摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A tonneau cover device moves a tonneau cover, which is coupled to a hatchback door of a vehicle, between an extension position and a storage position. The tonneau cover device includes a detection unit and a controller. The detection unit detects whether a pre-operation for opening the hatchback door has been performed. The controller permits movement of the tonneau cover to the extension position when a courtesy switch, which is arranged in the vehicle, detects that the hatchback door is closed and the detection unit does not detect that the pre-operation has been performed. The controller restricts movement of the tonneau cover to the extension position when the courtesy switch detects that the hatchback door is closed and the detection unit detects that the pre-operation has been performed.
摘要:
A tonneau cover device includes a tonneau cover attached to a hatchback door. A movable guide is arranged on the tonneau cover and is guided by a fixed guide, which is arranged in a vehicle. The tonneau cover moves to an extension position when the hatchback door closes and a storage position when the hatchback door opens. A detector detects whether movement of the tonneau cover is obstructed due to contact with an object. A controller moves the tonneau cover to where the movable guide can come into contact with the fixed guide in a state in which the hatchback door is open when the detector detects that the movement of the tonneau cover to the storage position has been obstructed.
摘要:
The communication signal generating device is for use in a communication system where communication signals each of which is set at a first level or a second level are exchanged among a plurality of communication apparatuses through a communication line. The communication signal generating device includes a switching element provided in a communication line to connect the communication line to a ground or a constant voltage source, and a driving means to generate a first communication signal at the first level by turning on the switching element to thereby pass a certain current to the communication line, and generate a second communication signal at the second level by turning off the switching element to thereby pass no current to the communication line. The driving means is configured to gradually increase an output impedance of the switching element during one bit time of the first communication signal.
摘要:
A capacitive occupant detection apparatus comprising a sensor unit and a control unit is disclosed. The sensor unit includes a detection electrode and a periphery guard electrode. The control unit includes: a signal application circuit for applying an oscillation signal to the detection electrode; an operational amplifier for applying to the guard electrode a signal having the same phase and potential as the oscillation signal applied to the detection electrode; and a control circuit for receiving current and voltage values supplied to the detection and for determining a mounting state on a seat based on the inputted current and voltage values (including phase information). The periphery guard electrode is located to surround the detection electrode when viewed from an upper side of the detection electrode.
摘要:
A sliding member includes: a substrate which has a sliding surface sliding under the presence of lubricating oil; and a film which is fixed to at least a part of the sliding surface. The film contains carbon (C), titanium (Ti), and boron (B), is obtained by repeatedly and alternately layering a first layer containing amorphous carbon as a principal component and a second layer containing C and Ti as principal components, and has hardness of 18 GPa or more.
摘要:
A tonneau cover device includes a tonneau cover attached to a hatchback door. A movable guide is arranged on the tonneau cover and is guided by a fixed guide, which is arranged in a vehicle. The tonneau cover moves to an extension position when the hatchback door closes and a storage position when the hatchback door opens. A detector detects whether movement of the tonneau cover is obstructed due to contact with an object. A controller moves the tonneau cover to where the movable guide can come into contact with the fixed guide in a state in which the hatchback door is open when the detector detects that the movement of the tonneau cover to the storage position has been obstructed.
摘要:
This invention facilitates monitoring operation for checking whether or not quality of a substrate deteriorates as well as operation for identifying a cause of deterioration in quality. Identification information of constituent elements related to measurement target sections (pads) on a component-mounted substrate is arranged into hierarchal structure data. A first axis is arranged with the measurement target sections associated with this arrangement. A second axis is arranged with information (identification information of lots and squeegees) representing production conditions of the substrates according to an order of the substrates being processed. A two-dimensional area defined by the first axis and the second axis is set. A color map is generated, in which measured data of the measurement target sections on the substrates are arranged in colors at corresponding positions within the two-dimensional area. Specifically, in the respective measured data, values in a preferable range is displayed in white, values larger than the preferable range is displayed in red-like color, and values smaller than the preferable range is displayed in blue-like color.