Abstract:
Provided are a thin-film transistor (TFT) display panel having improved electrical properties that can be fabricated time-effectively and a method of fabricating the TFT display panel. The TFT display panel includes: gate wirings which are formed on an insulating substrate; oxide active layer patterns which are formed on the gate wirings; data wirings which are formed on the oxide active layer patterns to cross the gate wirings; a passivation layer which is formed on the oxide active layer patterns and the data wirings and is made of silicon nitride (SiNx); and a pixel electrode which is formed on the passivation layer.
Abstract:
In one embodiment, a thin-film transistor (TFT) includes a gate electrode, a semiconductor pattern, first and second electrodes and a protective layer. The semiconductor pattern is formed on the gate electrode, and includes a first semiconductor layer deposited at a first deposition speed and a second semiconductor layer deposited at a second deposition speed faster than the first deposition speed. The first and second electrodes are spaced apart from each other on the semiconductor pattern. The protective layer is formed on the semiconductor pattern to cover the first and second electrodes, and makes contact with a channel region of the first semiconductor layer to form an interface with the first semiconductor layer. Thus, electrical characteristics of the TFT may be improved.
Abstract:
A manufacturing method of a thin film transistor (TFT) includes forming a gate electrode including a metal that can be combined with silicon to form silicide on a substrate and forming a gate insulation layer by supplying a gas which includes silicon to the gate electrode at a temperature below about 280° C. The method further includes forming a semiconductor on the gate insulation layer, forming a data line and a drain electrode on the semiconductor and forming a pixel electrode connected to the drain electrode.
Abstract:
The present invention provides a method for manufacturing a thin film transistor substrate including forming gate wires on an insulation substrate, forming oxide active layer patterns on the gate wires, forming data wires on the oxide active layer patterns so that the data wires cross the gate wires, forming a passivation film on the oxide active layer patterns and the data wires using a non-reductive reaction gas and SiH4, and forming pixel electrodes on the passivation film
Abstract translation:本发明提供了一种制造薄膜晶体管基板的方法,包括在绝缘基板上形成栅极线,在栅极线上形成氧化物有源层图案,在氧化物有源层图案上形成数据线,使得数据线与栅极线交叉 在氧化物活性层图案和数据线上使用非还原反应气体和SiH 4 S 4形成钝化膜,并在钝化膜上形成像素电极
Abstract:
The present invention relates to a process for vapor depositing a low dielectric insulating film, a thin film transistor using the same, and a preparation method thereof, and more particularly to a process for vapor deposition of low dielectric insulating film that can significantly improve a vapor deposition speed while maintaining properties of the low dielectric insulating film, thereby solving parasitic capacitance problems to realize a high aperture ratio structure, and can reduce a process time by using silane gas when vapor depositing an insulating film by a CVD or PECVD method to form a protection film for a semiconductor device. The present invention also relates to a thin film transistor using the process and preparation method thereof.
Abstract:
In a liquid crystal display device, the device includes a first substrate, a second substrate and a liquid crystal layer interposed therebetween. The first substrate includes a pixel electrode, a thin film transistor connected to the pixel electrode, and also a hitch to connect both a lower and upper electrode of the pixel electrode. The second substrate includes a common electrode having a lower domain division part and an upper domain division part, in which each of domain division part is formed at the position corresponding to the lower and upper electrode of the pixel electrode, respectively. Through the electric field controller connected at both sides of the upper electrode of the pixel electrode, quality of display image can improve without a darkening area occurring at one part of the unit pixel.
Abstract:
A method of manufacturing a silicon layer includes pretreating a surface of a silicon nitride layer formed on a substrate through a plasma enhanced chemical vapor deposition method using a first reaction gas including at least one of silicone tetrafluoride (SiF4) gas, a nitrogen trifluoride (NF3) gas, SiF4—H2 gas and a mixture thereof Then, a silicon layer is formed on the pretreated silicon nitride layer through the plasma enhanced chemical vapor deposition method using a second reaction gas including a mixture of gas including silicon tetrfluoride (SiF4), hydrogen (H2) and argon (Ar),
Abstract translation:一种制造硅层的方法包括:使用第一反应气体,通过等离子体增强化学气相沉积方法来预处理在衬底上形成的氮化硅层的表面,所述第一反应气体包括四氟化硅(SiF 4 N 4 O 4) )气体,三氟化氮(NF 3 3)气体,SiF 4 H 2 H 2气体及其混合物然后,形成硅层 通过等离子体增强化学气相沉积方法在预处理的氮化硅层上,使用包括包括四氟化硅(SiF 4 N 4),氢(H 2 O 3)的气体混合物的第二反应气体, )和氩(Ar),
Abstract:
A manufacturing method for a flat panel display device includes forming a barrier layer on a flexible plastic substrate by RF sputtering, forming an amorphous silicon layer on the plastic substrate, and subjecting the amorphous silicon layer to a rapid heat treatment so as to thereby improve electrical characteristics and/or homogeneity of the amorphous silicon layer.
Abstract:
An LCD includes a thin film display device having a plastic insulating substrate in which lifting of the edge of the thin film is avoided which includes a display region and a non-display region; a gate line assembly formed on the plastic insulating substrate with the use of a shadow mask disposed over the plastic insulating substrate; a gate insulating layer formed on the gate line assembly in the display region; a data line formed on the gate insulating layer and a data pad formed in the non-display region and spaced away from the gate insulating layer; and a passivation layer formed on the data line.
Abstract:
Provided are a photo sensor, a display device including the same, and a driving method thereof The photo sensor includes: an amplifying element including an input terminal coupled to a scan line for receiving a scan signal, an output terminal configured to output a sensing signal, and a control terminal connected to a first node; a sensing capacitor connected with the first node; a photosensitive sensing element including a control terminal connected with a terminal of a first control signal, an output terminal connected with the first node, and an input terminal; and a reset element connected with the output terminal of the amplifying element and resetting the output terminal of the amplifying element to second voltage according to a reset control signal.