-
公开(公告)号：US10074784B2
公开(公告)日：2018-09-11
申请号：US14596806
申请日：2015-01-14
CPC分类号： H01L33/58 , H01L33/22 , H01L33/405 , H01L33/54 , H01L33/56 , H01L2933/0058
摘要： In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
-
公开(公告)号：US20170179336A1
公开(公告)日：2017-06-22
申请号：US15449044
申请日：2017-03-03
CPC分类号： H01L33/0075 , H01L33/04 , H01L33/06 , H01L33/12 , H01L33/14 , H01L33/22 , H01L33/32 , H01L33/325 , H01L33/387 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/46 , H01L33/60 , H01L2933/0016 , H01L2933/0025 , H01L2933/0058
摘要： In various embodiments, light-emitting devices incorporate smooth contact layers and polarization doping (i.e., underlying layers substantially free of dopant impurities) and exhibit high photon extraction efficiencies.
-
公开(公告)号：US20160181487A1
公开(公告)日：2016-06-23
申请号：US14596806
申请日：2015-01-14
CPC分类号： H01L33/58 , H01L33/22 , H01L33/405 , H01L33/54 , H01L33/56 , H01L2933/0058
摘要： In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
摘要翻译： 在各种实施例中，刚性透镜通过具有不足以防止刚性透镜和半导体裸片之间的热膨胀失配诱导应变传播的厚度的密封剂层附着到发光半导体管芯。
-
公开(公告)号：US08962359B2
公开(公告)日：2015-02-24
申请号：US13553093
申请日：2012-07-19
CPC分类号： H01L33/58 , H01L33/22 , H01L33/405 , H01L33/54 , H01L33/56 , H01L2933/0058
摘要： In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
摘要翻译： 在各种实施例中，刚性透镜通过具有不足以防止刚性透镜和半导体裸片之间的热膨胀失配诱导应变传播的厚度的密封剂层附着到发光半导体管芯。
-
公开(公告)号：US20140203311A1
公开(公告)日：2014-07-24
申请号：US13553093
申请日：2012-07-19
CPC分类号： H01L33/58 , H01L33/22 , H01L33/405 , H01L33/54 , H01L33/56 , H01L2933/0058
摘要： In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
摘要翻译： 在各种实施例中，刚性透镜通过具有不足以防止刚性透镜和半导体裸片之间的热膨胀失配诱导应变传播的厚度的密封剂层附着到发光半导体管芯。
-
公开(公告)号：US07037838B2
公开(公告)日：2006-05-02
申请号：US10300481
申请日：2002-11-20
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02024 , B24B37/0056 , B24B37/044 , B24B49/006 , H01L21/02052
摘要： According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AlN substrate surfaces.
摘要翻译： 根据本发明的一个方面，提供了一种用于制备衬底表面的改进方法，其中衬底的表面准备用于化学机械抛光（CMP）工艺，在衬底的表面上进行CMP工艺，以及 完成基材的表面以从CMP工艺中清除任何活性成分的基材表面。 此外，提供了通过该方法制备的改进的基板。 根据本发明的一个方面，可以使用允许增加AlN衬底表面质量的特定抛光材料和程序。
-
-
-
-
-
搜索结果
96 条记录 (耗时 0.038 秒)
