摘要:
In one exemplary embodiment, a method includes: providing a semiconductor device having a substrate, a nanowire, a first structure and a second structure, where the nanowire is suspended between the first structure and the second structure, where the first structure and the second structure overly the substrate; and performing atomic layer deposition to deposit a film on at least a portion of the semiconductor device, where performing atomic layer deposition to deposit the film includes performing atomic layer deposition to deposit the film on at least a surface of the nanowire.
摘要:
A battery connector includes an insulative housing and a plurality of terminals retained in the housing. The housing defines a mating surface, a rear surface opposite to the mating surface and a plurality of passageways penetrating through the mating surface and the rear surface along a front-to-back direction. At least one pair of first grooves is formed in opposite inner sidewalls of each passageway and running through the rear surface. A pair of slits communicates and is staggered with the corresponding first grooves along a vertical direction perpendicular to the front-to-back direction. Each terminal includes a retention portion with at least one pair of barbs defined at two sides thereof. The retention portions pass through the first grooves along the front-to-back direction and are pressed along the vertical direction so as to retain the barbs in the corresponding slits.
摘要:
An electrical connector assembly includes a male connector and a female connector. The male connector includes a body having a male mating face, a first abutment face and a first mounting face and a number of first contacts each of which has a first male engaging section, a first median portion, and the first tail portion. A female connector includes a body having a female mating face, a second abutment face, and a second mounting face and a number of second contacts each of which has a first female engaging section, and a second male engaging section. A protective cover disposed on a top region between the female connector and the male connector has a projection, which abuts against the first median section of at least one of the first contact.
摘要:
An electrical adaptor includes a first connector body loaded with first terminals and a second connector body loaded with second terminals. The two connector bodies assembly attaches with each other and each defines a mating port opposite to each other. At least partial of the first terminals each includes a contacting strip in the mating port of the first connector body and a touching portion. Each second terminal includes a contacting portion in the mating port of the second connector body and a touching portion. Each touching portion of the first terminals contacts with touching portions of two or more said second terminals.
摘要:
Disclosed are a field effect transistor structure and a method of forming the structure. A gate stack is formed on the wafer above a designated channel region. Spacer material is deposited and anisotropically etched until just prior to exposing any horizontal surfaces of the wafer or gate stack, thereby leaving relatively thin horizontal portions of spacer material on the wafer surface and relatively thick vertical portions of spacer material on the gate sidewalls. The remaining spacer material is selectively and isotropically etched just until the horizontal portions of spacer material are completely removed, thereby leaving only the vertical portions of the spacer material on the gate sidewalls. This selective isotropic etch removes the horizontal portions of spacer material without damaging the wafer surface. Raised epitaxial source/drain regions can be formed on the undamaged wafer surface adjacent to the gate sidewall spacers in order to tailor source/drain resistance values.
摘要:
A dual-stage switching system for lithographic machine includes a wafer stage to be operated in an exposure station and another wafer stage to be operated in a pre-processing station. The two wafer stages are provided on a base, with four 2-DOF driving units capable of moving along X direction and Y direction being provided along the edge of the base, and the wafer stages being disposed in a space surrounded by the four 2-DOF driving units and suspended on an upper surface of the base by air bearings. Each of the 2-DOF driving units includes upper and lower linear guides and a guiding sleeve, with the upper and lower linear guides being installed vertical to each other in their corresponding guiding sleeve. Two adjacent 2-DOF driving units cooperatively drive the wafer stage) to move in the X direction and Y direction.
摘要:
A phase change memory control ring lower electrode is disclosed. The lower electrode includes an outer ring electrode in thermal contact with a phase change memory element, an inner seed layer disposed within the outer ring electrode and in contact with the phase change memory element, and an electrically conductive bottom layer coupled to the outer ring electrode.
摘要:
An electrical connector (1) comprises a dielectric housing (2) and a plurality of conductive contacts (3). The dielectric housing (2) comprises a plurality of contact passages (20) having retaining means (206) therein. Each conductive contact (3) comprises a retaining portion (30) engaging corresponding the contact passage (20) and a resiliently depressible contacting portion (34). When inserting, the conductive contact (3) is respectively inserted in the contact passages (20) along an inserting direction while the retaining portion (30) along a first path, the contacting portion (34) along a second path, but the retaining means (206) is not on the first path and second path and engages the inserted conductive contact (2).
摘要:
According to one exemplary embodiment, a switching module includes a first harmonic phase tuning filter coupled to a first input of an RF switch. The first harmonic phase tuning filter is configured to provide an output impedance that substantially matches an input impedance of the RF switch at approximately a fundamental frequency and to provide a high impedance at approximately a harmonic frequency generated by the RF switch. The first harmonic phase tuning filter includes an LC circuit coupled between input and output terminals of the first harmonic phase tuning filter and tuned to provide the high impedance at approximately the harmonic frequency generated by the RF switch. The RF switching module further includes a second harmonic phase tuning filter coupled to a second input of the RF switch. The first and second harmonic phase tuning filters can be fabricated on a single semiconductor die.
摘要:
This invention discloses a scanning mechanism of an ion implanter. The mechanism is a PR-PRR type parallel mechanism with two subchains and two DOFs, driving the wafer holder to scan when the first subchain and the second subchain are translated in the same direction at the same speed and adjusting the rotational angle of the wafer holder when the first moving link (30) and the second moving link (32) in the first subchain and the second subchain have different translation amounts in the same direction or opposite directions. The driving motor for the scanning mechanism is provided outside the implant chamber. The invention also solves problems like low rigidity and large accumulation errors of existing serial scanning mechanisms and the effect of the electromagnetic field of the motor within the ion implant chamber on the trajectory of the ion beam.