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    METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE
    91.
    发明申请
    METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE 有权
    制造散热包装结构的方法

    公开(公告)号：US20110287587A1

    公开(公告)日：2011-11-24

    申请号：US13195617

    申请日：2011-08-01

    申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/52

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401 ,  H01L2224/45099

    摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.

    摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有对应的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。

    Fabrication method of semiconductor package having heat dissipation device
    94.
    发明授权
    Fabrication method of semiconductor package having heat dissipation device 有权
    具有散热装置的半导体封装的制造方法

    公开(公告)号：US07759170B2

    公开(公告)日：2010-07-20

    申请号：US12710450

    申请日：2010-02-23

    申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/00 ,  H01L23/34 ,  H05K7/20

    CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

    摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

    摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分并且从密封剂暴露第一和第二开口。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。

    Semiconductor package having heat dissipating device and fabrication method of the semiconductor package
    97.
    发明申请
    Semiconductor package having heat dissipating device and fabrication method of the semiconductor package 有权
    具有散热装置的半导体封装和半导体封装的制造方法

    公开(公告)号：US20070200228A1

    公开(公告)日：2007-08-30

    申请号：US11647832

    申请日：2006-12-29

    申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

    摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

    摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分，并使第一和第二开口与密封剂暴露。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。

    Semiconductor package with heat sink
    99.
    发明授权
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US07177155B2

    公开(公告)日：2007-02-13

    申请号：US11212290

    申请日：2005-08-26

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    IPC分类号： H05K7/20 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及衬底上的诸如焊球的输入/输出连接的布置 不会导致芯片的裂纹。

    Flip-chip semiconductor device
    100.
    发明申请
    Flip-chip semiconductor device 审中-公开
    倒装芯片半导体器件

    公开(公告)号：US20060249852A1

    公开(公告)日：2006-11-09

    申请号：US11417548

    申请日：2006-05-03

    申请人： Shih-Kuang Chiu ,  Mei-Yi Sung ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Shih-Kuang Chiu ,  Mei-Yi Sung ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/48

    CPC分类号： H01L23/36 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

    摘要： A flip-chip semiconductor device is proposed, including a substrate, a plurality of stiffeners disposed at peripheral areas of the substrate, with a gap formed between each of the adjacent stiffeners; at least a semiconductor chip mounted on an area of the substrate surrounded by the stiffeners via flip-chip technique; and a beat sink attached to the semiconductor chip. By such arrangement, warpage of the semiconductor device may be prevented. As an opening is formed at an appropriate position of the stiffener structure, distortion of the stiffener may be avoided. Further, as the beat sink is not attached to the stiffener, solder bumps may be free from thermal stress due to mismatch in coefficient of thermal expansion between the heat sink and the substrate while preventing delamination of the heat sink caused by thermal stress.

    摘要翻译： 提出了一种倒装芯片半导体器件，包括基板，设置在基板的周边区域的多个加强件，在每个相邻的加强件之间形成间隙; 至少半导体芯片安装在通过倒装芯片技术被加强件包围的基板的区域上; 和连接到半导体芯片的节流槽。 通过这样的布置，可以防止半导体器件的翘曲。 当开口形成在加强结构的适当位置时，可以避免加强件的变形。 此外，由于散热器不附着在加强件上，所以由于散热器和基板之间的热膨胀系数不匹配，焊料凸点可能没有热应力，同时防止热应力引起的散热片分层。