公开(公告)号：US20080011508A1

公开(公告)日：2008-01-17

申请号：US11898554

申请日：2007-09-13

申请人： Masahiro Sunohara ,  Kei Murayama ,  Hiroyuki Kato ,  Syoji Watanabe

发明人： Masahiro Sunohara ,  Kei Murayama ,  Hiroyuki Kato ,  Syoji Watanabe

IPC分类号： H05K1/16 ,  H05K3/20

CPC分类号： H01L25/0657 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/185 ,  Y10T29/49128 ,  H01L2924/00

摘要： An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess portion of the core substrate such that a connection pad of the electronic parts is directed upward, and also, such a structure may be employed that the electronic parts is embedded in a resin layer of a core substrate having a structure that the resin layer is formed on the prepreg insulating layer.

摘要翻译： 本发明的电子零件包装结构包括具有这样的结构的芯基板，该芯基板通过在树脂层上形成具有开口部分的预浸料绝缘层而形成凹部，以及安装在该底板上的电子部件 芯基板的凹部，使得电子部件的连接垫朝向上方，并且也可以采用这样的结构，即将电子部件嵌入到具有树脂层的结构的芯基板的树脂层中 形成在预浸料绝缘层上。

公开(公告)号：US20070257371A1

公开(公告)日：2007-11-08

申请号：US11822462

申请日：2007-07-06

申请人： Shigetoshi Wakayama ,  Mutsuaki Kai ,  Hiroyuki Kato ,  Masato Suga

发明人： Shigetoshi Wakayama ,  Mutsuaki Kai ,  Hiroyuki Kato ,  Masato Suga

IPC分类号： H01L23/52

CPC分类号： H01L23/564 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multilayer interconnection structure of a semiconductor device includes a first guard ring extending continuously along a periphery of a substrate and a second guard ring extending continuously in the multilayer interconnection structure along the periphery so as to be encircled by the first guard ring and so as to encircle an interconnection pattern inside the multilayer interconnection structure, wherein the first and second guard rings are connected with each other mechanically and continuously by a bridging conductor pattern extending continuously in a band form along a region including the first and second guard rings when viewed in the direction perpendicular to the substrate.

公开(公告)号：US07288208B2

公开(公告)日：2007-10-30

申请号：US11392863

申请日：2006-03-29

申请人： Michihiro Sano ,  Hiroyuki Kato

发明人： Michihiro Sano ,  Hiroyuki Kato

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC分类号： C30B29/16 ,  C30B7/00 ,  C30B33/00

摘要： Li impurities are removed from a substrate of ZnO formed by a hydrothermal synthesis method. The surface layer of the substrate with Li impurities removed, is etched to planarize the substrate.

摘要翻译： 从通过水热合成法形成的ZnO衬底中除去Li杂质。 去除了Li杂质的衬底的表面层被蚀刻以使衬底平坦化。

公开(公告)号：US20070186998A1

公开(公告)日：2007-08-16

申请号：US11703165

申请日：2007-02-07

申请人： Hiroyuki Kato ,  Takayuki Miyatake ,  Takayoshi Miyazaki ,  Kyoji Zaitsu

发明人： Hiroyuki Kato ,  Takayuki Miyatake ,  Takayoshi Miyazaki ,  Kyoji Zaitsu

IPC分类号： H01L39/24

CPC分类号： H01L39/2409 ,  Y10S420/901 ,  Y10S505/887 ,  Y10T29/49014 ,  Y10T428/12819

摘要： A precursor for manufacturing a Nb3Sn superconducting wire according to the present invention includes a mono-element wire including a Sn or Sn-based alloy core disposed at the, a Cu or Cu-based alloy matrix and a plurality of Nb or Nb-based alloy filaments surrounding the Sn or Sn-based alloy core, and a diffusion barrier layer and a stabilizing copper layer surrounding the Cu or Cu-based alloy matrix. In a final shape after a reduction process, the average diameter of the Nb or Nb-based alloy filaments is set to 5 μm to 30 μm, and the average distance between the Sn or Sn-based alloy core and the Nb or Nb-based alloy filaments nearest the Sn or Sn-based alloy core is set to 100 μm or less.

摘要翻译： 根据本发明的用于制造Nb 3 Sn超导线的前体包括一个单元线，其包括设置在Cu或Cu基合金基体上的Sn或Sn基合金芯， 围绕Sn或Sn基合金芯的多个Nb或Nb基合金丝，以及包围Cu或Cu基合金基体的扩散阻挡层和稳定的铜层。 在还原处理后的最终形状中，Nb或Nb系合金丝的平均直径为5μm〜30μm，Sn或Sn系合金芯与Nb或Nb基合金的平均距离 最接近Sn或Sn基合金芯的合金丝被设定为100μm以下。

公开(公告)号：US20070175543A1

公开(公告)日：2007-08-02

申请号：US11596470

申请日：2005-05-17

申请人： Takayoshi Miyazaki ,  Hiroyuki Kato ,  Kyoji Zaitsu ,  Kyoji Tachikawa

发明人： Takayoshi Miyazaki ,  Hiroyuki Kato ,  Kyoji Zaitsu ,  Kyoji Tachikawa

IPC分类号： H01L39/24

CPC分类号： B22F5/12 ,  B22F7/04 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/0491 ,  H01L39/2409 ,  Y10T29/49014 ,  B22F9/22 ,  B22F1/0085 ,  B22F1/0003 ,  B22F3/04 ,  B22F3/1208 ,  B22F3/24 ,  B22F9/082

摘要： Disclosed is a manufacturing method of an Nb3Sn superconductive wire using a powder technique, the method including the steps of: filling, as a raw powder, an intermetallic compound powder obtained from a metallic powder containing at least one metallic powder selected from Ta powder and Nb powder, and Sn powder, or a mixture of the metallic powder and the Sn powder into a sheath made of Nb or an Nb based alloy; performing a diameter-reduction process on the sheath to form a wire; heat treating the wire; and, forming a superconductive layer on the interface between the sheath and the powder, wherein at least one of the metallic powders selected from the Ta powder and the Nb powder is obtained by aggregating fine particles (primary) in shape of coral to form secondary particles.

摘要翻译： 公开了使用粉末技术的Nb 3 Sn超导线的制造方法，该方法包括以下步骤：从至少包含至少含有金属粉末的金属粉末获得的金属间化合物粉末作为原料粉末 选自Ta粉末和Nb粉末的一种金属粉末，Sn粉末，或者将金属粉末和Sn粉末的混合物制成由Nb或Nb基合金制成的护套; 在护套上进行直径减小过程以形成线; 热处理电线; 并且在护套和粉末之间的界面上形成超导层，其中通过将珊瑚形状的细颗粒（初级）聚集以形成二次颗粒，获得选自Ta粉末和Nb粉末中的至少一种金属粉末 。

公开(公告)号：US07207759B2

公开(公告)日：2007-04-24

申请号：US11013383

申请日：2004-12-17

申请人： Hiroyuki Kato

发明人： Hiroyuki Kato

IPC分类号： F16B13/06 ,  F16B19/00

CPC分类号： F16B19/1081 ,  Y10S411/913

摘要： A fastener comprises a pin and a bushing having a hollow shank that is inserted into holes in a plurality of members being attached. A pin shank is inserted into the bushing shank to effect a widened-diameter coupling condition in which the diameter of the bushing shank is widened, and the members being attached are coupled between the diameter-widened bushing shank and a bushing flange. On the bushing shank are pawls for maintaining a non-widened-diameter coupling condition in which the pin and the bushing are coupled with the pin shank partially inserted into the bushing shank, and the diameter of the bushing shank is not widened. On the pin shank there is a groove for engaging the pawls, which normally extend out beyond the diameter of the attachment holes, but can bend inward. The groove has a depth that will accept the pawls when they are bent inward.

摘要翻译： 紧固件包括销和具有中空柄的衬套，所述中空柄被插入到附接的多个构件中的孔中。 销柄被插入衬套柄中以实现加宽直径的联接状态，其中衬套柄的直径加宽，并且附接的构件联接在直径加宽的衬套柄和衬套凸缘之间。 衬套柄是用于保持非加宽直径的联接状态的棘爪，其中销和衬套与部分插入衬套柄中的销柄联接，并且衬套柄的直径没有变宽。 在销柄上有一个用于接合棘爪的槽，通常伸出超过连接孔的直径，但是可以向内弯曲。 凹槽具有在向内弯曲时接受爪的深度。

公开(公告)号：US20060279783A1

公开(公告)日：2006-12-14

申请号：US11147454

申请日：2005-06-08

申请人： Hiroyuki Kato

发明人： Hiroyuki Kato

IPC分类号： G06K15/00

CPC分类号： G06K15/02 ,  G03G15/50 ,  G03G15/6541 ,  G03G15/6582 ,  G06K15/1822

摘要： An apparatus and method for determining finishing parameters for a document having one or more pages includes performing a layout analysis that determines a location and type of at least one object for each page of the document. At least one rule is applied to results of the layout analysis, and at least one available finishing parameter is determined for the document based on applying the at least one rule to the results of the layout analysis.

摘要翻译： 一种用于确定具有一个或多个页面的文档的整理参数的装置和方法包括执行布局分析，该布局分析确定文档的每一页的至少一个对象的位置和类型。 至少一个规则被应用于布局分析的结果，并且基于将至少一个规则应用于布局分析的结果，为文档确定至少一个可用的修整参数。

公开(公告)号：US07141932B2

公开(公告)日：2006-11-28

申请号：US10394017

申请日：2003-03-24

申请人： Makoto Deguchi ,  Hiromichi Kawashima ,  Kozo Uemura ,  Hiroyuki Kato ,  Nobuhiro Tamura ,  Seiko Kawashima

发明人： Makoto Deguchi ,  Hiromichi Kawashima ,  Kozo Uemura ,  Hiroyuki Kato ,  Nobuhiro Tamura ,  Seiko Kawashima

IPC分类号： H01J61/00 ,  H01J17/20

CPC分类号： H01J61/125

摘要： A metal halide lamp includes a fire-resistant and translucent hermetic vessel containing amounts of scandium halide and sodium halide sealed in the hermetic vessel satisfying the formula of 0.25

摘要翻译： 金属卤化物灯包括耐火和半透明的密封容器，其包含密封在密封容器中的卤化钪和卤化钠的量，其满足公式0.25

公开(公告)号：US20060244131A1

公开(公告)日：2006-11-02

申请号：US11380128

申请日：2006-04-25

申请人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

发明人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

IPC分类号： H01L23/34

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/48227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.

摘要翻译： 在难以形成导电膜的密封树脂上设置有对导电膜的与导电膜的密封树脂的粘附性高的树脂层，并且与电子部件电连接的布线图案配置在 树脂层。

公开(公告)号：US20060059271A1

公开(公告)日：2006-03-16

申请号：US10931029

申请日：2004-09-01

申请人： Hiroyuki Kato

发明人： Hiroyuki Kato

IPC分类号： G06F15/173

CPC分类号： H04N1/00278 ,  H04N2201/001 ,  H04N2201/0015 ,  H04N2201/3225 ,  H04N2201/3271 ,  H04N2201/3278

摘要： An information processing apparatus, a printing apparatus and a printing program are provided which are capable of not only improving efficiency in print processing but also making efficient the management of print documents on the part of users. The printing program is adapted to make a computer execute a related document information acquisition step that acquires information on documents related to the document to be printed upon receipt of an instruction to print the document to be printed, a related document information attachment step that attaches the related document information acquired in the related document information acquisition step to information on the document to be printed, and a transmission step that transmits to the printing apparatus the information on the document to be printed with the related document information attached thereto in the related document information attachment step.

摘要翻译： 提供了一种信息处理设备，打印设备和打印程序，其不仅可以提高打印处理的效率，而且能够有效地管理用户的打印文档。 打印程序适于使计算机执行相关的文档信息获取步骤，该步骤在接收到打印要打印的文档的指令时获取与要打印的文档有关的文档的信息;附加文档信息附加步骤， 在相关文档信息获取步骤中获取的相关文档信息到关于要打印的文档的信息，以及发送步骤，向相关文档信息向打印设备发送关于要打印的文档的信息，附带有相关文档信息的信息 附件步骤。