-07-19

    申请人： Naoki Komai ,  Toshihiko Hayashi

    发明人： Naoki Komai ,  Toshihiko Hayashi

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76835 ,  H01L21/76811 ,  H01L21/76813 ,  H01L21/76814 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76862

    摘要： A multi-layer wiring structure including an upper layer wiring (second buried wiring) connected to a buried wiring (first buried wiring) in lower layer wiring grooves (first wiring grooves) through connection conductors, wherein a protective film capable of enduring a cleaning treatment with hydrogen radicals or hydrogen plasma applied to the surface of the first buried wiring at the time of forming the connection conductors is formed on the inside surfaces of the wiring grooves to be filled with he second buried wiring and the wiring connection holes to be filled with the connection conductors which surfaces are liable to be eroded upon exposure to the atmosphere used in the cleaning treatment, whereby erosion of the insulation layers at the time of the cleaning is obviated, sufficient cleaning can be performed, and deterioration of characteristics can be improved.

    摘要翻译： 一种多层布线结构，包括通过连接导体连接到下层布线槽（第一布线槽）中的埋地布线（第一掩埋布线）的上层布线（第二掩埋布线），其中能够承受清洁处理的保护膜 在形成连接导体时，在第一埋地布线的表面上施加氢自由基或氢等离子体形成在布线槽的内表面上，并填充第二掩埋布线和要填充的布线连接孔 这些连接导体在暴露于清洁处理中使用的气氛时易于被侵蚀，从而消除了清洁时的绝缘层的腐蚀，可以进行充分的清洁，并且可以提高特性的劣化。

    Drain device of automotive radiator
    7.
    发明授权
    Drain device of automotive radiator 失效
    汽车散热器排水装置

    公开(公告)号：US4612977A

    公开(公告)日：1986-09-23

    申请号：US765820

    申请日：1985-08-15

    申请人： Toshihiko Hayashi ,  Yoshitomi Matsuzaki

    发明人： Toshihiko Hayashi ,  Yoshitomi Matsuzaki

    IPC分类号： B60K11/04 ,  F01P11/02 ,  F28F9/00 ,  F28F9/02 ,  F16K5/00

    CPC分类号： B60K11/04 ,  F28F2265/06

    摘要： A collar member disposed about a drain bore in the radiator. A drain cock is received within the collar member and has a portion which enters the drain hose is fixed to a drain bore of the radiator and seals the drain bore when tightened. An axial groove in the drain cock places the interior of the radiator in communication with a chamber within the collar when the drain cock is loosened, so that fluid may be drained from the radiator through the chamber and the drain hose. A hose holder is connected to a fan shroud to hold a portion of the drain hose in place.

    摘要翻译： 围绕散热器中的排水孔设置的轴环构件。 排水旋塞容纳在轴环构件内并且具有进入排水软管的部分固定到散热器的排水孔并在拧紧时密封排水孔。 当排放旋塞松开时，排水旋塞中的轴向凹槽使散热器的内部与轴环内的腔连通，使得流体可以通过腔室和排水软管从散热器排出。 软管支架连接到风扇罩以将排水软管的一部分固定到位。

    Easily-openable heat seal lid
    8.
    发明授权
    Easily-openable heat seal lid 失效
    易于开启的热封盖

    公开(公告)号：US4428494A

    公开(公告)日：1984-01-31

    申请号：US434726

    申请日：1982-10-18

    申请人： Kazumi Hirota ,  Yotaro Tsutsumi ,  Senji Itoh ,  Tadahiko Katsura ,  Kikuo Matsuoka ,  Ichiro Hori ,  Toshihiko Hayashi

    发明人： Kazumi Hirota ,  Yotaro Tsutsumi ,  Senji Itoh ,  Tadahiko Katsura ,  Kikuo Matsuoka ,  Ichiro Hori ,  Toshihiko Hayashi

    IPC分类号： B65D17/28 ,  B65D20060101 ,  B65D17/34 ,  B65D17/347 ,  B65D17/353 ,  B65D17/40 ,  B65D17/42 ,  B65D17/50 ,  B65D65/32 ,  B65D77/30 ,  B65D85/72

    CPC分类号： B65D17/163

    摘要： Disclosed is an easily openable heat seal lid for sealing a vessel proper by forming a heat-sealed portion between the lid and the vessel proper, which comprises a laminate comprising at least an inner face member composed of a thermoplastic resin and a metal foil, wherein scores defining a portion to be opened are formed on the side inner than the portion to be heat-sealed so that the scores extend to the midway of the thickness direction of the metal foil, an opening tab is formed on the portion of the lid to be opened through a bonding fulcrum portion composed of a thermoplastic resin hot adhesive so that the push-tearing top end of the opening tab is located on the scores, and the peel strength between the opening tab and the lid in said bonding portion is at least 0.4 Kg/5 mm.

    摘要翻译： 公开了一种用于通过在盖和容器本体之间形成热密封部分来适当地密封容器的容易打开的热封盖，其包括至少包括由热塑性树脂和金属箔构成的内表面构件的层压体，其中 在被热封部分的一侧形成有要打开的部分的分数，使得分数延伸到金属箔的厚度方向的中间，在盖的部分上形成开口凸片， 通过由热塑性树脂热粘合剂构成的接合支点部分打开，使得开口舌片的推拉顶端位于刻痕上，并且所述接合部分中的开口接片和盖子之间的剥离强度至少为 0.4公斤/ 5毫米。