Surface treatment method for magnesium alloy object and structure thereof

    公开(公告)号:US12018389B2

    公开(公告)日:2024-06-25

    申请号:US16926241

    申请日:2020-07-10

    CPC分类号: C23F17/00 C25D11/30

    摘要: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.

    METAL-DOPED BORON FILMS
    6.
    发明申请

    公开(公告)号:US20220341034A1

    公开(公告)日:2022-10-27

    申请号:US17240395

    申请日:2021-04-26

    摘要: Exemplary deposition methods may include delivering a boron-containing precursor to a processing region of a semiconductor processing chamber. The methods may include delivering a dopant-containing precursor with the boron-containing precursor. The dopant-containing precursor may include a metal. The methods may include forming a plasma of all precursors within the processing region of the semiconductor processing chamber. The methods may include depositing a doped-boron material on a substrate disposed within the processing region of the semiconductor processing chamber. The doped-boron material may include greater than or about 80 at. % of boron in the doped-boron material.

    METHOD FOR TREATING SURFACES OF ALUMINUM CONTAINING SUBSTRATES

    公开(公告)号:US20210355584A1

    公开(公告)日:2021-11-18

    申请号:US17273522

    申请日:2019-09-05

    摘要: Described herein is a method for treatment of at least one surface of a substrate at least partially made of aluminum and/or an aluminum alloy, including at least a step of contacting the surface with an acidic aqueous composition (A) including one or more metal compounds (M) selected from the group of titanium compounds, zirconium compounds, and hafnium compounds and one or more linear polymers (P) containing (m1) hydroxyethyl- and/or hydroxypropyl-(meth)acrylate, (m2) vinylphosphonic acid, and (m3) (meth)acrylic acid in form of their polymerized monomeric units, the one or more linear polymers (P) being included in the acidic aqueous composition (A) in an amount of 50 to 5000 ppm. Also described herein is an acidic aqueous composition (A), a master batch to produce the acidic aqueous composition (A), a method of using the acidic aqueous composition (A) for treating surfaces, and substrates comprising the treated surfaces.

    Multi-layered coating film formation method

    公开(公告)号:US10577708B2

    公开(公告)日:2020-03-03

    申请号:US14906018

    申请日:2014-08-08

    摘要: A problem to be solved by the present invention is to provide a method for forming a multilayer coating film, the method being capable of achieving excellent finished appearance and excellent corrosion resistance without affecting electrodeposition coatability even when a part or all of the water-washing step is omitted after chemical conversion treatment, and to provide a coated article. The invention provides a method for forming a multilayer coating film, comprising forming a chemical conversion coating film and an electrodeposition coating film on a metal substrate by Step 1 of immersing a metal substrate in a chemical conversion treatment solution to form a chemical conversion coating film, and Step 2 of omitting a part or all of the water-washing step, and performing electrodeposition coating on the metal substrate using a cationic electrodeposition coating composition to form an electrodeposition coating film, wherein when the electrodeposition coating is performed in Step 2, the solution adhered to and/or deposited on the metal substrate has an electrical conductivity of less than 10,000 μS/cm.