Method of manufacturing semiconductor device and semiconductor device
    7.
    发明授权
    Method of manufacturing semiconductor device and semiconductor device 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US08013344B2

    公开(公告)日:2011-09-06

    申请号:US12186168

    申请日:2008-08-05

    IPC分类号: H01L27/15

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。

    Method of manufacturing semiconductor device and semiconductor device
    9.
    发明授权
    Method of manufacturing semiconductor device and semiconductor device 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US08445303B2

    公开(公告)日:2013-05-21

    申请号:US13366589

    申请日:2012-02-06

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20120142167A1

    公开(公告)日:2012-06-07

    申请号:US13366589

    申请日:2012-02-06

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。