Resonant pressure sensor with improved linearity

    公开(公告)号:US11815420B2

    公开(公告)日:2023-11-14

    申请号:US18160632

    申请日:2023-01-27

    CPC classification number: G01L9/0072

    Abstract: A resonant pressure sensor with improved linearity includes: a substrate including a substrate-separated portion separated from a housing-fixed portion; a first resonator that: is disposed in the substrate-separated portion; and detects a change of a first resonance frequency based on a strain in the substrate caused by static pressure applied by a pressure-receiving fluid; a second resonator that: is disposed in the substrate; detects a change of a second resonance frequency based on the strain in the substrate; and has a pressure sensitivity of the second resonance frequency; and a processor that: measures the static pressure based on the detected change of the first resonance frequency; and corrects the static pressure according to internal temperature of the pressure sensor based on a difference between the second resonance frequency and the first resonance frequency.

    RESONANT PRESSURE SENSOR
    2.
    发明申请

    公开(公告)号:US20210215560A1

    公开(公告)日:2021-07-15

    申请号:US17143517

    申请日:2021-01-07

    Abstract: An resonant pressure sensor, includes: a housing; a housing-fixed portion that is fixed to the housing; a substrate that includes a substrate-fixed portion that is fixed to the housing-fixed portion and a substrate-separated portion that is separated from the housing-fixed portion and extends from the substrate-fixed portion; a first resonator that is disposed in the substrate-separated portion and that detects a change of a resonance frequency based on a strain in the substrate caused by static pressure applied by the pressure-receiving fluid; and a processor. A pressure-receiving fluid is interposed in a gap between the housing-fixed portion and the substrate and envelops the substrate. The processor measures the static pressure based on the detected change of the resonance frequency.

    BUILDING INTEGRITY ASSESSMENT SYSTEM
    3.
    发明申请

    公开(公告)号:US20200284930A1

    公开(公告)日:2020-09-10

    申请号:US16806411

    申请日:2020-03-02

    Abstract: A building integrity assessment system includes: an earthquake detector including: a building bottom sensor at a bottom of a building and that detects acceleration and an earthquake early-warning receiver that receives an earthquake early warning; a cloud computer; and sensors disposed at a plurality of positions in the building and that measures an influence of an earthquake on the building at each of the positions and wirelessly transmits measurement results to the cloud computer. The cloud computer estimates and evaluates the integrity of the building based on the measurement results. In response to the building bottom sensor detecting preliminary tremors or the earthquake early-warning receiver receiving the earthquake early warning, the plurality of sensors measures the influence of the earthquake on the building from a time before a major motion arrives at the building to a time after the arrival.

    Resonant sensor
    6.
    发明授权

    公开(公告)号:US09952250B2

    公开(公告)日:2018-04-24

    申请号:US14829801

    申请日:2015-08-19

    CPC classification number: G01P15/097 G01P2015/0828

    Abstract: A resonant sensor includes a mover that is movable in a first direction, a supporter that extends in a second direction perpendicular to the first direction, the supporter being connected to the mover and a fixer, the supporter supporting the mover which is movable in the first direction, and a resonator that is vibratable, at least a part of the resonator being embedded in the supporter.

    RESONANT PRESSURE SENSOR WITH IMPROVED LINEARITY

    公开(公告)号:US20230175908A1

    公开(公告)日:2023-06-08

    申请号:US18160632

    申请日:2023-01-27

    CPC classification number: G01L9/0072

    Abstract: A resonant pressure sensor with improved linearity includes: a substrate including a substrate-separated portion separated from a housing-fixed portion; a first resonator that: is disposed in the substrate-separated portion; and detects a change of a first resonance frequency based on a strain in the substrate caused by static pressure applied by a pressure-receiving fluid; a second resonator that: is disposed in the substrate; detects a change of a second resonance frequency based on the strain in the substrate; and has a pressure sensitivity of the second resonance frequency; and a processor that: measures the static pressure based on the detected change of the first resonance frequency; and corrects the static pressure according to internal temperature of the pressure sensor based on a difference between the second resonance frequency and the first resonance frequency.

    Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer
    10.
    发明授权
    Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer 有权
    谐振换能器,其制造方法和谐振换能器的多层结构

    公开(公告)号:US09139419B2

    公开(公告)日:2015-09-22

    申请号:US14336613

    申请日:2014-07-21

    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole, a second layer disposed over the first layer, a third layer covering the first layer and the second layer, and a projection extending from the second layer toward the resonator, the projection being spatially separated from the resonator, the projection being separated from the first layer by a first gap, the second layer being separated from the first layer by a second gap, the first gap is communicated with the second gap.

    Abstract translation: 谐振换能器包括硅单晶衬底,设置在硅单晶衬底上的硅单晶谐振器,由硅构成的外壳,围绕谐振器间隙,并与硅单晶衬底一起形成腔室,令人兴奋的 模块,其被配置为激励所述谐振器;振动检测模块,被配置为检测所述谐振器的振动,设置在所述腔室上的第一层,所述第一层具有通孔,设置在所述第一层上的第二层, 第一层和第二层,以及从第二层朝向谐振器延伸的突起,突起与谐振器在空间上分离,突起与第一层隔开第一间隙,第二层与第一层分离 通过第二间隙,第一间隙与第二间隙连通。

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