公开(公告)号：US20080258293A1

公开(公告)日：2008-10-23

申请号：US11736461

申请日：2007-04-17

申请人： Wen-Kun YANG ,  Diann-Fang LIN

发明人： Wen-Kun YANG ,  Diann-Fang LIN

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L23/552 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

摘要： The present invention provides a package structure and a method for forming the same. The structure comprises a substrate with contact pads and through holes filled with conducting metals for performing heat dissipation and ground shielding A chip with bonding pads is attached on the contact pad by an adhesive with high thermal conductivity to achieve heat dissipation. A RDL is formed on the substrate and the chip to couple the bonding pad and the contact pad formed on the substrate. The structure of present invention can improve the thickness thereof, and the heat dissipation and ground shielding of the structure are enhanced. Furthermore, the structure can achieve package on package (PoP) structure.

摘要翻译： 本发明提供一种封装结构及其形成方法。 该结构包括具有接触焊盘的基板和填充有用于进行散热和接地屏蔽的导电金属的通孔。具有接合焊盘的芯片通过具有高导热性的粘合剂附接在接触焊盘上以实现散热。 在衬底和芯片上形成RDL以耦合形成在衬底上的接合焊盘和接触焊盘。 本发明的结构可以提高其结构的厚度，提高结构的散热和接地屏蔽。 此外，该结构可以实现封装封装（PoP）结构。

公开(公告)号：US20130062783A1

公开(公告)日：2013-03-14

申请号：US13606147

申请日：2012-09-07

申请人： Diann-Fang LIN

发明人： Diann-Fang LIN

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip packaging structure and a manufacturing method for the same are provided. The chip packaging structure includes a first chip, a second chip and a transfer component. The first chip has a plurality of first bonding pads formed on the top surface of the first chip. The second chip has a plurality of second bonding pads formed on the top surface of the second chip. The first chip and the second chip are arranged abreast and electrically connected to each other. The transfer component is disposed on the top surface of the first chip and electrically connected with the first chip. Via these arrangements, the chip packaging structure can have smaller dimensions.

摘要翻译： 提供了一种芯片封装结构及其制造方法。 芯片封装结构包括第一芯片，第二芯片和转移部件。 第一芯片具有形成在第一芯片的顶表面上的多个第一焊盘。 第二芯片具有形成在第二芯片的顶表面上的多个第二焊盘。 第一芯片和第二芯片彼此并排布置并电连接。 转印组分设置在第一芯片的顶表面上并与第一芯片电连接。 通过这些布置，芯片封装结构可以具有更小的尺寸。