公开(公告)号：US20240361859A1

公开(公告)日：2024-10-31

申请号：US18767302

申请日：2024-07-09

Applicant: InnoLux Corporation

Inventor： Kuan-Feng LEE ,  Yuan-Lin WU ,  Yu-Hsien WU

IPC: G06F3/041 ,  G06F3/044 ,  H01L25/075 ,  H05K1/18 ,  H10K59/40

CPC classification number: G06F3/0416 ,  G06F3/0412 ,  G06F3/044 ,  H01L25/075 ,  H05K1/189 ,  H10K59/40

Abstract: An electronic device is provided. The electronic device includes a substrate, a metal layer, a plurality of diodes, a first transistor, and a second transistor. The metal layer is overlapped with the substrate and includes a plurality of holes. The diodes are disposed on the substrate. The first transistor and the second transistor are disposed on the substrate and electrically connected to one of the diodes, the gate electrodes of the first transistor and the second transistor overlap a same semiconductor, and the one of the diodes overlaps the first transistor and doesn't overlap the second transistor.

公开(公告)号：US20240349537A1

公开(公告)日：2024-10-17

申请号：US18756149

申请日：2024-06-27

Applicant: InnoLux Corporation

Inventor： Kuan-Feng LEE

IPC: H10K59/121 ,  H01L27/12 ,  H01L29/786 ,  H10K59/131 ,  H10K59/40

CPC classification number: H10K59/1213 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1251 ,  H10K59/131 ,  H01L27/1255 ,  H01L29/78675 ,  H01L29/7869 ,  H01L2224/16225 ,  H10K59/40

Abstract: An array substrate structure is provided, which includes a substrate with a first surface and a second surface opposite to the first surface. A first TFT is on the first surface of the substrate, and a second TFT is on the second surface of the substrate. A through via passes through the substrate, and the first TFT is electrically connected to the second TFT through the through via.

公开(公告)号：US20240234395A9

公开(公告)日：2024-07-11

申请号：US18369837

申请日：2023-09-18

Applicant: InnoLux Corporation

Inventor： Jia-Yuan CHEN ,  Yu-Chia HUANG ,  Tsung-Han TSAI ,  Kuan-Feng LEE

IPC: H01L25/16 ,  G02F1/13357 ,  G02F1/136 ,  G02F1/1368 ,  G02F1/157 ,  G02F1/163 ,  G02F1/16766 ,  G02F1/1677

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/13613 ,  G02F1/13685 ,  G02F1/157 ,  G02F1/163 ,  G02F1/16766 ,  G02F1/1677 ,  H01L24/08

Abstract: A display device includes a substrate, at least one light emitting unit bound on the substrate, a transparency controllable unit disposed on the substrate, and an integrated circuit unit overlapped with the substrate. The integrated circuit unit includes a semiconducting structure and a conductive structure overlapped with the semiconducting structure. The integrated circuit unit is electrically connected to the at least one light emitting unit and the transparency controllable unit.

公开(公告)号：US20240221679A1

公开(公告)日：2024-07-04

申请号：US18442199

申请日：2024-02-15

Applicant: InnoLux Corporation

Inventor： Kuan-Feng LEE ,  Yuan-Lin WU

IPC: G09G3/3266 ,  G06F3/041 ,  G06F3/044 ,  H01L23/544 ,  H01L27/12

CPC classification number: G09G3/3266 ,  G06F3/0412 ,  G06F3/04164 ,  G06F3/044 ,  H01L23/544 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1251 ,  G09G2310/0297 ,  H01L2223/54426

Abstract: An electronic device includes an insulating layer, a first conductive portion, a second conductive portion, a connective portion, a processing unit and an electronic element. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer. The connective portion is at least partially disposed in the insulating layer. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion. The thickness of the processing unit is greater than the thickness of the first conductive portion.

公开(公告)号：US20240176446A1

公开(公告)日：2024-05-30

申请号：US18382532

申请日：2023-10-23

Applicant: InnoLux Corporation

Inventor： Yuan-Lin WU ,  Kuan-Feng LEE

IPC: G06F3/041 ,  G06F3/044 ,  H10K59/40 ,  H10K77/10

CPC classification number: G06F3/041662 ,  G06F3/0412 ,  G06F3/041661 ,  G06F3/044 ,  H10K59/40 ,  H10K77/111 ,  H10K2102/311

Abstract: The present disclosure provides an electronic device including a substrate, a circuit layer, an organic structure, and a sensing structure. The circuit layer is disposed on the substrate, and the circuit layer includes a switch. The organic structure is disposed on the substrate, and in a top view of the electronic device, the organic structure is adjacent to an edge of the substrate. The sensing structure is disposed on the circuit layer, and the sensing structure includes a sensing unit and a wire electrically connected to the sensing unit. The wire crosses over the organic structure and is electrically connected to the switch.

公开(公告)号：US20240120451A1

公开(公告)日：2024-04-11

申请号：US18544727

申请日：2023-12-19

Applicant: InnoLux Corporation

Inventor： Jia-Yuan CHEN ,  Tsung-Han TSAI ,  Kuan-Feng LEE ,  Yuan-Lin WU

IPC: H01L33/58 ,  H01L25/075 ,  H01L27/15 ,  H01L31/14 ,  H01L31/16 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/14 ,  H01L31/16 ,  H01L33/0012 ,  H01L33/005 ,  H01L33/0093 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

Abstract: An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.

公开(公告)号：US20240120326A1

公开(公告)日：2024-04-11

申请号：US18244311

申请日：2023-09-11

Applicant: InnoLux Corporation

Inventor： Yuan-Lin WU ,  Chandra LIUS ,  Tsung-Han TSAI ,  Kuan-Feng LEE

IPC: H01L25/16 ,  H10K39/00 ,  H10K59/60 ,  H10K77/10

CPC classification number: H01L25/167 ,  H10K39/601 ,  H10K59/60 ,  H10K77/111 ,  A61B5/0059

Abstract: Disclosed is a bio sensing device including a medium layer, a light emitting element and an optical sensor. The light emitting element is configured to emit a light toward a user's skin layer, in which the light passes through the medium layer and has a maximum intensity in a first wavelength. The optical sensor is configured to receive a reflected part of the light from the user's skin layer, in which the reflected part of the light passes through the medium layer, and the medium layer has a first transmittance greater than 60% with respect to the first wavelength.

公开(公告)号：US20240014116A1

公开(公告)日：2024-01-11

申请号：US17955557

申请日：2022-09-29

Applicant: InnoLux Corporation

Inventor： Chia-Lin YANG ,  Sheng-Nan CHEN ,  Kuang-Ming FAN ,  Kuan-Feng LEE ,  Jui-Jen YUEH ,  Chin-Ming HUANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/367

CPC classification number: H01L23/49838 ,  H01L24/08 ,  H01L24/09 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/3677 ,  H01L2224/0801 ,  H01L2224/08225 ,  H01L2224/0903 ,  H01L2924/30101

Abstract: An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.

公开(公告)号：US20230359097A1

公开(公告)日：2023-11-09

申请号：US18216182

申请日：2023-06-29

Applicant: InnoLux Corporation

Inventor： Chandra LIUS ,  Kuan-Feng LEE ,  Nai-Fang HSU

IPC: G02F1/1368 ,  G02F1/1345 ,  G02F1/1362 ,  H01L27/12

CPC classification number: G02F1/1368 ,  G02F1/13454 ,  G02F1/136209 ,  G02F1/13624 ,  H01L27/1225 ,  H01L27/1237 ,  H01L27/1251 ,  G02F1/13685 ,  G02F2202/104 ,  H01L29/78675

Abstract: A substrate assembly includes: a substrate; a first transistor disposed on the substrate, wherein the first transistor includes a first semiconductor layer and the first semiconductor layer is a silicon semiconductor layer; and a second transistor disposed on the substrate, wherein the second transistor includes a second semiconductor layer and a drain electrode electrically connected to the second semiconductor layer, and the second semiconductor layer is an oxide semiconductor layer, wherein the first semiconductor layer of the first transistor is electrically insulated from the drain electrode of the second transistor.

公开(公告)号：US20230292578A1

公开(公告)日：2023-09-14

申请号：US18106490

申请日：2023-02-07

Applicant: InnoLux Corporation

Inventor： Chandra LIUS ,  Kuan-Feng LEE

IPC: H10K59/80 ,  G02B3/00 ,  G06V40/13

CPC classification number: H10K59/879 ,  G02B3/0012 ,  G06V40/1318 ,  H10K59/12

Abstract: The present disclosure provides a display device including a display panel and a lens layer. The display panel has a normal region and a camera region, in which the normal region includes a plurality of first light emitting units, and the camera region includes a plurality of second light emitting units. The lens layer is disposed on the normal region and the camera region, and the lens layer includes a plurality of first lenses overlapped with the first light emitting units and a plurality of second lenses overlapped with the second light emitting units. A density of the first lenses in the normal region is greater than a density of the second lenses in the camera region.