Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
In one embodiment, an image sensor includes a pixel array including a plurality of pixels, an analog-to-digital converter configured to convert analog pixel signals output from the pixels into digital signals, a first cluster configured to store a first group of digital signals among the digital signals and to output first image data, a second cluster configured to store a second group of digital signals among the digital signals and to output second image data, and at least one cluster switch connected to the first cluster and the second cluster, a first channel, and a second channel. The image sensor is configured to transmit at least one among the first image data and the second image data to at least one among the first channel and the second channel based on an operation mode.
Abstract:
A solid-state image pickup device 1A includes an image pickup section 2 having a pixel array P in which a pixel C is two-dimensionally arranged, a lens section 3 having a plurality of lenses 3a arranged on the pixel array P, and an image generating section 4A for generating an image by using an electrical signal SE. The image pickup section 2 has a plurality of the pixel arrays P including one image pickup region T. The image generating section 4A generates the image by averaging the electrical signals SE for each pixel C corresponding to one another among the image pickup regions T, in order to reduce noise present in the electrical signal SE.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
An imaging apparatus includes a prism for separating a first luminous flux into a plurality of second luminous fluxes, a plurality of imaging sensors disposed corresponding to the second luminous fluxes, an image generator for generating image data based on output image signals, and focus controller for executing a focusing operation based on focus detection image signals. The imaging sensors each have a plurality of imaging pixels and a plurality of phase difference pixels disposed in a specific pattern. An arrangement of a first imaging sensor, which is one of the plurality of imaging sensors, is different from an arrangement of a second imaging sensor, which is another one of the plurality of imaging sensors. The specific pattern is such that a position of a phase difference pixel of the first imaging sensor does not overlap with a position of a phase difference pixel of the second imaging sensor.
Abstract:
A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.
Abstract:
A stitched image sensor array on a semiconductor substrate with identical blocks that have wherein said first configuration includes enable inputs, which vary a function of the block depending on the connection to the enable inputs. The enable inputs can set an SRAM to receive different numbers of inputs.