Method of manufacturing semiconductor device and semiconductor device
    8.
    发明授权
    Method of manufacturing semiconductor device and semiconductor device 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US08013344B2

    公开(公告)日:2011-09-06

    申请号:US12186168

    申请日:2008-08-05

    IPC分类号: H01L27/15

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。

    SEMICONDUCTOR LASER DEVICE
    9.
    发明申请
    SEMICONDUCTOR LASER DEVICE 审中-公开
    半导体激光器件

    公开(公告)号:US20090028204A1

    公开(公告)日:2009-01-29

    申请号:US12179254

    申请日:2008-07-24

    IPC分类号: H01S5/026

    摘要: A semiconductor laser device includes a substrate made of a nitride-based semiconductor and a waveguide formed on a principal surface of the substrate, wherein the substrate includes a dislocation concentrated region arranged so as to obliquely extend with respect to the principal surface of the substrate, and the waveguide is so formed as to be located above the dislocation concentrated region and also located on a region except a portion where the dislocation concentrated region is present in the principal surface of the substrate.

    摘要翻译: 半导体激光器件包括由氮化物基半导体制成的衬底和形成在衬底的主表面上的波导,其中衬底包括布置成相对于衬底的主表面倾斜延伸的位错集中区域, 并且波导被形成为位于位错集中区域之上并且还位于除了位错集中区域存在于基板的主表面中的部分之外的区域上。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20110210365A1

    公开(公告)日:2011-09-01

    申请号:US13105386

    申请日:2011-05-11

    IPC分类号: H01L33/58

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。