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公开(公告)号:US20240326171A1
公开(公告)日:2024-10-03
申请号:US18128359
申请日:2023-03-30
IPC分类号: B23K26/359 , B23K26/0622 , B41M5/26 , B41M5/50
CPC分类号: B23K26/359 , B23K26/0622 , B41M5/262 , B41M5/502
摘要: A sheet of material marked by a pulse lasing apparatus. The sheet of material has a predetermined feature comprising a plurality of marks and voids in a grid pattern. The grid pattern has a plurality of locations disposed along a series of substantially parallel rows, and each location comprises either one mark or one void. The pulses from the pulse lasing apparatus form the marks and the absence of a pulse forms the voids. The pulse lasing apparatus is controlled by a computing device that sends packets of instructions to the pulse lasing apparatus, the packet of instructions comprising at least 2, where each individual instruction informs the laser to pulse or not to pulse, creating a mark or a void, respectively, at each location on the grid pattern.
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公开(公告)号:US12097573B2
公开(公告)日:2024-09-24
申请号:US18078104
申请日:2022-12-09
申请人: Yoichi Ichikawa
发明人: Yoichi Ichikawa
IPC分类号: B29C49/00 , B23K26/359 , B23K103/00
CPC分类号: B23K26/359 , B29C49/071 , B23K2103/42 , B29C2949/0724
摘要: A laser processing method includes: marking multiple concaves on a surface of a preform before blow molding.
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公开(公告)号:US12017122B2
公开(公告)日:2024-06-25
申请号:US17833143
申请日:2022-06-06
IPC分类号: A63B53/04 , A63B60/00 , B23K26/359 , B23K26/364
CPC分类号: A63B53/0445 , A63B53/04 , A63B53/047 , A63B60/00 , B23K26/359 , B23K26/364 , A63B53/0408
摘要: A golf club head has a striking face with a plurality of scorelines including a first scoreline and a second scoreline adjacent thereto. The striking face also has a plurality of auxiliary grooves each spaced from the scorelines. In a first imaginary vertical plane, a first path is formed by a first intersection between the first imaginary vertical plane and the striking face, and the auxiliary grooves have a first concentration no less than 0.17 measured between the first and second scorelines. A second imaginary vertical plane is horizontally spaced from the first imaginary plane. A second path is formed in the second imaginary vertical plane by a second intersection between the second imaginary vertical plane and the striking face. The auxiliary grooves in the second imaginary vertical plane have a second concentration that is different from the first concentration measured between the first and second scorelines.
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公开(公告)号:US20240033855A1
公开(公告)日:2024-02-01
申请号:US18020665
申请日:2021-03-05
发明人: Jae Hak CHUNG
IPC分类号: B23K26/359 , B41M1/32
CPC分类号: B23K26/359 , B41M1/32
摘要: The present invention relates to a method for marking the surface of a rubber stopper with a character or numeral by irradiating the surface of the rubber stopper with a laser beam. According to the method of the present invention, there are advantages in that when a mark is made on a rubber stopper, foreign matter is not produced, deformation of the rubber stopper does not occur, and the mark is not erased or spread.
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公开(公告)号:US11883903B2
公开(公告)日:2024-01-30
申请号:US16320585
申请日:2017-07-25
申请人: AMPLITUDE SYSTEMES , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE , UNIVERSITE DE BORDEAUX , ALPHANOV INSTITUT D'OPTIQUE D'AQUITAINE
发明人: Konstantin Mishchik , John Lopez , Rainer Kling , Clémentine Javaux-Leger , Guillaume Duchateau , Ophélie Dematteo-Caulier
IPC分类号: B23K26/0622 , B33Y10/00 , B33Y30/00 , B23K26/359 , B23K26/53 , B23K26/00 , B23K26/06 , B23K26/067 , G02B5/00 , G02B19/00 , G02B27/09 , G02B27/14 , B23K26/38 , B23K103/00
CPC分类号: B23K26/0624 , B23K26/0006 , B23K26/0643 , B23K26/0652 , B23K26/0676 , B23K26/359 , B23K26/38 , B23K26/53 , B33Y10/00 , B33Y30/00 , G02B5/001 , G02B19/0047 , G02B27/0927 , G02B27/14 , B23K2103/50
摘要: Disclosed is a method for cutting dielectric or semiconducting material with a laser. The method includes the following steps: emission of a laser beam including at least one burst of N femtoseconds laser pulses; spatial separation of the laser beam into a first split beam having a first energy, and respectively, a second split beam having a second energy; spatial concentration of energy of the first split beam in a first zone of the material, respectively, of the second split beam in a second zone of the material, the first zone and the second zone being separate and staggered by a distance dx; and adjustment of the distance between the first zone and the second zone in such a way as to initiate a straight micro-fracture oriented between the first zone and the second zone.
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公开(公告)号:US11813697B1
公开(公告)日:2023-11-14
申请号:US18132054
申请日:2023-04-07
申请人: Khanh Le , John Lekavich , Bao Tran
发明人: Khanh Le , John Lekavich , Bao Tran
IPC分类号: H04B10/50 , B23K26/359 , B23K26/082 , G02F1/11 , D06M10/00 , B23K103/00
CPC分类号: B23K26/359 , B23K26/082 , D06M10/005 , G02F1/113 , B23K2103/38
摘要: A laser system for creating patterns on clothing includes a laser source; a phased array acousto-optic deflector (AOD) configured to control the direction and intensity of the laser beam; a computer comprising software for reading input files containing pattern designs and controlling the AOD to direct the laser beam according to the pattern designs; a fabric preparation station for washing and preparing fabric before laser treatment; a post-laser wash station for removing debris from the fabric after laser treatment; and a clothing finishing station for applying finishing touches to the fabric. The AOD includes an optical element having a surface with one or more steps formed thereon; a conductive layer formed on the surface with the steps; one or more crystals secured to each step; and electrodes positioned on each surface of each crystal.
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公开(公告)号:US20230347449A1
公开(公告)日:2023-11-02
申请号:US18038335
申请日:2021-11-22
发明人: Andreas BODE-MOSIG , Frank SEIDEL
IPC分类号: B23K26/364 , B23K26/359 , B23K26/082 , B23K26/03
CPC分类号: B23K26/364 , B23K26/359 , B23K26/082 , B23K26/03 , B23K2101/006
摘要: A method for producing a weakening line in a surface of a component. The method comprises a guiding step and a skipping step. In the guiding step, a removal apparatus for removing a material of the surface is guided over a plurality of segments of a predefined line-shaped contour by means of an activated laser beam in order to produce a desired wall thickness for at least one of the segments so as to produce the weakening line. In the skipping step, the segment is skipped if the segment has the desired wall thickness.
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公开(公告)号:US20230286081A1
公开(公告)日:2023-09-14
申请号:US18007284
申请日:2020-08-14
发明人: Christian Pflaum
IPC分类号: B23K26/359 , B23K26/0622 , B23K26/082 , B23K26/03 , B41M5/00 , B41M5/26
CPC分类号: B23K26/359 , B23K26/032 , B23K26/0624 , B23K26/082 , B41M5/007 , B41M5/262 , B23K2103/52
摘要: The present invention relates to a method of high-speed recording and reading data on or in a layer (10) of a first material and to a device for high-speed recording and reading data on or in a layer (10) of a first material using a laser source (19, a galvanometer (4) and a digital micromirror (5) adapted to emit multiple laser beams.
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公开(公告)号:US11638971B2
公开(公告)日:2023-05-02
申请号:US16496541
申请日:2018-01-24
发明人: Meihong Wu , Zipeng Zhao , Guobao Li , Kanyi Shen , Zhuochao Hu , Chen Ling , Huande Sun , Huabing Zhang
IPC分类号: B23K26/364 , B23K26/359 , B23K26/40 , C22C38/02 , B23K103/04
摘要: A grain-oriented silicon steel with low iron loss, wherein the silicon steel is provided with a plurality of grooves on its surface, each of the grooves is 10-60 μm in width and 5-40 μm in depth, and the spacing between adjacent grooves is 1-10 mm. The manufacturing method therefor comprises: scoring the surface of the grain-oriented silicon steel with low iron loss by using a laser in order to form the grooves. The grain-oriented silicon steel with low iron loss can maintain the magnetic domain refining effect in a stress-relief annealing process, and avoid the introduction of more residual stress.
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公开(公告)号:US11629088B2
公开(公告)日:2023-04-18
申请号:US16443020
申请日:2019-06-17
申请人: Corning Incorporated
IPC分类号: C03B33/02 , B23K26/00 , B23K26/359 , B23K26/03 , B23K26/06 , B23K26/08 , B23K103/00
摘要: A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.
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