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211 条记录 (耗时 0.037 秒)

    ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES
    91.
    发明申请
    ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES 审中-公开
    基于阳极阵列的电镀设备

    公开(公告)号：US20110198229A1

    公开(公告)日：2011-08-18

    申请号：US13097020

    申请日：2011-04-28

    申请人： SARAVJEET SINGH ,  Manoocher Birang ,  Nicolay Y. Kovarsky ,  Aron Rosenfeld

    发明人： SARAVJEET SINGH ,  Manoocher Birang ,  Nicolay Y. Kovarsky ,  Aron Rosenfeld

    IPC分类号： C25D5/00 ,  C25B9/00

    CPC分类号： C25D17/12 ,  C25D17/10 ,  H01L21/2885 ,  Y10S204/07

    摘要： The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.

    摘要翻译： 本发明一般涉及在基片上镀敷导电材料的装置和方法。 本发明的一个实施例提供一种用于在基板上镀覆导电材料的装置。 该装置包括被配置为保持电解质的流体池，被配置为支撑基板并且电连接基板的接触环以及设置在流体槽中的阳极组件，其中阳极组件包括排成行的多个阳极元件。

    SUBSTRATE POLISHING METROLOGY USING INTERFERENCE SIGNALS
    94.
    发明申请
    SUBSTRATE POLISHING METROLOGY USING INTERFERENCE SIGNALS 失效
    使用干扰信号的基板抛光公式

    公开(公告)号：US20100240281A1

    公开(公告)日：2010-09-23

    申请号：US12793438

    申请日：2010-06-03

    申请人： Manoocher Birang ,  Grigory Pyatigorsky

    发明人： Manoocher Birang ,  Grigory Pyatigorsky

    IPC分类号： B24B49/00

    CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/06 ,  G01B11/0683

    摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.

    摘要翻译： 抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光 光束并将光束引向基板以使光束撞击正在抛光的基板的侧面。 从基板反射的光在检测器处产生干涉信号。 从干扰信号计算均匀度的度量。

    METHODS AND APPARATUS FOR POLISHING CONTROL
    95.
    发明申请
    METHODS AND APPARATUS FOR POLISHING CONTROL 审中-公开
    抛光控制方法与装置

    公开(公告)号：US20080268643A1

    公开(公告)日：2008-10-30

    申请号：US12173772

    申请日：2008-07-15

    申请人： Manoocher Birang ,  Konstantin Y. Smekalin ,  David A. Chan

    发明人： Manoocher Birang ,  Konstantin Y. Smekalin ,  David A. Chan

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/003 ,  B24B49/12

    摘要： A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.

    摘要翻译： CMP站可以通过使用由第一抛光晶片的在线计量站获得的数据来闭环控制，以影响后续抛光晶片的处理。 第一个晶片经过内联计量站的抛光和测量。 测量站在各点测量阵列电介质厚度，场介电厚度，阻挡残留厚度和金属残留厚度。 然后将数据输入算法，并计算抛光参数输出。 输出被发送到CMP站，用于补充或替换以前的抛光参数。 随后的晶片在CMP站上使用修改的抛光参数进行研磨。

    Eddy current system for in-situ profile measurement
    97.
    发明申请
    Eddy current system for in-situ profile measurement 有权
    用于原位轮廓测量的涡流系统

    公开(公告)号：US20070139043A1

    公开(公告)日：2007-06-21

    申请号：US11505659

    申请日：2006-08-16

    申请人： G. Miller ,  Boguslaw Swedek ,  Manoocher Birang

    发明人： G. Miller ,  Boguslaw Swedek ,  Manoocher Birang

    IPC分类号： G01B7/06

    CPC分类号： B24B37/013 ,  B24B49/105 ,  G01B7/10 ,  H01L21/67253

    摘要： An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.

    摘要翻译： 涡流监视系统可以包括细长的核心。 一个或多个线圈可以与细长铁芯耦合以产生可与晶片上的一个或多个导电区域耦合的振荡磁场。 芯可以相对于晶片翻转以提供改善的分辨率，同时保持足够的信号强度。 涡流监测系统可以包括用于产生谐振频率的振荡磁场的DC耦合边缘振荡器，其中谐振频率可能由于对一个或多个导电区域的改变而改变。 涡流监视系统可用于实现实时配置文件控制。

    Spin-rinse-dryer
    98.
    发明授权
    Spin-rinse-dryer 失效
    旋转干燥机

    公开(公告)号：US07226514B2

    公开(公告)日：2007-06-05

    申请号：US10309832

    申请日：2002-12-04

    申请人： Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

    发明人： Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

    IPC分类号： B08B3/02

    CPC分类号： H01L21/67028 ,  Y10S134/902

    摘要： An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction. A sensor adapted to facilitate desired flywheel position, an openable gripper having a remote actuator, a radiused gripper and a source of inert drying gas are also provided in individual embodiments.

    摘要翻译： 提供了一种创造性的垂直旋转干燥器。 本发明的旋转干燥器可以具有屏蔽系统，其被定位成接收从垂直定位在旋转干燥器内的衬底移位的流体。 屏蔽系统可以具有一个或多个屏蔽件，其定位成当流体冲击屏蔽时至少部分地反射流体。 一个或多个屏蔽件成角度以促使其流体流动，并且优选是亲水的以防止液滴形成。 优选地，屏蔽系统具有以水平和垂直交错方式定位的三个屏蔽件，使得流体从第一屏蔽件的面向基板的表面转移到相邻屏蔽件的顶部或非基板面向表面等。压力梯度可以 施加在旋转干燥器的内部以产生鼓风流体沿着屏蔽系统沿所需方向行进的空气流。 在各个实施例中还提供了适于促进期望的飞轮位置的传感器，具有远程致动器的可打开夹具，圆角夹持器和惰性干燥气体源。

    Polishing Assembly With A Window
    99.
    发明申请
    Polishing Assembly With A Window 有权
    抛光组装与窗口

    公开(公告)号：US20070021037A1

    公开(公告)日：2007-01-25

    申请号：US11532498

    申请日：2006-09-15

    申请人： Manoocher Birang ,  Allan Gleason ,  William Guthrie

    发明人： Manoocher Birang ,  Allan Gleason ,  William Guthrie

    IPC分类号： B24B49/00

    CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  B24D18/00 ,  G01B11/06 ,  G01B11/0683

    摘要： The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.

    摘要翻译： 用于化学机械抛光装置的抛光垫及其制造方法。 抛光垫具有与抛光表面相邻的覆盖层和与压板相邻的背衬层。 具有第一横截面积的覆盖层中的第一开口和具有第二不同横截面积的背衬层中的第二开口形成穿过抛光垫的孔。 基本上透明的聚氨酯塞被定位在孔中，并且粘合剂材料将塞子固定在孔中。