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120 条记录 (耗时 0.04 秒)

    MULTIFUNCTIONAL SUPPORTING FRAME FOR A WEB CAMERA
    93.
    发明申请
    MULTIFUNCTIONAL SUPPORTING FRAME FOR A WEB CAMERA 审中-公开
    网络摄像机的多功能支持框架

    公开(公告)号：US20090103913A1

    公开(公告)日：2009-04-23

    申请号：US11874934

    申请日：2007-10-19

    申请人： Chih-Ming Huang

    发明人： Chih-Ming Huang

    IPC分类号： G03B17/00

    CPC分类号： G03B17/00

    摘要： A multifunctional supporting frame for a web camera, comprises a movable supporting clamping seat having a hollow rectangular receiving chamber; the rectangular receiving chamber being formed by an upper L shape sheet, a middle U shape sheet, and a lower enclosed rectangular sheet; one lateral side of the L shape sheet being extended with a sheet plate; at least one guide post being extended from one surface of the sheet plate; the guide posts being combined with springs so as to be formed as a telescopic structure which is adjustable to have a desire width for clamping an object; and a bendable shaft seat formed by an upper U shape plate and a lower U shape plate which are pivotally engaged. A lens set is installed above the movable supporting clamping seat by using a lens set pin seat.

    摘要翻译： 一种用于网络摄像机的多功能支撑框架，包括具有中空矩形接收室的可移动支撑夹座; 矩形容纳室由上部L形片，中部U形片和下部封闭矩形片形成; L形片的一个侧面用片状板延伸; 至少一个引导柱从所述板的一个表面延伸; 引导柱与弹簧组合，以形成可伸缩结构，其可调节以具有用于夹紧物体的期望宽度; 以及由上U形板和下U形板形成的可枢转地接合的可弯曲的轴座。 通过使用镜头组座座将透镜组安装在可动支撑夹座上方。

    Semiconductor read-only memory device and method of fabricating the same
    94.
    发明授权
    Semiconductor read-only memory device and method of fabricating the same 有权

    公开(公告)号：US06380587B1

    公开(公告)日：2002-04-30

    申请号：US09706527

    申请日：2000-11-03

    申请人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    发明人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    IPC分类号： H01L2976

    CPC分类号： H01L27/1126 ,  H01L27/105 ,  H01L27/11293

    摘要： A semiconductor read-only memory (ROM) and a method of fabricating the same are provided. The ROM device is structured in such a manner that allows the fabrication to include a fewer number of mask processes. This makes it more cost effective and allows a cycle time that is shorter than that of the prior art. Moreover, the particular structure of the ROM device makes punchthrough less likely to occur between any neighboring pairs of the buried bit lines when the ROM device is further scaled down. The ROM device is constructed on a semiconductor substrate which is partitioned into a peripheral region and a cell region. A plurality of STI structures are formed at predefined locations in both the peripheral region and the cell region. Immediately after this, a first ion-implantation process can be performed on the cell region to form a plurality of buried bit lines. Subsequently, the dielectric isolation layers in all of the STI structures in the cell region are removed, leaving a plurality of empty trenches behind. A conformal insulating layer and a conductive layer are then successively formed over the wafer, and the conductive layer is further selectively removed to form a word line in the cell region and a gate in the peripheral region. In the code implantation process, selected channel regions between the buried bit lines are doped with impurities for code implantation of data into the ROM device.

    Electrical connector and printed circuit board assembly
    95.
    发明授权
    Electrical connector and printed circuit board assembly 失效
    电气连接器和印刷电路板组件

    公开(公告)号：US08241059B2

    公开(公告)日：2012-08-14

    申请号：US12792910

    申请日：2010-06-03

    申请人： Wei-Chao Huang ,  Chih-Ming Huang

    发明人： Wei-Chao Huang ,  Chih-Ming Huang

    IPC分类号： H01R13/621

    CPC分类号： H01R12/7047

    摘要： A connector and printed circuit board assembly includes a printed circuit board, a connector fixed on the printed circuit board, and a fixing board fixed on the connector, the fixing board defining a through hole, a connecting member fixed on the printed circuit board adjacent to the connector, a threaded retainer, and a threaded post securely connected with the connecting member. The threaded post passes through the through hole and seats the threaded retainer to lock the connector onto the printed circuit board.

    摘要翻译： 连接器和印刷电路板组件包括印刷电路板，固定在印刷电路板上的连接器和固定在连接器上的固定板，固定板限定通孔，固定在印刷电路板上的连接件 连接器，螺纹保持器和与连接构件牢固连接的螺纹柱。 螺纹柱穿过通孔并安装螺纹固定器以将连接器锁定到印刷电路板上。

    Torque compensation method and system for DC brushless motor
    96.
    发明授权
    Torque compensation method and system for DC brushless motor 有权
    直流无刷电机的扭矩补偿方法及系统

    公开(公告)号：US07667421B2

    公开(公告)日：2010-02-23

    申请号：US11861838

    申请日：2007-09-26

    申请人： Chih-Ming Huang

    发明人： Chih-Ming Huang

    IPC分类号： H02P7/00

    CPC分类号： H02P6/08 ,  H02P6/14

    摘要： A torque compensation method and system for a DC brushless motor. When the DC brushless motor coupled with an asymmetric load is rotating, the difference between an instant current and an average current of a shunt resister is an index of adjusting control signals within an absolute rotor position for the purpose of approaching the corresponding instant current to the average current.

    摘要翻译： 一种用于直流无刷电机的转矩补偿方法和系统。 当与非对称负载耦合的DC无刷电动机旋转时，分流电阻器的瞬时电流和平均电流之间的差异是在绝对转子位置内调整控制信号的指标，以便接近对应于瞬时电流 平均电流。

    Device for locking lens
    97.
    发明申请
    Device for locking lens 审中-公开
    锁定镜头的装置

    公开(公告)号：US20090282673A1

    公开(公告)日：2009-11-19

    申请号：US12316750

    申请日：2008-12-15

    申请人： Chih-Ming Huang ,  Chih-Lun Chen

    发明人： Chih-Ming Huang ,  Chih-Lun Chen

    IPC分类号： G02B7/04

    CPC分类号： G02B7/026 ,  G03B13/32 ,  Y10T29/53

    摘要： A lens-fastening apparatus for assembling a voice coil motor of a camera module is provided. The voice coil motor has a lens holder. The lens-fastening apparatus includes a guiding plate; a rotation stopping jig having a central and a lateral portions, disposed on the guiding plate, and fit with the lens holder for stopping a rotation of the lens holder; a focusing ring for rotating the lens; a first pressing device pressing the central portion of the rotation stopping jig to fasten the rotation stopping jig on the guiding plate; and a second pressing device pressing the lateral portion of the rotation stopping jig.

    摘要翻译： 提供了一种用于组装相机模块的音圈电机的镜头固定装置。 音圈电机具有透镜架。 透镜紧固装置包括导板; 具有中央和外侧部分的旋转止动夹具，设置在所述引导板上，并与所述透镜保持器配合以停止所述透镜保持器的旋转; 用于旋转透镜的聚焦环; 按压所述旋转停止夹具的中心部分的第一按压装置将所述转动停止夹具紧固在所述引导板上; 以及按压旋转停止夹具的侧部的第二按压装置。

    TORQUE COMPENSATION METHOD AND SYSTEM FOR DC BRUSHLESS MOTOR
    98.
    发明申请
    TORQUE COMPENSATION METHOD AND SYSTEM FOR DC BRUSHLESS MOTOR 有权
    直流无刷马达的扭矩补偿方法及系统

    公开(公告)号：US20080075439A1

    公开(公告)日：2008-03-27

    申请号：US11861838

    申请日：2007-09-26

    申请人： Chih-Ming Huang

    发明人： Chih-Ming Huang

    IPC分类号： H02P7/29

    CPC分类号： H02P6/08 ,  H02P6/14

    摘要： A torque compensation method and system for a DC brushless motor. When the DC brushless motor coupled with an asymmetric load is rotating, the difference between an instant current and an average current of a shunt resister is an index of adjusting control signals within an absolute rotor position for the purpose of approaching the corresponding instant current to the average current.

    摘要翻译： 一种用于直流无刷电机的转矩补偿方法和系统。 当与非对称负载耦合的DC无刷电动机旋转时，分流电阻器的瞬时电流和平均电流之间的差异是在绝对转子位置内调整控制信号的指标，以便接近对应于瞬时电流 平均电流。

    Semiconductor package with lead frame as chip carrier and method for fabricating the same
    99.
    发明授权
    Semiconductor package with lead frame as chip carrier and method for fabricating the same 失效
    具有引线框架的半导体封装作为芯片载体及其制造方法

    公开(公告)号：US07339280B2

    公开(公告)日：2008-03-04

    申请号：US10319211

    申请日：2002-12-13

    申请人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

    发明人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

    IPC分类号： H01L23/29

    CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame includes a die pad and a plurality of leads properly spaced apart from the die pad, each lead being composed of an inner lead portion and an outer lead portion, wherein the inner lead portion is directed toward the die pad, and the outer lead portion has a terminal. At least a chip is mounted on the die pad, and a first encapsulant is formed for encapsulating the chip, die pad and inner lead portions. An injection-molded second encapsulant is formed for encapsulating the first encapsulant and outer lead portions, but exposing the terminals of the outer lead portions. The second encapsulant made by injection molding can prevent resin flash over the exposed terminals, thereby assuring electrical-connection quality of the semiconductor package.

    摘要翻译： 提供了具有引线框架作为芯片载体的半导体封装及其制造方法。 引线框架包括管芯焊盘和与管芯焊盘适当间隔开的多个引线，每个引线由内引线部分和外引线部分组成，其中内引线部分指向管芯焊盘，外引线 引线部分具有端子。 至少芯片安装在管芯焊盘上，形成第一密封剂以封装芯片，管芯焊盘和内引线部分。 形成注射成型的第二密封剂，用于封装第一密封剂和外引线部分，但暴露外引线部分的端子。 通过注射成型制成的第二密封剂可以防止树脂在暴露的端子上闪烁，从而确保半导体封装的电连接质量。