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公开(公告)号：US08710662B2
公开(公告)日：2014-04-29
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
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公开(公告)号：US20120248495A1
公开(公告)日：2012-10-04
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
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