公开(公告)号：US20060146470A1

公开(公告)日：2006-07-06

申请号：US11179809

申请日：2005-07-13

申请人： Jun Shen ,  Cheng Wei

发明人： Jun Shen ,  Cheng Wei

IPC分类号： H01H47/00

CPC分类号： H01H50/005 ,  H01H67/22 ,  H01H2050/007

摘要： Systems and methods for actuating micro-magnetic latching switches in an array of micro-magnetic latching switches are described. The array of switches is defined by Y rows aligned with a first axis and X columns aligned with a second axis. Each switch in the array of switches is capable of being actuated by a coil. In an aspect, a row of coils is moved along the second axis to be positioned adjacent to a selected one of the Y rows of switches. A sufficient driving current is proved to a selected coil in the row of coils to actuate a selected switch in the selected one of the Y rows of switches. In another aspect, a plurality of first axis drive signals and a plurality of second axis drive signals are generated. These signals drive an array of coils, wherein each coil in the array of coils is positioned adjacent to a corresponding switch in the array of switches. Each first axis drive signal is coupled to coils in a corresponding column of coils in the array of coils. Each second axis drive signal is coupled to coils in a corresponding row of coils in the array of coils. In another aspect, a three-dimensional array of switches is actuated by drive signals that drive a three-dimensional array of coils.

公开(公告)号：US07071431B2

公开(公告)日：2006-07-04

申请号：US09799746

申请日：2001-03-06

申请人： Meichun Ruan ,  Jun Shen ,  Charles Wheeler

发明人： Meichun Ruan ,  Jun Shen ,  Charles Wheeler

IPC分类号： H01H59/00

CPC分类号： G02B6/358 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3566 ,  G02B6/3572 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/0841 ,  G02B26/085 ,  H01H50/005 ,  H01H67/22 ,  H01H2050/007

摘要： A switch with an open state and a closed state suitably includes a cantilever having first and second states corresponding to the open and closed states of the switch, respectively. The switch may also include a magnet configured to provide an electromagnetic field that maintains said cantilever in one of the first and second states. Various embodiments may also include an electrode or electrical conductor configured to provide an electric potential or electromagnetic pulse, as appropriate, to switch the cantilever between the first and second states. Various embodiments may be formulated with micromachining technologies, and may be formed on a substrate.

公开(公告)号：US20060114084A1

公开(公告)日：2006-06-01

申请号：US11151663

申请日：2005-06-14

申请人： Meichun Ruan ,  Jun Shen ,  Gordon Tam

发明人： Meichun Ruan ,  Jun Shen ,  Gordon Tam

IPC分类号： H01H51/22

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

公开(公告)号：US20060084252A1

公开(公告)日：2006-04-20

申请号：US11113344

申请日：2005-04-25

申请人： Gordon Tam ,  Jun Shen

发明人： Gordon Tam ,  Jun Shen

IPC分类号： H01L21/20

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

摘要翻译： 描述了以使得至少部分顶部接触层与粘合层重叠的方式图案粘合和顶部接触层的过程，而顶部接触层的另一部分与底部接触部重叠，但是不与 粘附层。 顶部接触层和粘合层之间的重叠有助于将顶部接触层保持在牺牲层上。 因为粘合层和底部接触之间没有重叠，所以不再需要去除粘附层，导致更好的接触和简化制造过程。

公开(公告)号：US20060055491A1

公开(公告)日：2006-03-16

申请号：US11097390

申请日：2005-04-04

申请人： Jun Shen ,  Prasad Godavarti

发明人： Jun Shen ,  Prasad Godavarti

IPC分类号： H01H51/22

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： A method and apparatus for packaging a plurality of micro-magnetic switches is described. A bonded substrate structure includes a first substrate, a second substrate, and a magnetic layer. The first substrate has a plurality of cantilevers formed thereon. The second substrate has a first surface that is bonded to the first substrate. Each cantilever of the plurality of cantilevers on the first substrate is housed in a corresponding space formed between the first substrate and the second substrate. The magnetic layer is formed on a second surface of the first and/or second substrate to induce a magnetization in a magnetic material of each housed cantilever. The bonded substrate structure is singulated to form a plurality of separate micro-magnetic switch packages. Each micro-magnetic switch package of the plurality of micro-magnetic switch packages includes at least one housed cantilever.

公开(公告)号：US20050207379A1

公开(公告)日：2005-09-22

申请号：US11083889

申请日：2005-03-18

申请人： Jun Shen ,  Song Song ,  Pei Sun ,  Jian Zhang

发明人： Jun Shen ,  Song Song ,  Pei Sun ,  Jian Zhang

IPC分类号： H04L12/28 ,  H04L12/58 ,  H04L12/66 ,  H04L12/701 ,  H04W4/12 ,  H04W28/00 ,  H04W40/34 ,  H04W64/00 ,  H04W84/12 ,  H04W88/16 ,  H04Q7/24

CPC分类号： H04L51/00 ,  H04L51/24 ,  H04L51/38

摘要： Methods, systems, gateways and user devices for receiving/sending multimedia message. According to the invention, a multimedia messaging service system comprising a wireless LAN, a multimedia messaging service user device and a multimedia messaging service gateway, the user device communicates with the gateway via the wireless LAN so as to send and receive multimedia messages. Furthermore, the gateway of the invention detect whether the user device is located within the wireless LAN. If yes, then multimedia messages are sent and received via the wireless LAN; and if not, then via conventional telecom network. The invention also discloses a corresponding gateway and a corresponding user device.

摘要翻译： 用于接收/发送多媒体消息的方法，系统，网关和用户设备。 根据本发明，一种包括无线LAN，多媒体消息服务用户装置和多媒体消息服务网关的多媒体消息业务系统，用户设备经由无线LAN与网关进行通信，发送和接收多媒体消息。 此外，本发明的网关检测用户设备是否位于无线LAN内。 如果是，则通过无线LAN发送和接收多媒体消息; 如果没有，那么通过常规电信网络。 本发明还公开了相应的网关和对应的用户设备。

公开(公告)号：US06894592B2

公开(公告)日：2005-05-17

申请号：US10147915

申请日：2002-05-20

申请人： Jun Shen ,  Prasad S. Godavarti ,  John Stafford ,  Gordon Tam

发明人： Jun Shen ,  Prasad S. Godavarti ,  John Stafford ,  Gordon Tam

IPC分类号： H01H50/00 ,  H01H51/22 ,  H01M51/22

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.

摘要翻译： 描述了用于微加工磁性锁定开关的封装以及用于组装封装的方法。 在一个方面，衬底由相对的第一和第二表面限定。 微型开关集成电路（IC）芯片安装在第一表面。 芯片上的接触焊盘与第一表面上的迹线耦合。 永久磁铁定位成紧邻芯片。 盖子连接到第一表面。 盖的内表面形成外壳以将芯片封装在第一表面上。 芯片可以替代地安装到盖的内表面。 该芯片可以以标准或倒装芯片方式定向。 另一方面，可移动的微加工悬臂由衬底的表面支撑。 盖子贴在表面上。 盖的内表面形成在衬底的表面上包围悬臂的外壳。 永磁体与悬臂紧邻。 电磁铁连接到盖的内表面或外表面。

公开(公告)号：US06778046B2

公开(公告)日：2004-08-17

申请号：US10126291

申请日：2002-04-19

申请人： John Stafford ,  Gordon Tam ,  Jun Shen

发明人： John Stafford ,  Gordon Tam ,  Jun Shen

IPC分类号： H01H5122

CPC分类号： B81B7/0077 ,  H01H1/0036 ,  H01H36/0006 ,  H01H50/005 ,  H01H2036/0093 ,  H01H2050/007 ,  H01L23/10 ,  H01L24/97 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/00

摘要： A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

摘要翻译： 形成气密密封的MEMS封装的方法包括以下步骤：在支撑衬底的表面上为MEMS器件提供至少一个接触的支撑GaAs衬底，并在支撑衬底的表面上形成悬臂，定位成电 以一个方向与联系人联系。 金属密封环周围围绕触点和悬臂固定到支撑基板的表面。 在硅芯片中蚀刻空腔以形成帽构件。 金属密封圈固定在腔体周围的帽部件上。 通过在不使用助焊剂的惰性环境中回流位于两个密封环之间的焊料合金，将封装密封。

公开(公告)号：US06750745B1

公开(公告)日：2004-06-15

申请号：US10229227

申请日：2002-08-27

申请人： Chengping Wei ,  Jun Shen ,  Gordon Tam

发明人： Chengping Wei ,  Jun Shen ,  Gordon Tam

IPC分类号： H01H5122

CPC分类号： H01H50/005 ,  H01H2036/0093 ,  H01H2050/007

摘要： Micro magnetic switching apparatus includes a permanent magnet supported on a base and a coil supported by the base so as to define a plurality of sides. A plurality of latching micro magnetic relays each includes a magnetic cantilever positioned to open a first electric circuit in a first orientation and to close the first electric circuit in a second orientation. One each of the relays is mounted adjacent each of the plurality of sides of the coil and adjacent the permanent magnet so as to be latched in one of the first and second orientations when the coil is not activated and to switch to the other of the first and second orientations when the coil is activated and to be latched in the other of the first and second orientations by the permanent magnet.

摘要翻译： 微型磁开关装置包括支撑在基座上的永磁体和由基座支撑以限定多个侧面的线圈。 多个闭锁微型磁继电器各自包括磁悬臂，定位成以第一方向打开第一电路并且以第二取向关闭第一电路。 一个继电器中的每一个被安装在线圈的多个侧面中的每一个周围并且与永磁体相邻，以便当线圈未被激活时被锁定在第一和第二取向中的一个中并且切换到第一 以及当线圈被激活并且被永磁体锁定在第一和第二取向中的另一个中时的第二取向。

公开(公告)号：US5552330A

公开(公告)日：1996-09-03

申请号：US386171

申请日：1995-02-09

申请人： Saied N. Tehrani ,  Herbert Goronkin ,  Jun Shen ,  Xiaodong T. Zhu

发明人： Saied N. Tehrani ,  Herbert Goronkin ,  Jun Shen ,  Xiaodong T. Zhu

IPC分类号： H01L29/68 ,  H01L21/20 ,  H01L21/334 ,  H01L27/06 ,  H01L29/205 ,  H01L29/76 ,  H01L21/265 ,  H01L21/44

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/02395 ,  H01L21/02463 ,  H01L21/02466 ,  H01L21/02546 ,  H01L21/02549 ,  H01L21/02576 ,  H01L27/0605 ,  H01L29/66939 ,  H01L29/7606

摘要： A resonant tunneling FET including a heterostructure FET with a channel layer having a first current contact and a control contact operatively coupled thereto and a resonant tunneling device, including a quantum well layer sandwiched between barrier layers with a resonant tunneling layer affixed to an opposite side of one barrier layer, operably affixed to the heterostructure FET to form a second current contact. The resonant tunneling FET being constructed from a material system which allows the fabrication of additional devices on the same substrate.

摘要翻译： 一种谐振隧穿FET，其包括具有第一电流接触的通道层和可操作地耦合到其上的控制触点的异质结构FET，以及谐振隧穿装置，其包括夹在阻挡层之间的量子阱层，其中谐振隧穿层固定在 一个阻挡层，可操作地固定到异质结构FET以形成第二电流接触。 谐振隧道FET由材料系统构成，其允许在同一衬底上制造附加器件。