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120 条记录 (耗时 0.026 秒)

    Semiconductor read-only memory device and method of fabricating the same
    1.
    发明授权
    Semiconductor read-only memory device and method of fabricating the same 有权

    公开(公告)号：US06380587B1

    公开(公告)日：2002-04-30

    申请号：US09706527

    申请日：2000-11-03

    申请人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    发明人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    IPC分类号： H01L2976

    CPC分类号： H01L27/1126 ,  H01L27/105 ,  H01L27/11293

    摘要： A semiconductor read-only memory (ROM) and a method of fabricating the same are provided. The ROM device is structured in such a manner that allows the fabrication to include a fewer number of mask processes. This makes it more cost effective and allows a cycle time that is shorter than that of the prior art. Moreover, the particular structure of the ROM device makes punchthrough less likely to occur between any neighboring pairs of the buried bit lines when the ROM device is further scaled down. The ROM device is constructed on a semiconductor substrate which is partitioned into a peripheral region and a cell region. A plurality of STI structures are formed at predefined locations in both the peripheral region and the cell region. Immediately after this, a first ion-implantation process can be performed on the cell region to form a plurality of buried bit lines. Subsequently, the dielectric isolation layers in all of the STI structures in the cell region are removed, leaving a plurality of empty trenches behind. A conformal insulating layer and a conductive layer are then successively formed over the wafer, and the conductive layer is further selectively removed to form a word line in the cell region and a gate in the peripheral region. In the code implantation process, selected channel regions between the buried bit lines are doped with impurities for code implantation of data into the ROM device.

    Semiconductor read-only memory device and method of fabricating the same
    2.
    发明授权
    Semiconductor read-only memory device and method of fabricating the same 有权
    半导体只读存储器件及其制造方法

    公开(公告)号：US06350654B1

    公开(公告)日：2002-02-26

    申请号：US09215618

    申请日：1998-12-17

    申请人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    发明人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

    IPC分类号： H01L21336

    CPC分类号： H01L27/1126 ,  H01L27/105 ,  H01L27/11293

    摘要： A semiconductor read-only memory (ROM) and a method of fabricating the same are provided. The ROM device is structured in such a manner that allows the fabrication to include a fewer number of mask processes. This makes it more cost effective and allows a cycle time that is shorter than that of the prior art. Moreover, the particular structure of the ROM device makes punchthrough less likely to occur between any neighboring pairs of the buried bit lines when the ROM device is further scaled down. The ROM device is constructed on a semiconductor substrate which is partitioned into a peripheral region and a cell region. A plurality of STI structures are formed at predefined locations in both the peripheral region and the cell region. Immediately after this, a first ion-implantation process can be performed on the cell region to form a plurality of buried bit lines. Subsequently, the dielectric isolation layers in all of the STI structures in the cell region are removed, leaving a plurality of empty trenches behind. A conformal insulating layer and a conductive layer are then successively formed over the wafer, and the conductive layer is further selectively removed to form a word line in the cell region and a gate in the peripheral region. In the code implantation process, selected channel regions between the buried bit lines are doped with impurities for code implantation of data into the ROM device.

    摘要翻译： 提供半导体只读存储器（ROM）及其制造方法。 ROM器件以允许制造包括更少数量的掩模处理的方式构造。 这使得它更具成本效益并且允许比现有技术更短的循环时间。 此外，当ROM器件进一步缩小时，ROM器件的特定结构使得在任何相邻的掩埋位线对之间不太可能发生穿透。 ROM器件被构造在被划分成周边区域和单元区域的半导体衬底上。 在周边区域和单元区域中的预定位置处形成多个STI结构。 此后，可以在单元区域上进行第一离子注入工艺以形成多个掩埋位线。 随后，去除单元区域中所有STI结构中的介电隔离层，留下多个空槽。 然后在晶片上连续地形成保形绝缘层和导电层，并且进一步选择性地去除导电层，以在单元区域中形成字线，并在外围区域形成栅极。 在代码注入过程中，掩埋位线之间的选定沟道区域掺杂有用于将数据代码注入到ROM器件中的杂质。

    ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF
    7.
    发明申请
    ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF 有权
    电子载体板及其包装结构

    公开(公告)号：US20100170709A1

    公开(公告)日：2010-07-08

    申请号：US12727307

    申请日：2010-03-19

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

    IPC分类号： H05K1/16 ,  H05K1/00

    CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

    摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

    Electronic carrier board and package structure thereof
    8.
    发明授权
    Electronic carrier board and package structure thereof 有权
    电子载板及其封装结构

    公开(公告)号：US07696623B2

    公开(公告)日：2010-04-13

    申请号：US11643147

    申请日：2006-12-20

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

    摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

    MULTIFUNCTIONAL SUPPORTING FRAME FOR A WEB CAMERA
    9.
    发明申请
    MULTIFUNCTIONAL SUPPORTING FRAME FOR A WEB CAMERA 审中-公开
    网络摄像机的多功能支持框架

    公开(公告)号：US20090103913A1

    公开(公告)日：2009-04-23

    申请号：US11874934

    申请日：2007-10-19

    申请人： Chih-Ming Huang

    发明人： Chih-Ming Huang

    IPC分类号： G03B17/00

    CPC分类号： G03B17/00

    摘要： A multifunctional supporting frame for a web camera, comprises a movable supporting clamping seat having a hollow rectangular receiving chamber; the rectangular receiving chamber being formed by an upper L shape sheet, a middle U shape sheet, and a lower enclosed rectangular sheet; one lateral side of the L shape sheet being extended with a sheet plate; at least one guide post being extended from one surface of the sheet plate; the guide posts being combined with springs so as to be formed as a telescopic structure which is adjustable to have a desire width for clamping an object; and a bendable shaft seat formed by an upper U shape plate and a lower U shape plate which are pivotally engaged. A lens set is installed above the movable supporting clamping seat by using a lens set pin seat.

    摘要翻译： 一种用于网络摄像机的多功能支撑框架，包括具有中空矩形接收室的可移动支撑夹座; 矩形容纳室由上部L形片，中部U形片和下部封闭矩形片形成; L形片的一个侧面用片状板延伸; 至少一个引导柱从所述板的一个表面延伸; 引导柱与弹簧组合，以形成可伸缩结构，其可调节以具有用于夹紧物体的期望宽度; 以及由上U形板和下U形板形成的可枢转地接合的可弯曲的轴座。 通过使用镜头组座座将透镜组安装在可动支撑夹座上方。