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公开(公告)号：US08710662B2
公开(公告)日：2014-04-29
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
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公开(公告)号：US20120248495A1
公开(公告)日：2012-10-04
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
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公开(公告)号：US09922951B1
公开(公告)日：2018-03-20
申请号：US15350019
申请日：2016-11-12
CPC分类号： H01L24/29 , H01L21/486 , H01L21/563 , H01L23/49894 , H01L24/06 , H01L24/24 , H01L24/27 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/12105 , H01L2224/27464 , H01L2224/29147 , H01L2224/29553 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83657 , H01L2224/83678 , H01L2224/92144
摘要： A catalytic laminate is formed from a resin, a fiber reinforced layer, and catalytic particles such that the catalytic particles are disposed throughout the catalytic laminate but excluded from the outer surface of the catalytic laminate. The catalytic laminate has trace channels and vias formed to make a single or multi-layer catalytic laminate printed circuit board. Apertures with locations which match the locations of integrated circuit pads are formed in the laminate PCB. The integrated circuit is bonded to the catalytic laminate PCB, and the integrated circuit and laminate are both subjected to electroless plating, thereby electrically connecting the integrated circuit to the single or multi-layer catalytic laminate PCB.
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公开(公告)号：US20160190085A1
公开(公告)日：2016-06-30
申请号：US14959468
申请日：2015-12-04
发明人： Akira KATO
CPC分类号： H01L24/32 , H01L21/4821 , H01L23/3107 , H01L23/3142 , H01L23/49513 , H01L23/49517 , H01L23/49537 , H01L23/49575 , H01L23/49582 , H01L24/29 , H01L24/83 , H01L2224/26175 , H01L2224/29083 , H01L2224/291 , H01L2224/29111 , H01L2224/29116 , H01L2224/29147 , H01L2224/32245 , H01L2224/83444 , H01L2224/83447 , H01L2224/83544 , H01L2224/83655 , H01L2224/8392 , H01L2224/83948 , H01L2224/83951 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/0102
摘要： A manufacturing method of a semiconductor module, includes: forming a Ni plating layer on a surface of a first lead frame; forming a Au plating layer on a surface of the Ni plating layer; manufacturing an intermediate body that a semiconductor element is soldered to the first lead frame; forming a primer layer by applying a primer to a surface of the intermediate body and then drying the primer; molding a sealing resin body on a surface of the primer layer; and performing heat treatment so that Ni included in the Ni plating layer is dispersed in the Au plating layer.
摘要翻译： 一种半导体模块的制造方法，包括：在第一引线框架的表面上形成Ni镀层; 在所述Ni镀层的表面上形成Au镀层; 制造半导体元件被焊接到第一引线框架的中间体; 通过将底漆施用到中间体的表面，然后干燥底漆来形成底漆层; 在底漆层的表面上成型密封树脂体; 并且进行热处理，使得Ni镀层中包含的Ni分散在Au镀层中。
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公开(公告)号：US08217403B1
公开(公告)日：2012-07-10
申请号：US13179073
申请日：2011-07-08
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L27/15
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.
摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和绝缘层。 金属化层具有高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分被扩散接合在一起。 绝缘层与金属化层同时形成以覆盖金属化层的外表面。 电子部件电连接到金属化层。
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