Abstract:
A display structure of a slip-cover-hinge electronic device, which includes a housing, a display module, two track modules and a flexible-printed-circuit module, is disclosed. The housing has an accommodated cavity formed with a bottom wall, two parallel slots formed respectively at two opposite ends of the bottom wall, and a passageway formed between the two slots and on the bottom wall. The display module is connected within the cavity. Each track module has a track disposed on the opposite ends of the bottom wall and a skid slidably arranged onto the corresponding tracks for gliding in corresponding slots. The flexible-printed-circuit module has at least a flexible-printed-circuit member, which includes an electrical connection portion and a resilient portion flexibly extending from the electrical connection portion. The resilient portion extends out of the passageway of the housing, and the resilient portion is partially self-overlapped to be capable of stretching outwardly.
Abstract:
A display structure of a slip-cover-hinge electronic device, which includes a housing, a display module, two track modules and a flexible-printed-circuit module, is disclosed. The housing has an accommodated cavity formed with a bottom wall, two parallel slots formed respectively at two opposite ends of the bottom wall, and a passageway formed between the two slots and on the bottom wall. The display module is connected within the cavity. Each track module has a track disposed on the opposite ends of the bottom wall and a skid slidably arranged onto the corresponding tracks for gliding in corresponding slots. The flexible-printed-circuit module has at least a flexible-printed-circuit member, which includes an electrical connection portion and a resilient portion flexibly extending from the electrical connection portion. The resilient portion extends out of the passageway of the housing, and the resilient portion is partially self-overlapped to be capable of stretching outwardly.
Abstract:
A semiconductor package including a substrate, a circuit pattern, a chip, at least one conductive material and an adhesive is provided. The substrate has a first surface, a second surface opposite thereto, and at least one through hole which penetrates the first surface and the second surface. The circuit pattern structure is disposed on the second surface and has at least one connecting pad disposed at the through hole. The chip is disposed on the first surface of the substrate. The chip has at least one conductive post, wherein the conductive post and the conductive material are disposed inside the through hole, and the conductive post is electrically connected with the pattern circuit structure through the conductive material. The adhesive is disposed between the chip and the substrate. A manufacturing method of the semiconductor structure is also provided.
Abstract:
This invention is directed to an acid beverage composition having a pH of from 3.0 to 4.5 having (A) a hydrated protein stabilizing agent; (B) at least one flavoring material; and (C) a slurry of an aqueous protein material prepared by a process including preparing an aqueous extract from a protein containing material, adjusting the pH of same to precipitate the protein material, separating the precipitated protein and forming a suspension of same in water, adjusting the pH of the suspension to a particular pH value, and pasteurizing same.
Abstract:
An optoelectronic transmission module. In the optoelectronic transmission module, a light transmissive element has first and second ends and top and bottom surfaces, a circuit board transmits electrical signals and has first and second openings. The circuit board is conformably extended from the top surface of the light transmissive element to the bottom surface such that the first and second openings are aligned with the first and second ends respectively. Two light transducers, each having a light transmitter/detector optically aligned with one of the first and second ends of the light transmissive element, wherein the light transducers transmit/receive light signals through the light transmissive element and the light transmitter/detector thereof. Two electrical interconnections are disposed on the circuit board and neighbored with the two ends of the light transmissive element respectively to interconnect the electrical signals.
Abstract:
This invention is directed to an acidic beverage composition, comprising; (A) a hydrated protein material having a combination of an inositol-6-phosphate content, an inositol-5-phosphate content, an inositol-4-phosphate content and an inositol-3-phosphate content of less than 8.0 μmol/g, with (B) a hydrated protein stabilizing agent and (C) at least one acid comprising a fruit juice, a vegetable juice, citric acid, malic acid, tartaric acid, lactic acid, ascorbic acid, glucono delta lactone or phosphoric acid, wherein the acidic beverage composition has a pH of from 3.0 to 4.5.
Abstract:
A method for adjusting a display of a sub-picture in an audio/video (AV) playback device is disclosed. The method provides a set of sub-picture adjusting parameter for adjusting display format of the sub-picture. The set of sub-picture adjusting parameter includes a sub-picture location adjusting parameter for adjusting display location of the sub-picture or a sub-picture size adjusting parameter for adjusting display size of the sub-picture. An input apparatus of the AV playback device is used to set the set of sub-picture adjusting parameter. The AV playback device determines, adjusts and displays the sub-picture according to the set of sub-picture adjusting parameter.
Abstract:
A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the PCB will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.
Abstract:
A contamination-resistant thin film deposition method utilizing a reaction-type vacuum sputtering process in which an organic tetrafluoroethylene plastic and conductor substances are sputtered onto a substrate to deposit a thin film onto the substrate, with the thin film deriving its contamination-resistant capability from the anti-stick properties of the tetrafluoroethylene plastic and the anti-static properties of the conductor substances. The contamination-resistant thin film deposition method utilizes a configured tetrafluoroethylene plastic target structure that includes a negative substrate, a filiform electrode, an insulative support, a tetrafluoroethylene plastic sputtering substrate, a positive substrate, a tetrafluoroethylene plastic substrate rotating device, a magnetic field generator, and a gas input port. A 2 mm to 5 mm interval is left in between the positive substrate and the tetrafluoroethylene plastic substrate to facilitate the generation of a positive charge and effectively utilize the energy of the Faraday positive shaded region effect to invoke collisions off the tetrafluoroethylene plastic.