公开(公告)号：US08004955B2

公开(公告)日：2011-08-23

申请号：US12251795

申请日：2008-10-15

申请人： Yoshiyuki Tashiro ,  Shuichi Takeuchi

发明人： Yoshiyuki Tashiro ,  Shuichi Takeuchi

IPC分类号： G11B7/00

CPC分类号： G11B7/1378 ,  G11B7/13922 ,  G11B2007/0006

摘要： There is provided a coupling lens used in an optical information recording/reproducing device for recording information to and/or reproducing information from an optical disc. The coupling lens includes a first surface and a second surface, wherein the coupling lens is configured to satisfy a following condition (1): −0.80≦Z≦0.40  (1), wherein a value Z is obtained from a following equation (E1): Z = ⅆ ⅆ n ⁢ ( L ′ ) L ′ = ( A - B ) ( D - E ) - ( F - G ) ( H - I ) . ( E1 )

摘要翻译： 提供了一种用于光信息记录/再现装置中用于向光盘记录信息和/或从光盘再现信息的耦合透镜。 耦合透镜包括第一表面和第二表面，其中耦合透镜被配置为满足以下条件（1）：-0.80＆lt; lE; Z＆nlE; 0.40（1）其中，从以下等式（E1 ）：Z =ⅆⅆn（L'）L'=（A-B）（D-E） - （F-G）（H-I）。 （E1）

公开(公告)号：US07929401B2

公开(公告)日：2011-04-19

申请号：US12508101

申请日：2009-07-23

申请人： Naoki Yamagata ,  Shuichi Takeuchi

发明人： Naoki Yamagata ,  Shuichi Takeuchi

IPC分类号： G11B7/00

CPC分类号： G11B7/1374

摘要： An objective lens used for an optical information recording/reproducing apparatus for an optical disc based on a predetermined standard is made of resin and has a numerical aperture larger than or equal to 0.75. When f (unit: mm) represents a focal length at a wavelength λ (unit: nm), d (unit: mm) represents a thickness, and n represents a refractive index of the objective lens at the wavelength λ, the objective lens satisfies following conditions: 1.00

摘要翻译： 用于基于预定标准的用于光盘的光学信息记录/再现装置的物镜由树脂制成，并且具有大于或等于0.75的数值孔径。 当f（单位：mm）表示波长λ（单位：nm）的焦距时，d（单位：mm）表示厚度，n表示物镜在波长λ的折射率，物镜满足 以下条件：1.00

公开(公告)号：US07889426B2

公开(公告)日：2011-02-15

申请号：US11427521

申请日：2006-06-29

申请人： Shuichi Takeuchi ,  Yutaka Takakubo

发明人： Shuichi Takeuchi ,  Yutaka Takakubo

IPC分类号： G02B5/18

CPC分类号： G02B5/1814 ,  G02B3/08 ,  G02B26/125

摘要： A scanning lens for an imaging optical system converges a beam emitted by a light source and deflected by a deflector on a target surface to form a beam spot scanning in a main scanning direction thereon. The scanning lens includes a plastic lens formed by injection molding, which has a diffractive lens structure on at least one surface thereof. The diffractive lens structure has a plurality of annular zones arranged concentrically about a rotational axis. Each annular zone has a diffracting surface that diffracts the light beam passing therethrough. The diffractive lens structure has stepped surfaces each connecting adjoining diffracting surfaces. In a plane including the rotational axis and parallel with the main scanning direction, the stepped surfaces are inclined with respect to the rotational axis so that stress working between a metallic molding for the plastic lens and each of the stepped surfaces in demolding is reduced.

摘要翻译： 用于成像光学系统的扫描透镜会聚由光源发射并由偏转器偏转在目标表面上的光束，以在其上沿主扫描方向形成光束点扫描。 扫描透镜包括通过注射成型形成的塑料透镜，其在其至少一个表面上具有衍射透镜结构。 衍射透镜结构具有围绕旋转轴线同心布置的多个环形区域。 每个环形区域具有衍射通过其的光束的衍射表面。 衍射透镜结构具有各自连接相邻衍射面的阶梯面。 在包括旋转轴线并与主扫描方向平行的平面中，阶梯面相对于旋转轴线倾斜，使得用于塑料透镜的金属模制件与脱模中的每个台阶表面之间的应力作用减小。

公开(公告)号：US20100328917A1

公开(公告)日：2010-12-30

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi MATSUMURA ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi MATSUMURA ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00 ,  H01L23/498

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。

公开(公告)号：US07687314B2

公开(公告)日：2010-03-30

申请号：US12330302

申请日：2008-12-08

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Yoshiyuki Satoh ,  Tetsuya Takahashi

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Yoshiyuki Satoh ,  Tetsuya Takahashi

IPC分类号： H01L21/50

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/331 ,  H01L2224/33505 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8309 ,  H01L2224/83092 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83204 ,  H01L2224/8349 ,  H01L2224/83862 ,  H01L2224/83986 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/3512

摘要： An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps.

摘要翻译： 一种电子设备制造方法，包括：通过将加热头压靠在电子部件的非安装表面上，将第一粘合剂施加到安装部分，以使得连接焊盘和凸块接触的方式进行第一加热， 加热电子部件，硬化第一粘合剂，固定安装基板和电子部件，在减压下用第二粘合剂填充安装基板和电子部件之间的空间，以及从减小的第二加热步骤 通过将加热头压靠在电子部件的非安装表面上，加热电子部件，以及使第二粘合剂硬化，熔化连接焊盘，并将连接焊盘和凸块 。

公开(公告)号：US07264146B2

公开(公告)日：2007-09-04

申请号：US10995569

申请日：2004-11-24

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Yukio Ozaki

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Yukio Ozaki

IPC分类号： B23K5/20 ,  B23K37/00 ,  B29C65/00 ,  B32B37/00

CPC分类号： H01L24/81 ,  B23K1/06 ,  B23K20/10 ,  B23K20/106 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/00 ,  H01L2924/00014

摘要： An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

摘要翻译： 一种超声波工具，用于通过使用施加到所述材料中的一种材料的超声波的作用将所述材料中的一种材料的表面接合到所述另一种材料的表面而将两种材料彼此粘合， 所述超声波工具具有包含氧化铬作为主要成分的涂层，所述涂层形成在所述工具的至少与所述材料的表面接触的表面上，所述材料通过所述材料的表面施加到所述材料之一。 还公开了一种设置有超声波工具的超声波焊接机。

公开(公告)号：US06980344B2

公开(公告)日：2005-12-27

申请号：US10600697

申请日：2003-06-23

申请人： Shuichi Takeuchi

发明人： Shuichi Takeuchi

IPC分类号： B41J2/44 ,  G02B13/00 ,  G02B13/18 ,  G02B26/10 ,  G02B26/12 ,  G02B26/08

CPC分类号： G02B26/127

摘要： A scanning optical system includes a deflector that deflects a light beam toward an object surface such that the light beam is scanned over the object surface in a main scanning direction. A mirror system reflects back the light beam so that the light beam travels toward the object surface after being deflected twice by the deflector. The mirror system reflects back the light beam such that a projection of the light beam on an auxiliary scanning section, which is a plane perpendicular to the main scanning direction, is incident on the reflection surface for a first time at an incident angle different from an incident angle at which the projection of the light beam is incident on the reflection surface for a second time. A blocking member is provided to prevent the unwanted light flux from striking the object surface while allowing the light beam scanning the object surface.

摘要翻译： 扫描光学系统包括偏转器，偏转器将光束朝向物体表面偏转，使得光束在主扫描方向上在物体表面上扫描。 反射镜系统反射光束，使得光束在被偏转器偏转两次之后朝向物体表面传播。 反射镜系统反射光束，使得光束在与主扫描方向垂直的平面上的辅助扫描部分的投影以不同于入射角的入射角第一次入射在反射面上 光束投影第二次入射到反射面上的入射角度。 提供阻挡构件以防止不想要的光束撞击物体表面，同时允许光束扫描物体表面。

公开(公告)号：US20050205641A1

公开(公告)日：2005-09-22

申请号：US10995569

申请日：2004-11-24

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Yukio Ozaki

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Yukio Ozaki

IPC分类号： B23K1/06 ,  B23K20/10 ,  H01L21/60 ,  H01L21/607

CPC分类号： H01L24/81 ,  B23K1/06 ,  B23K20/10 ,  B23K20/106 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/00 ,  H01L2924/00014

摘要： An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

摘要翻译： 一种超声波工具，用于通过使用施加到所述材料中的一种材料的超声波的作用将所述材料中的一种材料的表面接合到所述另一种材料的表面而将两种材料彼此粘合， 所述超声波工具具有包含氧化铬作为主要成分的涂层，所述涂层形成在所述工具的至少与所述材料的表面接触的表面上，所述材料通过所述材料的表面施加到所述材料之一。 还公开了一种设置有超声波工具的超声波焊接机。

公开(公告)号：US06898025B2

公开(公告)日：2005-05-24

申请号：US10452236

申请日：2003-06-03

申请人： Shuichi Takeuchi ,  Yutaka Takakubo

发明人： Shuichi Takeuchi ,  Yutaka Takakubo

IPC分类号： G02B13/14 ,  G03F7/20 ,  G02B17/00

CPC分类号： G03F7/70225 ,  G02B13/143 ,  G03F7/70241

摘要： A projection optical system, which is telecentric with respect to an object side and an image side, projects a pattern onto an image plane, which is substantially parallel with the pattern, at a substantial equi-magnification. The projecting optical system is provided with first and second condenser lenses having a common (first) optical axis which is perpendicular to the pattern and the image plane. The projection optical system further includes an imaging lens having a second optical axis that intersects with the first optical axis at an intermediate position between the first and second condenser lenses. A first mirror reflects a beam from the pattern and passed through the first condenser lens toward the imaging lens. A second mirror reflects the beam passed through the imaging lens to the imaging lens, and a third mirror reflects the beam passed through the imaging lens toward the second condenser lens.

摘要翻译： 相对于物体侧和图像侧是远心的投影光学系统以基本上等倍的方式将图案投影到基本上与图案平行的图像平面上。 投影光学系统设置有具有垂直于图案和图像平面的公共（第一）光轴的第一和第二聚光透镜。 投影光学系统还包括具有在第一和第二聚光透镜之间的中间位置处与第一光轴相交的第二光轴的成像透镜。 第一反射镜反射来自图案的光束并且经过第一聚光透镜朝向成像透镜。 第二反射镜将通过成像透镜的光束反射到成像透镜，并且第三反射镜将通过成像透镜的光束反射到第二聚光透镜。

公开(公告)号：US06873475B2

公开(公告)日：2005-03-29

申请号：US10790737

申请日：2004-03-03

申请人： Shuichi Takeuchi

发明人： Shuichi Takeuchi

IPC分类号： G02B13/00 ,  G02B3/02 ,  G02B13/18 ,  G11B7/00 ,  G11B7/135

CPC分类号： G11B7/1378 ,  G11B7/1353 ,  G11B7/1374 ,  G11B2007/0006

摘要： An objective lens for a plurality of types of optical discs is provided with a diffracting structure on at least one surface thereof. The surface includes an inner area including the optical axis and an outer area. The outer area includes at least one special annular zone. Part of a first beam (having a first wavelength for a first optical disc of lower data density) passed through the zone will be substantially in antiphase with part of the first beam passed through the inner area. The convergence angle θ of part of the first beam incident on the outermost part of the inner area measured after emerging from the objective lens and a design numerical aperture NAref of the first optical disc satisfy: 1.0

摘要翻译： 用于多种类型的光盘的物镜在其至少一个表面上设置有衍射结构。 表面包括包括光轴和外部区域的内部区域。 外部区域包括至少一个特殊的环形区域。 穿过该区域的第一光束（具有较低数据密度的第一光盘的第一波长）的部分将基本上与第一光束的一部分通过内部区域反相。 入射到从物镜出射后测量的内部区域的最外部分的第一光束的部分的会聚角θ和第一光盘的设计数值孔径NAref满足：第一光束的物镜的有效NA 基本上等于设计数值孔径NAref。