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公开(公告)号：US20090047755A1
公开(公告)日：2009-02-19
申请号：US12250420
申请日：2008-10-13
申请人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
发明人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
CPC分类号： H01L21/6835 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2224/11003 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H01L2924/30105 , H05K1/0216 , H05K3/4015 , H05K3/4602 , H05K2201/0367 , H05K2201/0792 , H05K2201/09481 , H05K2201/096 , H05K2201/09909 , H05K2201/09981 , H05K2203/0113 , H05K2203/0235 , H05K2203/0338 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要翻译： 提供了具有优异的高频特性并且可以获得用于内部布线图案的大面积的半导体封装。 根据本发明，半导体封装包括：安装在多层布线板12的正面上的多层印刷布线板12和IC芯片以及安装在反面上的多个凸点端子16。 每个凸块端子16包括具有平坦面40的绝缘芯42和沉积在除了平面40之外的所有外表面上的导电涂层。导电涂层44的端面看起来像围绕绝缘芯42的环，并且是 焊接到形成在多层印刷电路板12的背面上的环形连接焊盘52.通孔36布置在凸块端子16的正上方，并且直径小于凸块端子16的直径的间隙孔34， 形成在内部布线图案28和30中以允许通孔36通过。
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公开(公告)号：US07484293B2
公开(公告)日：2009-02-03
申请号：US11567804
申请日：2006-12-07
申请人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
发明人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
IPC分类号： H05K3/34
CPC分类号： H01L21/6835 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2224/11003 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H01L2924/30105 , H05K1/0216 , H05K3/4015 , H05K3/4602 , H05K2201/0367 , H05K2201/0792 , H05K2201/09481 , H05K2201/096 , H05K2201/09909 , H05K2201/09981 , H05K2203/0113 , H05K2203/0235 , H05K2203/0338 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要翻译： 提供了具有优异的高频特性并且可以获得用于内部布线图案的大面积的半导体封装。 根据本发明，半导体封装包括：安装在多层布线板12的正面上的多层印刷布线板12和IC芯片以及安装在反面上的多个凸点端子16。 每个凸块端子16包括具有平坦面40的绝缘芯42和沉积在除了平面40之外的所有外表面上的导电涂层。导电涂层44的端面看起来像围绕绝缘芯42的环，并且是 焊接到形成在多层印刷电路板12的背面上的环形连接焊盘52.通孔36布置在凸块端子16的正上方，并且直径小于凸块端子16的直径的间隙孔34， 形成在内部布线图案28和30中以允许通孔36通过。
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公开(公告)号：US20070145551A1
公开(公告)日：2007-06-28
申请号：US11567804
申请日：2006-12-07
申请人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
发明人： Yoshiyuki Yamaji , Hirokazu Noma , Hiroyuki Mori
IPC分类号： H01L23/02
CPC分类号： H01L21/6835 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2224/11003 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H01L2924/30105 , H05K1/0216 , H05K3/4015 , H05K3/4602 , H05K2201/0367 , H05K2201/0792 , H05K2201/09481 , H05K2201/096 , H05K2201/09909 , H05K2201/09981 , H05K2203/0113 , H05K2203/0235 , H05K2203/0338 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要翻译： 提供了具有优异的高频特性并且可以获得用于内部布线图案的大面积的半导体封装。 根据本发明，半导体封装包括：安装在多层布线板12的正面上的多层印刷布线板12和IC芯片以及安装在反面上的多个凸点端子16。 每个凸块端子16包括具有平坦面40的绝缘芯42和沉积在除了平面40之外的所有外表面上的导电涂层。 导电涂层44的端面看起来像围绕绝缘芯42的环，并且被焊接到形成在多层印刷线路板12的背面上的环形连接焊盘52。 通孔36布置在凸块端子16的正上方，并且其直径小于凸点端子16的直径的间隙孔34形成在内部布线图形28和30中以允许通孔36通过。
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公开(公告)号：US5614986A
公开(公告)日：1997-03-25
申请号：US419396
申请日：1995-04-10
申请人： Tohru Yoshikawa , Yoshiyuki Yamaji
发明人： Tohru Yoshikawa , Yoshiyuki Yamaji
CPC分类号： G03B27/6285
摘要： A photographic printing apparatus can process any of a roll of films, a strip of film and a film in a cartridge. A feed speed adjusting unit is provided between a scanner unit and a printing/exposure unit. A cartridge supply unit is provided upstream of the scanner unit and upstream of the printing/exposure unit. A strip of film is fed by a film carrier and a cartridge film is fed by a feed roller of a cartridge holder.
摘要翻译： 照相印刷设备可以处理一卷胶片，一条胶片和胶片盒中的任何一个。 进给速度调节单元设置在扫描仪单元和打印/曝光单元之间。 墨盒供应单元设置在扫描仪单元的上游和打印/曝光单元的上游。 一片薄膜通过胶片载体进料，并通过盒式保持器的进给辊进给暗盒胶片。
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公开(公告)号：US5612765A
公开(公告)日：1997-03-18
申请号：US417121
申请日：1995-04-05
申请人： Tohru Yoshikawa , Yoshiyuki Yamaji
发明人： Tohru Yoshikawa , Yoshiyuki Yamaji
CPC分类号： G03B27/6285
摘要： A carrier device can receive cartridges each containing a film from a lateral direction and send them reliably, efficiently and continuously to a photoprinting machine in a straight line, while holding them in position with an arm. Cartridges are supplied one by one into the carrier device from a cartridge housing device located at the side of the carrier device. A cartridge set in a carriage or the carrier device is retained in position by the arms and transferred to the printing machine by driving the carriage with a motor of a driving unit along a guide path. The carriage has a cartridge retaining mechanism and an arm locking mechanism.
摘要翻译： 载体装置可以从横向接收每个含有胶片的盒，并且将它们以手臂保持在适当位置时将它们可靠地，有效地和连续地以直线发送到照相印刷机。 一个一个的墨盒从位于载体装置一侧的墨盒容纳装置一个一个地供应到载体装置中。 设置在托架或托架装置中的卡盘通过臂保持在适当的位置，并通过驱动单元的马达沿着引导路径驱动托架而传送到打印机。 托架具有盒保持机构和臂锁定机构。
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6.发明授权
公开(公告)号：US6074108A
公开(公告)日：2000-06-13
申请号：US829261
申请日：1997-03-31
CPC分类号： G03D15/00 , G03B17/30 , G03B27/6285
摘要： A method of cleaning a film transport unit (5), in which a cleaning leader (80) formed of a synthetic fiber (81) hardened with a resin (82) is transported through a transport path of the film transport unit, and the cleaning leader (80) removes substances adhering to a magnetic head (32a) disposed in the transport path, with said cleaning leader. Preferably, the synthetic fiber is hardened by being impregnated with a resin (82) selected from urethane resin, acrylic resin and silicone resin. Preferably, the cleaning leader (80) is elongated to be an identical or similar shape to a film (2) transported through the film transport unit (5). At least a leading end of the cleaning leader is hardened.
摘要翻译： 一种清洁胶片输送单元（5）的方法，其中由用树脂（82）硬化的合成纤维（81）形成的清洁引导件（80）通过胶片传送单元的传送路径传送，并且清洁 引导器（80）与所述清洁引导件一起去除附着在设置在传送路径中的磁头（32a）的物质。 优选地，通过用选自聚氨酯树脂，丙烯酸树脂和有机硅树脂的树脂（82）浸渍合成纤维来硬化。 优选地，清洁引导件（80）伸长成与通过胶片传送单元（5）传送的胶片（2）相同或相似的形状。 清洁头部的至少前端被硬化。
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公开(公告)号：US5825462A
公开(公告)日：1998-10-20
申请号：US569790
申请日：1995-12-08
CPC分类号： G03D13/003 , G03B27/6285
摘要： A film cartridge storage apparatus for storing a plurality of film cartridges 20 stacked one on another. The stored film cartridges 20 are extracted from the apparatus one after another from the lowermost cartridge in association with a pivotal member 83 of an individual feed mechanism 80; 18; 280 having a first arm portion 83a and a second arm portion 83b. The first arm portion 83a of the pivotal member 83 pivots between a first area and a second area to hold the lowermost film cartridge in the first area and also to feed the lowermost film cartridge in the second area. The second arm portion 83b of the pivotal member allows a film cartridge to fall toward the first arm portion in the first area and also prevents a film cartridge from falling toward the first arm portion in the second area. An elastic escape means 90; 190; 290 is provided for avoiding mutual interference between a film cartridge contacting the second arm portion and a pivotal locus of the second arm portion in the course of the pivotal movement of the second arm portion from the first area to the second area.
摘要翻译： 一种用于存储多个彼此堆叠的胶片暗盒20的暗盒存储装置。 存储的暗盒20从与单个进给机构80的枢转构件83相关联的最下面的盒中一个接一个地从装置中取出; 18; 280具有第一臂部83a和第二臂部83b。 枢转构件83的第一臂部83a在第一区域和第二区域之间枢转，以将最下面的暗盒保持在第一区域中，并且还将最下面的暗盒送入第二区域。 枢转构件的第二臂部分83b允许暗盒在第一区域中朝向第一臂部分落下，并且还防止暗盒在第二区域中朝向第一臂部落下。 弹性逃逸装置90; 190; 290被设置用于在第二臂部分从第一区域到第二区域的枢转运动的过程中避免与第二臂部分接触的胶片暗盒与第二臂部分的枢转轨迹之间的相互干涉。
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8.发明申请Semiconductor Module, Terminal Strip, Method for Manufacturing Terminal Strip, and Method for Manufacturing Semiconductor Module 审中-公开半导体模块，端子排，端子排制造方法及制造半导体模块的方法公开(公告)号：US20100213592A1
公开(公告)日：2010-08-26
申请号：US12707776
申请日：2010-02-18
申请人： Masatoshi Ishii , Yoshiyuki Yamaji
发明人： Masatoshi Ishii , Yoshiyuki Yamaji
IPC分类号： H01L23/52 , H01L23/48 , H01L21/768 , H01L21/77
CPC分类号： H01L23/49833 , H01L23/49827 , H01L23/50 , H01L25/105 , H01L2224/16225 , H01L2225/1023 , H01L2225/107 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107
摘要： To provide a semiconductor module, a terminal strip, a method for manufacturing the terminal strip, and a method for manufacturing the semiconductor module in which loop inductance is decreased.A terminal strip includes a grounding (GND) conductor, power supply (VDD) conductors, signal line conductors, and insulators. The insulators intervene between the GND conductor and the VDD conductors. Similarly, the insulators intervene between the GND conductor and the signal line conductors. In the terminal strip, since the GND conductor and the VDD conductors are disposed close to each other, mutual inductance between GND wiring and VDD wiring can be increased. Thus, loop inductance can be decreased.
摘要翻译： 提供半导体模块，端子排，端子排的制造方法以及制造环路电感降低的半导体模块的方法。 端子排包括接地（GND）导体，电源（VDD）导体，信号线导体和绝缘体。 绝缘体介于GND导体和VDD导体之间。 类似地，绝缘体介于GND导体和信号线导体之间。 在端子排中，由于GND导体和VDD导体彼此靠近配置，因此可以增加GND布线和VDD布线之间的互感。 因此，可以减小环路电感。
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公开(公告)号：US6097573A
公开(公告)日：2000-08-01
申请号：US105250
申请日：1998-06-26
申请人： Toru Yoshikawa , Yoshiyuki Yamaji
发明人： Toru Yoshikawa , Yoshiyuki Yamaji
CPC分类号： G11B15/62 , G03B17/24 , G03B2217/244
摘要： A magnetic information recorder/reproducer can reduce the possibility of breakage of parts and thus lessen the need for maintenance. A resilient member for pressing a magnetic medium against a magnetic head has a resilient, hard guide layer provided on one side thereof facing the magnetic medium. The guide layer prevents the magnetic medium from coming into contact with the resilient member. The resilient member is thus less like to be broken or worn because it does not contact the magnetic medium.
摘要翻译： 磁信息记录器/再现器可以减少部件损坏的可能性，从而减少对维护的需要。 用于将磁介质压在磁头上的弹性构件具有设置在面向磁介质的一侧上的弹性的硬引导层。 引导层防止磁性介质与弹性构件接触。 因此，弹性构件因为不接触磁性介质而更不像破损或磨损。
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公开(公告)号：US6056451A
公开(公告)日：2000-05-02
申请号：US598505
申请日：1996-02-08
申请人： Kohji Seki , Yoshiyuki Yamaji
发明人： Kohji Seki , Yoshiyuki Yamaji
CPC分类号： G03D15/046
摘要： A photographic film processing apparatus for processing long developed film (10b) formed by joining photographic films with a splicing material (13). The apparatus includes a first transport device (40a) for transporting the long developed film. A region of the splicing material in the long developed film is detected in order to cut the long film. A main cutter (60) cuts the long developed film transported by the first transport device, in the region of the splicing material into short films (10a) prior to an exposing process. A second transport device (40b) is provided for transporting the short films to exposure processing units (20, 30). Further, an auxiliary cutter (70) is provided for cutting lateral portions of the region of the splicing material in the long developed film. The region of the splicing material is cut such that a width of an upstream short film is contained within a width at a forward end of a downstream short film.
摘要翻译： 一种用于处理通过将照相胶片与拼接材料（13）接合形成的长显影膜（10b）的照相胶片处理设备。 该装置包括用于输送长显影膜的第一输送装置（40a）。 检测长显影膜中的接合材料的区域以切割长膜。 主切割器（60）在曝光过程之前将在拼接材料区域中由第一传送装置传送的长显影膜切割成短片（10a）。 第二传送装置（40b）用于将短片传送到曝光处理单元（20,30）。 此外，设置辅助切割器（70），用于切割长显影膜中的拼接材料的区域的侧向部分。 剪接材料的区域被切割成使得上游短片的宽度包含在下游短片的前端的宽度内。
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