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    Method of flip-chip bonding
    6.
    发明申请
    Method of flip-chip bonding 审中-公开
    倒装芯片接合方法

    公开(公告)号：US20060097029A1

    公开(公告)日：2006-05-11

    申请号：US11062959

    申请日：2005-02-23

    申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

    发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

    IPC分类号： B23K1/06

    CPC分类号： B23K20/10 ,  B23K1/0016 ,  B23K2101/40

    摘要： A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration. The method includes an aligning step 2 that aligns and places in contact bumps or pads of a semiconductor chip and pads or bumps of a substrate, a leveling step 4 that levels the shapes of the bumps by pressing together the semiconductor chip and the substrate with a first predetermined load, a bonding preparation step 6 that applies ultrasonic vibration to the semiconductor chip and/or the substrate so that the amplitude of the ultrasonic vibration gradually increases while the first predetermined load weakens, and a bonding step 8 that bonds the bumps and pads by applying ultrasonic vibration to the semiconductor chip and/or the substrate in a state where the semiconductor chip and the substrate are pressed together with a second predetermined load that is smaller than the first predetermined load.

    摘要翻译： 倒装芯片接合的方法可以有利地激活接合表面并且在接合半导体芯片和基板的焊盘和凸点时去除氧化膜，并且避免诸如凸块过度平坦的问题，并且连接端子之间的接合被随后的超声波破坏 振动。 该方法包括：对准步骤2，其对准和放置在半导体芯片的接触凸块或焊盘以及衬底的焊盘或凸块;调平步骤4，其通过将半导体芯片和衬底压在一起来调整凸块的形状 第一预定负载，对半导体芯片和/或基板施加超声波振动的接合准备步骤6，使得当第一预定负载变弱时超声波振动的幅度逐渐增加;以及接合步骤8，其将凸块和焊盘 通过在半导体芯片和基板以比第一预定负载小的第二预定负载被压在一起的状态下，向半导体芯片和/或基板施加超声波振动。

    Substrate processing apparatus and method of manufacturing semiconductor device
    7.
    发明授权
    Substrate processing apparatus and method of manufacturing semiconductor device 有权
    基板处理装置及半导体装置的制造方法

    公开(公告)号：US09437465B2

    公开(公告)日：2016-09-06

    申请号：US12631152

    申请日：2009-12-04

    申请人： Satoru Takahata ,  Yukio Ozaki ,  Reizo Nunozawa

    发明人： Satoru Takahata ,  Yukio Ozaki ,  Reizo Nunozawa

    IPC分类号： H01L21/203 ,  H01L21/67 ,  C23C16/52 ,  C23C16/54 ,  G05B19/4063 ,  G05B19/418

    CPC分类号： H01L21/67276 ,  C23C16/52 ,  C23C16/54 ,  G05B19/4063 ,  G05B19/41875 ,  G05B2219/31437 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/22

    摘要： When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate; a control unit configured to control the process system for performing a plurality of steps; and a manipulation unit configured to monitor a progress of each of the plurality of steps, wherein when a time elapsed after the control unit goes into a hold state exceeds an allowable time previously allocated to the one of the plurality of steps while waiting for a completion of the one of the plurality of steps started by the process system, the control unit transmits an alarm message to the manipulation unit so as to inform the manipulation unit that the allowable time is exceeded, terminates the hold state, and performs a recovery action.

    摘要翻译： 当一个步骤被延迟时，可以迅速地通知操作者延迟。 衬底处理设备包括被配置为处理衬底的工艺系统; 控制单元，被配置为控制所述处理系统以执行多个步骤; 以及操作单元，被配置为监视所述多个步骤中的每一个的进度，其中当所述控制单元进入保持状态之后经过的时间超过预先分配给所述多个步骤中的所述一个步骤的允许时间，同时等待完成 在由处理系统启动的多个步骤中的一个步骤中，控制单元向操作单元发送报警消息，以通知操作单元超过允许时间，终止保持状态，并执行恢复动作。

    Game machine
    10.
    发明授权
    Game machine 有权
    游戏机

    公开(公告)号：US06254479B1

    公开(公告)日：2001-07-03

    申请号：US09233645

    申请日：1999-01-19

    申请人： Genichiro Okitani ,  Ryosuke Toriyama ,  Takaaki Ishii ,  Yukari Shibata ,  Yukio Ozaki

    发明人： Genichiro Okitani ,  Ryosuke Toriyama ,  Takaaki Ishii ,  Yukari Shibata ,  Yukio Ozaki

    IPC分类号： A63F1300

    CPC分类号： G07F17/34 ,  G07F17/3244

    摘要： In a game machine which comprises a roulette part for rotating an indicating mark along an outside of a play field, the indicating mark is stopped in accordance with a signal from a stop switch. If the indicating mark is stopped in a center position of a prize area which is indicated with a chance gage, a payment of medals as a reward is allowed. If the indicating mark is stopped in a position which is included in the prize area but don't coincide with the center position, a process of a lottery with a random number is carried out and a gage volume of a level gage is changed in the basis of the random number. An additional chance of a payment of medals is given corresponding to a position in which the indicating mark is stopped.

    摘要翻译： 在包括用于沿着游戏场的外部旋转指示标记的轮盘部分的游戏机中，根据来自停止开关的信号停止指示标记。 如果指示标记被停止在用机会表示的奖励区域的中心位置，则允许奖励作为奖励的支付。 如果指示标记被停止在包括在奖励区域中但与中心位置不一致的位置，则执行具有随机数的彩票的处理，并且在 随机数的基础。 对应于指示标记停止的位置，给予额外奖金的机会。