TMR device with novel free layer
    93.
    发明申请
    TMR device with novel free layer 有权
    TMR器件具有新颖的自由层

    公开(公告)号:US20100073828A1

    公开(公告)日:2010-03-25

    申请号:US12284454

    申请日:2008-09-22

    IPC分类号: G11B5/127

    摘要: A TMR sensor with a free layer having a FL1/FL2/FL3 configuration is disclosed in which FL1 is FeCo or a FeCo alloy with a thickness between 2 and 15 Angstroms. The FL2 layer is made of CoFeB or a CoFeB alloy having a thickness from 2 to 10 Angstroms. The FL3 layer is from 10 to 100 Angstroms thick and has a negative λ to offset the positive λ from FL1 and FL2 layers and is comprised of CoB or a CoBQ alloy where Q is one of Ni, Mn, Tb, W, Hf, Zr, Nb, and Si. Alternatively, the FL3 layer may be a composite such as CoB/CoFe, (CoB/CoFe)n where n is ≧2 or (CoB/CoFe)m/CoB where m is ≧1. The free layer described herein affords a high TMR ratio above 60% while achieving low values for λ (

    摘要翻译: 公开了具有FL1 / FL2 / FL3结构的自由层的TMR传感器,其中FL1是FeCo或厚度在2和15埃之间的FeCo合金。 FL2层由厚度为2〜10埃的CoFeB或CoFeB合金制成。 FL3层的厚度为10〜100埃,并且具有负λ以从FL1和FL2层偏移正的λ,由CoB或CoBQ合金组成,其中Q是Ni,Mn,Tb,W,Hf,Zr ,Nb和Si。 或者,FL3层可以是其中n为≥2的CoB / CoFe(CoB / CoFe)n或(CoB / CoFe)m / CoB(其中m为≥1)的复合物。 此处描述的自由层提供高于60%的高TMR比,同时实现λ(<5×10-6),RA(1.5欧姆/μm2)和Hc(<6Oe)的低值。

    Heusler alloy with insertion layer to reduce the ordering temperature for CPP, TMR, MRAM, and other spintronics applications
    94.
    发明授权
    Heusler alloy with insertion layer to reduce the ordering temperature for CPP, TMR, MRAM, and other spintronics applications 有权
    Heusler合金与插入层,以降低CPP,TMR,MRAM和其他自旋电子应用的订购温度

    公开(公告)号:US07672088B2

    公开(公告)日:2010-03-02

    申请号:US11472126

    申请日:2006-06-21

    IPC分类号: G11B5/39

    摘要: A spin valve structure is disclosed in which an AP1 layer and/or free layer are made of a laminated Heusler alloy having Al or FeCo insertion layers. The ordering temperature of a Heusler alloy such as Co2MnSi is thereby lowered from about 350° C. to 280° C. which becomes practical for spintronics device applications. The insertion layer is 0.5 to 5 Angstroms thick and may also be Sn, Ge, Ga, Sb, or Cr. The AP1 layer or free layer can contain one or two additional FeCo layers to give a configuration represented by FeCo/[HA/IL]nHA, [HA/IL]nHA/FeCo, or FeCo/[HA/IL]nHA/FeCo where n is an integer ≧1, HA is a Heusler alloy layer, and IL is an insertion layer. Optionally, a Heusler alloy insertion scheme is possible by doping Al or FeCo in the HA layer. For example, Co2MnSi may be co-sputtered with an Al or FeCo target or with a Co2MnAl or Co2FeSi target.

    摘要翻译: 公开了一种自旋阀结构,其中AP1层和/或自由层由具有Al或FeCo插入层的层状Heusler合金制成。 因此,Heusler合金(例如Co 2 MnSi)的排序温度从约350℃降低到280℃,这对于自旋电子器件应用是实用的。 插入层的厚度为0.5〜5埃,也可以是Sn,Ge,Ga,Sb或Cr。 AP1层或自由层可以含有一个或两个另外的FeCo层,以得到由FeCo / [HA / IL] nHA,[HA / IL] nHA / FeCo或FeCo / [HA / IL] nHA / FeCo表示的构型,其中 n是整数≥1,HA是Heusler合金层,IL是插入层。 任选地,通过在HA层中掺杂Al或FeCo,Heusler合金插入方案是可能的。 例如,Co2MnSi可以与Al或FeCo靶或Co2MnAl或Co2FeSi靶共溅射。

    TMR device with surfactant layer on top of cofexby/cofez inner pinned layer
    97.
    发明申请
    TMR device with surfactant layer on top of cofexby/cofez inner pinned layer 有权
    具有表面活性剂层的TMR器件位于cofexby / cofez内部固定层的顶部

    公开(公告)号:US20090161266A1

    公开(公告)日:2009-06-25

    申请号:US12321901

    申请日:2009-01-27

    IPC分类号: G11B5/33 G11B5/127

    摘要: A high performance TMR element is fabricated by inserting an oxygen surfactant layer (OSL) between a pinned layer and AlOx tunnel barrier layer in a bottom spin valve configuration. The pinned layer preferably has a SyAP configuration with an outer pinned layer, a Ru coupling layer, and an inner pinned layer comprised of CoFeXBY/CoFeZ wherein x=0 to 70 atomic %, y=0 to 30 atomic %, and z=0 to 100 atomic %. The OSL is formed by treating the CoFeZ layer with oxygen plasma. The AlOx tunnel barrier has improved uniformity of about 2% across a 6 inch wafer and can be formed from an Al layer as thin as 5 Angstroms. As a result, the Hin value can be decreased by ⅓ to about 32 Oe. A dR/R of 25% and a RA of 3 ohm-cm2 have been achieved for TMR read head applications.

    摘要翻译: 通过在底部自旋阀配置中的钉扎层和AlOx隧道势垒层之间插入氧表面活性剂层(OSL)来制造高性能TMR元件。 钉扎层优选具有带外部被钉扎层,Ru耦合层和由CoFeXBY / CoFeZ组成的内部钉扎层的SyAP构型,其中x = 0至70原子%,y = 0至30原子%,z = 0 至100原子%。 OSL通过用氧等离子体处理CoFeZ层而形成。 AlOx隧道势垒在6英寸晶片上提高了约2%的均匀性,并且可以由薄至5埃的Al层形成。 结果,Hin值可以减少1/3至约32Oe。 对于TMR读头应用,已经实现了25%的dR / R和3ohm-cm 2的RA。

    TMR device with low magnetostriction free layer
    98.
    发明申请
    TMR device with low magnetostriction free layer 审中-公开
    具低磁致伸缩层的TMR器件

    公开(公告)号:US20090122450A1

    公开(公告)日:2009-05-14

    申请号:US11983329

    申请日:2007-11-08

    IPC分类号: G11B5/33

    摘要: A high performance TMR sensor is fabricated by employing a free layer comprised of CoBX with a λ between −5×10−6 and 0 on a MgOX tunnel barrier. Optionally, a FeCo/CoBX free layer configuration may be used where x is about 1 to 30 atomic %. Trilayer configurations represented by FeCo/CoFeB/CoBX, FeCo/CoBX/CoFeB, FeCoY/CoFeW/CoBX, or FeCoY/FeB/CoBX may also be employed. Alternatively, CoNiFeB or CoNiFeBM formed by co-sputtering CoB with CoNiFe or CoNiFeM, respectively, where M is V, Ti, Zr, Nb, Hf, Ta, or Mo may be substituted for CoBx in the aforementioned embodiments. A 15 to 30% in improvement in TMR ratio over a conventional CoFe/NiFe free layer is achieved while maintaining a low Hc and RA

    摘要翻译: 通过在MgOX隧道屏障上采用包含-5×10-6和0之间的λ的CoBX自由层来制造高性能TMR传感器。 可选地,可以使用Fe约为1〜30原子%的FeCo / CoBX自由层构型。 还可以使用由FeCo / CoFeB / CoBX,FeCo / CoBX / CoFeB,FeCoY / CoFeW / CoBX或FeCoY / FeB / CoBX表示的三层结构。 或者,在上述实施方式中,可以将CoB与分别与CoNiFe或CoNiFeM(其中M为V,Ti,Zr,Nb,Hf,Ta或Mo)共溅射而形成的CoNiFeB或CoNiFeBM代替CoBx。 在保持低Hc和RA <3欧姆 - um2的同时,实现了常规CoFe / NiFe自由层的TMR比提高15至30%。 在双层或三层实施例中,通过组合CoBx(-1)和具有正λ的一个或多个层来实现-5×10 -6和5×10 -6之间的λ。

    CPP device with improved current confining structure and process
    99.
    发明申请
    CPP device with improved current confining structure and process 有权
    CPP器件具有改进的电流限制结构和工艺

    公开(公告)号:US20090059441A1

    公开(公告)日:2009-03-05

    申请号:US11895719

    申请日:2007-08-27

    IPC分类号: G11B5/33 B05D5/12

    摘要: Plasma nitridation, in place of plasma oxidation, is used for the formation of a CCP layer. Al, Mg, Hf, etc. all form insulating nitrides under these conditions. Maintaining the structure at a temperature of at least 150° C. during plasma nitridation and/or performing post annealing at a temperature of 220° C. or higher, ensures that no copper nitride can form. Additionally, unintended oxidation by molecular oxygen of the exposed magnetic layers (mainly the pinned and free layers) is also avoided

    摘要翻译: 等离子体氮化代替等离子体氧化,用于形成CCP层。 Al,Mg,Hf等都在这些条件下形成绝缘氮化物。 在等离子体氮化和/或在220℃以上的温度下进行后退火时,将结构维持在至少150℃的温度下,确保不会形成氮化铜。 此外,也避免了暴露的磁性层(主要是固定和自由层)的分子氧的非预期氧化

    TMR device with Hf based seed layer
    100.
    发明申请
    TMR device with Hf based seed layer 有权
    具有Hf基种子层的TMR器件

    公开(公告)号:US20080171223A1

    公开(公告)日:2008-07-17

    申请号:US11652740

    申请日:2007-01-12

    IPC分类号: B32B15/20 B05D5/12

    摘要: A MTJ structure is disclosed in which the seed layer is made of a lower Ta layer, a middle Hf layer, and an upper NiFe or NiFeX layer where X is Co, Cr, or Cu. Optionally, Zr, Cr, HfZr, or HfCr may be employed as the middle layer and materials having FCC structures such as CoFe and Cu may be used as the upper layer. As a result, the overlying layers in a TMR sensor will be smoother and less pin dispersion is observed. The Hex/Hc ratio is increased relative to that for a MTJ having a conventional Ta/Ru seed layer configuration. The trilayer seed configuration is especially effective when an IrMn AFM layer is grown thereon and thereby reduces Hin between the overlying pinned layer and free layer. Ni content in the NiFe or NiFeX middle layer is above 30 atomic % and preferably >80 atomic %.

    摘要翻译: 公开了一种MTJ结构,其中种子层由下Ta层,中Hf层和上NiFe或NiFeX层制成,其中X是Co,Cr或Cu。 可选地,可以使用Zr,Cr,HfZr或HfCr作为中间层,并且可以使用具有FCC结构的诸如CoFe和Cu的材料作为上层。 结果,TMR传感器中的上覆层将变得更平滑,并且观察到较少的引脚分散。 相对于具有常规Ta / Ru种子层构型的MTJ,Hex / Hc比增加。 当IrMn AFM层在其上生长时,三层种子构型特别有效,从而在覆盖的被钉扎层和自由层之间降低了Hin。 NiFe或NiFeX中间层的Ni含量在30原子%以上,优选为80原子%以上。