公开(公告)号：US20060223473A1

公开(公告)日：2006-10-05

申请号：US11184423

申请日：2005-07-19

申请人： Arya Behzad ,  Hung-Ming Chien

发明人： Arya Behzad ,  Hung-Ming Chien

IPC分类号： H04B1/06

CPC分类号： H03L7/18 ,  H03L7/0802 ,  H03L7/0891

摘要： A phase locked loop includes a detection module, a control conversion module, a controlled oscillation module, a divider module, and a power distribution module. The detection module is operably coupled to produce a difference signal based on a difference between a reference oscillation and a feedback oscillation. The control conversion module is operably coupled to convert the difference signal into a control signal. The controlled oscillation module is operably coupled to produce an output oscillation based on the control signal. The divider module is operably coupled to produce the feedback oscillation based on the output oscillation. The power distribution module is operably coupled to receive a supply voltage and to provide an individual supply voltage to at least one of the detection module, the control conversion module, the controlled oscillation module, and the divider module to optimize at least one of performance and power consumption of the phase locked loop.

摘要翻译： 锁相环包括检测模块，控制转换模块，受控振荡模块，分频模块和配电模块。 检测模块可操作地耦合以基于参考振荡和反馈振荡之间的差产生差分信号。 控制转换模块可操作地耦合以将差分信号转换成控制信号。 受控振荡模块可操作地耦合以基于控制信号产生输出振荡。 分压器模块可操作地耦合以基于输出振荡产生反馈振荡。 功率分配模块可操作地耦合以接收电源电压并且向检测模块，控制转换模块，受控振荡模块和分频器模块中的至少一个提供单独的电源电压，以优化性能和 锁相环的功耗。

公开(公告)号：US20060223458A1

公开(公告)日：2006-10-05

申请号：US11168831

申请日：2005-06-28

申请人： Arya Behzad

发明人： Arya Behzad

IPC分类号： H04B1/40

CPC分类号： H04B1/406

摘要： A Radio Frequency (RF) transceiver Integrated Circuit (IC) includes a first RF transceiver group, a first baseband section, a second RF transceiver group, a second baseband section, local oscillation circuitry, and local oscillation distribution circuitry. The first baseband section communicatively couples to the first RF transceiver group. The second RF transceiver group resides in substantial symmetry with the first RF transceiver group about a center line of symmetry of the RF transceiver IC. The second baseband section communicatively coupled to the second RF transceiver group. The local oscillation distribution circuitry operably couples to the local oscillation generation circuitry, to the first RF transceiver group, and to the second RF transceiver group. The second baseband section may reside in substantial symmetry with the first baseband section about the center line of symmetry of the RF transceiver IC.

公开(公告)号：US20060220748A1

公开(公告)日：2006-10-05

申请号：US11446662

申请日：2006-06-05

申请人： Arya Behzad

发明人： Arya Behzad

IPC分类号： H03F1/22

CPC分类号： H03F1/0266 ,  H03F1/0205 ,  H03F1/22 ,  H03F1/223 ,  H03F3/24 ,  H03F3/45188 ,  H03F2200/372 ,  H03F2200/435 ,  H03F2203/45288

摘要： A power amplifier power amplifier includes a transconductance stage and a cascode stage. The transconductance stage that is operable to receive an input voltage signal and to produce an output current signal. The transconductance stage includes a first Metal Oxide Silicon (MOS) transistor having a first gate oxide thickness and a first channel length. The cascode stage communicatively couples to the transconductance stage and is operable to receive the output current signal and to produce an output voltage signal based thereupon. The cascode stage includes a second MOS transistor having a second gate oxide thickness and a second channel length.

摘要翻译： 功率放大器功率放大器包括跨导级和共源共栅级。 跨导级，其可操作以接收输入电压信号并产生输出电流信号。 跨导级包括具有第一栅极氧化物厚度和第一沟道长度的第一金属氧化物硅（MOS）晶体管。 共源共栅级通信耦合到跨导级并且可操作以接收输出电流信号并且基于此产生输出电压信号。 共射共栅级包括具有第二栅极氧化物厚度和第二沟道长度的第二MOS晶体管。

公开(公告)号：US20060202755A1

公开(公告)日：2006-09-14

申请号：US11420406

申请日：2006-05-25

申请人： Arya Behzad ,  Klaas Bult ,  Ramon Gomez ,  Chi-Hung Lin ,  Tom Kwan ,  Oscar Agazzi ,  John Creigh ,  Mehdi Hatamian ,  David Kruse ,  Arthur Abnous ,  Henry Samueli

发明人： Arya Behzad ,  Klaas Bult ,  Ramon Gomez ,  Chi-Hung Lin ,  Tom Kwan ,  Oscar Agazzi ,  John Creigh ,  Mehdi Hatamian ,  David Kruse ,  Arthur Abnous ,  Henry Samueli

IPC分类号： H03F3/68

CPC分类号： H03F1/32 ,  H03F3/347 ,  H03F3/505 ,  H03F2200/211 ,  H03F2200/252 ,  H03F2200/421 ,  H03F2200/513 ,  H03G1/0088 ,  H03G3/001 ,  H03G3/3036 ,  H03G3/3052 ,  H03G5/10 ,  H03H11/245

摘要： Circuitry to remove switches from signal paths in integrated circuit programmable gain attenuators Programmable gain attenuators and programmable gain amplifiers commonly switch between signal levels using semi-conductor switches. Such switches may introduce non-linearities in the signal, By isolating the switches from the signal path linearity of the PGA can be improved.

摘要翻译： 电路从集成电路可编程增益衰减器中的信号路径中去除开关可编程增益衰减器和可编程增益放大器通常使用半导体开关在信号电平之间切换。 这种开关可能在信号中引入非线性。通过将开关与信号路径隔离，可以提高PGA的线性度。

公开(公告)号：US20060131701A1

公开(公告)日：2006-06-22

申请号：US11353910

申请日：2006-02-13

申请人： Arya Behzad

发明人： Arya Behzad

IPC分类号： H01L39/00

CPC分类号： H03F3/191 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03D7/1441 ,  H03D7/1458 ,  H03D7/1483 ,  H03D2200/0043 ,  H03F1/565 ,  H03F3/45188 ,  H03F2200/111 ,  H03F2200/372 ,  H03F2203/45638 ,  H03F2203/45704 ,  H03F2203/45726 ,  H03F2203/45728 ,  H03F2203/7209 ,  H03J5/244 ,  H03J2200/10 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality of die pads formed thereon. The package includes a heat slug upon which the semi conductive die resides, a plurality of package pins, a plurality of bond wires, a downbond rail, and a plurality of downbonds. Each of the bond wires couples between a corresponding die pad and a corresponding package pin. The downbond rail couples to the heat slug. At least one downbond couples between a die pad corresponding to the first portion of the RF circuit and a respective location on the downbond rail, serves as an inductor for a second portion of the RF circuit, may include a plurality of downbonds coupled in parallel, and has a length and/or a diameter selected to provide a desired inductance.

公开(公告)号：US20060057999A1

公开(公告)日：2006-03-16

申请号：US11167528

申请日：2005-06-27

申请人： Arya Behzad ,  C. Lee

发明人： Arya Behzad ,  C. Lee

IPC分类号： H04B1/26 ,  H04B15/00

CPC分类号： H03D7/1441 ,  H03D7/1458 ,  H03D7/165 ,  H03D2200/0025 ,  H03D2200/0047

摘要： An offset cancellation scheme in which offset cancellation current is sourced into one differential branch of a driver circuit and sinked from the opposite differential branch. The source/sink arrangement allows for offset cancellation current to be introduced into the circuit, but the overall total average current remains substantially unchanged. When used in an I and Q mixer circuits, the offsets may be canceled without generating an I/Q imbalance in the I and Q mixers.

公开(公告)号：US20050088241A1

公开(公告)日：2005-04-28

申请号：US10971506

申请日：2004-10-22

申请人： Arya Behzad

发明人： Arya Behzad

IPC分类号： H01L23/36 ,  H01L23/48 ,  H01L23/50 ,  H01L23/60 ,  H01L23/66 ,  H01L27/02 ,  H03F3/14

CPC分类号： H01L27/0255 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/50 ,  H01L23/60 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A circuit includes a plurality of circuit components formed on a semi conductive substrate die and a bond wire. The plurality of circuit components include at least one active component that operates on an information signal, a tuning node coupled to the at least one active component, an Electro Static Discharge (ESD) protection inductor, and a chip pad. The chip pad couples to the tuning node. The ESD protection inductor communicatively couples between the tuning node and a rail formed on the semi conductive substrate die. The ESD protection inductor provides ESD protection prior to packaging of the semi conductive substrate die or in some cases prior to the installation of the packaged die on a PC board or the equivalent. The bond wire couples between the chip pad and a package pad and serves as a tuning inductor for the circuit.

摘要翻译： 电路包括形成在半导体基板芯片和接合线上的多个电路部件。 所述多个电路部件包括对信息信号进行操作的至少一个有源部件，耦合到所述至少一个有源部件的调谐节点，静电放电（ESD）保护电感器和芯片焊盘。 芯片焊盘耦合到调谐节点。 ESD保护电感器在调谐节点和形成在半导电衬底裸片上的导轨之间通信地耦合。 ESD保护电感器在封装半导体衬底裸片之前或在某些情况下，在将封装的裸片安装在PC板或等效电路之前提供ESD保护。 接合线耦合在芯片焊盘和封装焊盘之间，并用作电路的调谐电感器。

公开(公告)号：US20050088204A1

公开(公告)日：2005-04-28

申请号：US10973705

申请日：2004-10-26

申请人： Arya Behzad

发明人： Arya Behzad

IPC分类号： H03D7/14 ,  H03K5/22

CPC分类号： H03D7/1441 ,  H03D7/1458 ,  H03D7/1466 ,  H03D2200/0033 ,  H03D2200/0043 ,  H03D2200/0088

摘要： An RF communications system includes a transmit node for transmitting an RF information signal and a receive node for receiving the transmitted RF information signal. The receive node includes a passive mixer coupled to an amplifier for producing an IF or baseband differential mixer output signal as a function of a LO drive signal. The passive mixer having a first plurality of transistors of a first polarity type arranged in a ring configuration and a second plurality of transistors of a second polarity type, wherein each of second plurality of transistors is coupled to one of the first plurality of transistors.

公开(公告)号：US20050087887A1

公开(公告)日：2005-04-28

申请号：US10972102

申请日：2004-10-22

申请人： Arya Behzad ,  Agnes Woo ,  Victor Fong

发明人： Arya Behzad ,  Agnes Woo ,  Victor Fong

IPC分类号： H01L23/36 ,  H01L23/48 ,  H01L23/50 ,  H01L23/60 ,  H01L23/66 ,  H01L27/02 ,  H03F3/14

CPC分类号： H01L27/0255 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/50 ,  H01L23/60 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A padring formed on a semi conductive substrate die provides Electro Static Discharge (ESD) protection for a Radio Frequency (RF) circuit also formed on the semi conductive substrate die. The padring includes a voltage supply rail, a ground rail, a plurality of signal pad structures, and a plurality of voltage clamps. The plurality of signal pad structures are disposed between the voltage supply rail and the ground rail. Each signal pad structure includes a signal pad that couples to the RF circuit, a voltage supply path diode disposed between and coupled between the signal pad and the voltage supply rail, and a ground path diode disposed between and coupled between the signal pad and the voltage supply rail. The plurality of voltage clamps are disposed between and coupled between the voltage supply rail and the ground rail.

摘要翻译： 形成在半导体衬底裸片上的衬垫为也形成在半导体衬底裸片上的射频（RF）电路提供静电放电（ESD）保护。 衬垫包括电压供应轨，接地轨，多个信号垫结构和多个电压钳。 多个信号焊盘结构设置在电源线和接地轨之间。 每个信号焊盘结构包括耦合到RF电路的信号焊盘，设置在信号焊盘和电压源导轨之间并耦合在信号焊盘和电压供应轨道之间的电压供应路径二极管，以及设置在信号焊盘和电压之间并耦合在其之间的接地路径二极管 供应轨道 多个电压钳位置设置在电压供应轨道和接地轨道之间并耦合在电压供应轨道和接地轨道之间。

公开(公告)号：US20050083126A1

公开(公告)日：2005-04-21

申请号：US10984866

申请日：2004-11-10

申请人： Frank Singor ,  Arya Behzad

发明人： Frank Singor ,  Arya Behzad

IPC分类号： H03F3/45

CPC分类号： H03F3/45183 ,  H03F3/45381 ,  H03F3/45475 ,  H03F2200/516 ,  H03F2203/45392 ,  H03F2203/45651 ,  H03F2203/45652 ,  H03F2203/45682 ,  H03F2203/45696 ,  H03F2203/45702

摘要： A circuit and method for bridging an analog signal between two integrated circuits operating at different supply voltages. The circuit is a two stage fixed gain amplifier. The first stage is a transconductance amplifier and the second stage is an operational amplifier. The first stage converts an input signal from a voltage into a current. The second stage converts the current signal to an output voltage signal.

摘要翻译： 一种在不同电源电压下工作的两个集成电路之间桥接模拟信号的电路和方法。 该电路是两级固定增益放大器。 第一级是跨导放大器，第二级是运算放大器。 第一阶段将输入信号从电压转换为电流。 第二级将电流信号转换为输出电压信号。