摘要:
Integrated circuits with clock generation and distribution circuitry are provided. Integrated circuits may include phase-locked loops configured to generate multiple clock signals that are delayed versions of one another. The clocks signal may be distributed to various regions on an integrated circuit using serially connected clock buffer blocks. Each buffer block may include bidirectional pairs of buffer circuits coupled in parallel. Each buffer circuit may have a first input configured to receive an input clock signal, an output at which a corrected version of the input clock signal is provided (e.g., an output at which an output clock signal with desired duty cycle is provided), a second input that receives a first delayed clock signal for setting the desired duty cycle for the output clock signal, and a third input that receives a second delayed clock signal that is high at least when the first delayed clock signal rises high.
摘要:
A programmable device I/O architecture allows for a variable number of I/O banks. Each I/O bank is of an I/O bank type. Each I/O bank type has a fixed number of I/O pins. I/O banks of the same I/O bank type are compatible within the same programmable device and between different types of programmable devices. The largest size I/O bank type and intermediate size I/O bank types are adapted to be a compatible supersets of every smaller I/O bank type. Support pins are regularly distributed between data pins in each I/O bank type. Multiple instances of the same or compatible I/O banks are arranged to be accessible from different sides of the programmable device. To facilitate circuit board layout, each I/O bank is arranged as a mirror and/or rotation of other I/O banks on the device.
摘要翻译:可编程器件I / O架构允许可变数量的I / O bank。 每个I / O bank都是I / O bank类型。 每个I / O bank类型都有固定数量的I / O引脚。 相同I / O bank类型的I / O组在同一可编程器件内和不同类型的可编程器件之间兼容。 最大尺寸的I / O库类型和中等大小的I / O库类型适合于每个更小的I / O bank类型的兼容超集。 支持引脚定期分布在每个I / O bank类型的数据引脚之间。 相同或兼容的I / O组的多个实例被布置为可从可编程设备的不同侧面访问。 为了便于电路板布局,每个I / O组被布置为设备上的其他I / O组的镜像和/或旋转。
摘要:
To achieve an even distribution of different types of connections, sets of connection cells have been devised having different ratios of signal, power and ground connections in which the signal connections are all within a maximum distance of a power and/or a ground connection. In addition, the shapes of the cells are such that the cells fit together in a repeatable array that fully covers the plane of the interface, i.e., an array that tiles the plane. Accordingly, to distribute the connections substantially uniformly across the interface, the ratio of the number of signal connections, power connections and ground connections is determined; a cell is selected from the set of cells that has approximately the same ratio of the number of signal connections, power connections and ground connections; and the selected cell is repeatedly used to allocate the signal, power and ground connections in accordance with the distribution of connections in the selected cell until all the connections are distributed.
摘要:
An integrated circuit may include memory interface circuitry that is used to communicate with off-chip memory. The memory interface circuitry may include data strobe (DQS) enable circuitry that receives DQS signals from the off-chip memory and that outputs a gated version of the DQS signals. The DQS enable circuitry may include an input buffer, a comparator, a latch, a flip-flop, a counter, and a gating circuit. The input buffer may receive an incoming DQS signal. The comparator may be used to determine when the incoming DQS signal starts to toggle. The latch may be used to control when a gating signal is asserted. The flip-flop controls the counter, which limits the duration that the gating signal is asserted. The gating circuit receives the DQS signal from the buffer and the gating signal and passes the DQS signal through to its output only when the gating signal is asserted.
摘要:
The circuits and methods are provided for impedance termination on an integrated circuit. A network of resistors are formed on an integrated circuit (IC) to provide on-chip impedance termination to differential input/output (IO) pins. Transistors are coupled in the network of termination resistors. The transistors provide additional termination impedance to the differential IO pins. The transistors can be turned ON or OFF separately to change the impedance termination.
摘要:
The circuits and methods are provided for impedance termination on an integrated circuit. A network of resistors are formed on an integrated circuit (IC) to provide on-chip impedance termination to differential input/output (IO) pins. Transistors are coupled in the network of termination resistors. The transistors provide additional termination impedance to the differential IO pins. The transistors can be turned ON or OFF separately to change the impedance termination.
摘要:
Circuits, methods, and apparatus that provide output drivers that consume relatively little integrated circuit area and provide fast output switching. An exemplary embodiment provides an output driver including pull-up and pull-down devices, each device driven by a pre-driver stage. The pre-driver for the pull-down device is supplied from an auxiliary power supply, which has a higher voltage than the supply seen by the pull-up device. The pre-driver for the pull-down is biased by a voltage that tracks the higher of the auxiliary and output supplies. In some embodiments, the output driver may be part of an input/output cell. In that case, the well for the pull-up device is biased by a voltage that tracks the highest of the output supply and input received voltage, while the pull-up predriver circuit bias is the higher between the auxiliary and output supplies and the input received voltage.
摘要:
Circuits, methods, and apparatus that provide output drivers that consume relatively little integrated circuit area and provide fast output switching. An exemplary embodiment provides an output driver including pull-up and pull-down devices, each device driven by a pre-driver stage. The pre-driver for the pull-down device is supplied from an auxiliary power supply, which has a higher voltage than the supply seen by the pull-up device. The pre-driver for the pull-down is biased by a voltage that tracks the higher of the auxiliary and output supplies. In some embodiments, the output driver may be part of an input/output cell. In that case, the well for the pull-up device is biased by a voltage that tracks the highest of the output supply and input received voltage, while the pull-up predriver circuit bias is the higher between the auxiliary and output supplies and the input received voltage.
摘要:
Circuits, methods, and apparatus for dynamic control of source and termination impedances. One output stage provides a series termination when transmitting and a parallel termination when receiving data. A pull-up device has a nominal impedance of 50 ohms when the output stage pulls a pin from a low voltage to a high voltage, while a pull-down device has a nominal impedance of 50 ohms when the pin is pulled from a high voltage to a low voltage. Both the pull-up and pull-down devices are turned on when receiving data. Due to their non-linear current-voltage characteristics, the pull-up device appears as 50 ohms when the pin voltage is higher than one half the supply voltage, while the pull-down device appears as 50 ohms when the pin voltage is lower than one half the supply voltage. The pull-up and pull-down devices can be calibrated to provide a nominal 50 ohm impedance.
摘要:
Circuits, methods, and apparatus for dynamic control of source and termination impedances. One output stage provides a series termination when transmitting and a parallel termination when receiving data. A pull-up device has a nominal impedance of 50 ohms when the output stage pulls a pin from a low voltage to a high voltage, while a pull-down device has a nominal impedance of 50 ohms when the pin is pulled from a high voltage to a low voltage. Both the pull-up and pull-down devices are turned on when receiving data. Due to their non-linear current-voltage characteristics, the pull-up device appears as 50 ohms when the pin voltage is higher than one half the supply voltage, while the pull-down device appears as 50 ohms when the pin voltage is lower than one half the supply voltage. The pull-up and pull-down devices can be calibrated to provide a nominal 50 ohm impedance.