公开(公告)号：US20120091579A1

公开(公告)日：2012-04-19

申请号：US13204188

申请日：2011-08-05

申请人： Jin-Woo Park ,  Eunchul Ahn

发明人： Jin-Woo Park ,  Eunchul Ahn

IPC分类号： H01L23/498 ,  H01L23/488

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05552

摘要： A semiconductor package includes a wiring board including an upper connection pad provided on a first surface and a lower connection pad provided on a second surface opposite to the first surface, a semiconductor chip having a bonding pad area in which a bonding pad is provided and an adhesive area except the bonding pad area, and being mounted on the first surface of the wiring board in a flip-chip manner such that the bonding pad is electrically connected to the upper connection pad, a first molding layer provided between the adhesive area of the semiconductor chip and the first surface of the wiring board, and a second molding layer provided between the bonding pad area of the semiconductor chip and the first area of the wiring board while covering the first surface of the wiring board and the semiconductor chip. The first molding layer has a lower modulus than the second molding layer.

摘要翻译： 一种半导体封装，包括：布线板，包括设置在第一表面上的上连接焊盘和设置在与第一表面相对的第二表面上的下连接焊盘;半导体芯片，具有焊盘区域，其中提供焊盘， 粘合区域，并且以倒装芯片方式安装在布线板的第一表面上，使得焊盘与上连接焊盘电连接;第一模制层，设置在焊接区域的粘合区域之间， 半导体芯片和布线板的第一表面，以及第二模塑层，其设置在半导体芯片的焊盘区域和布线板的第一区域之间，同时覆盖布线板和半导体芯片的第一表面。 第一成型层的模量比第二成型层低。

公开(公告)号：US08157339B2

公开(公告)日：2012-04-17

申请号：US12442675

申请日：2007-10-23

申请人： Jin-Woo Park ,  Do-Hyung Kim

发明人： Jin-Woo Park ,  Do-Hyung Kim

IPC分类号： A47B96/04

CPC分类号： F25D25/024 ,  A47B88/483 ,  A47B2088/401 ,  A47B2210/0024 ,  A47B2210/0078

摘要： In order to increase the reliability of the parts constituting the basket and to conveniently use the basket and to stably accomplish the operation of the basket, as the shaking of the basket is prevented, there is disclosed a basket operation device of a refrigerator, comprising: a basket freely moved in a back-and-forth direction in the state that the basket is supported by an inner wall of the refrigerator; a rotation shaft supported by the basket and moved with the basket and respectively rotated; a pair of rotation elements supported by both sides of the rotation shaft and rotated at the same angle to guide a movement of the basket when the basket moves in a back-and-forth direction; and a corresponding element formed in the inner wall of the refrigerator in a back-and-forth direction to contact with the rotation elements.

摘要翻译： 为了提高构成篮子的部件的可靠性，并且为了方便地使用篮子并且稳定地实现篮子的操作，由于防止了篮子的晃动，因此公开了一种冰箱的篮子操作装置，包括： 在篮子由冰箱的内壁支撑的状态下，篮子在前后方向上自由移动; 旋转轴由篮子支撑并与篮子一起移动并分别旋转; 一对旋转元件，其由所述旋转轴的两侧支撑并且以相同的角度旋转，以当所述篮沿前后方向移动时引导所述篮的运动; 以及形成在冰箱的内壁中的与旋转元件接触的前后方向的对应元件。

公开(公告)号：US08026511B2

公开(公告)日：2011-09-27

申请号：US11529912

申请日：2006-09-29

申请人： Dong-Soo Choi ,  Jin-Woo Park

发明人： Dong-Soo Choi ,  Jin-Woo Park

IPC分类号： H01L35/24 ,  H01L51/00

CPC分类号： H01L51/5246 ,  H01L27/3276

摘要： An organic light emitting device according to one embodiment of the present invention comprises a first substrate defining a pixel region and a non-pixel region; an array of organic light emitting pixels formed in the pixel region of the first substrate; a second substrate placed over the first substrate, the array being interposed between the first and second substrates; a frit seal interposed between and interconnecting the first and second substrates, wherein the frit seal comprises a plurality of elongated segments, which in combination surrounds the array; and at least one conductive line formed in the non-pixel region and elongated substantially parallel to one of the plurality of elongated segments of the frit seal, wherein no conductive line in the non-pixel region is elongated substantially parallel to one of the elongated segments and overlaps the elongated segment substantially parallel thereto when viewed from the first or second substrate.

摘要翻译： 根据本发明的一个实施例的有机发光器件包括限定像素区域和非像素区域的第一衬底; 形成在所述第一基板的像素区域中的有机发光像素阵列; 放置在所述第一基板上的第二基板，所述阵列插入在所述第一和第二基板之间; 插入在第一和第二基板之间并互连的玻璃料密封件，其中玻璃料密封件包括多个细长段，其组合围绕阵列; 以及形成在所述非像素区域中并且基本上平行于所述玻璃料密封件的所述多个细长部分之一延伸的至少一个导电线，其中所述非像素区域中的导电线基本上不平行于所述细长部分之一延伸 并且当从第一或第二基底观察时与其基本平行的细长段重叠。

公开(公告)号：US07999372B2

公开(公告)日：2011-08-16

申请号：US11529884

申请日：2006-09-29

申请人： Jin-Woo Park

发明人： Jin-Woo Park

IPC分类号： H01L23/10

CPC分类号： H01L51/5253 ,  H01L51/524 ,  H01L51/5246

摘要： Provided is an organic light emitting display device. An organic light emitting display device according to one embodiment of the present invention comprises a first substrate; a second substrate comprising an interior surface opposing the first substrate; an array of organic light emitting pixels formed between the first and second substrates, the array comprising a top surface facing the second substrate; a frit seal interposed between the first and second substrates while surrounding the array; and a film structure comprising one or more layered films, the film structure comprising a portion interposed between the array and the second substrate, the film structure contacting the interior surface and the top surface; and wherein the second substrate comprises a recess on interior surface.

摘要翻译： 提供了一种有机发光显示装置。 根据本发明的一个实施例的有机发光显示装置包括第一基板; 第二基板，包括与所述第一基板相对的内表面; 形成在所述第一和第二基板之间的有机发光像素的阵列，所述阵列包括面向所述第二基板的顶表面; 插入在第一和第二基板之间的玻璃料密封件，同时围绕阵列; 以及包括一层或多层分层薄膜的薄膜结构，所述薄膜结构包括介于所述阵列和所述第二基底之间的部分，所述薄膜结构与所述内表面和所述顶表面接触; 并且其中所述第二基板在内表面上包括凹部。

公开(公告)号：US07955717B2

公开(公告)日：2011-06-07

申请号：US11167927

申请日：2005-06-28

申请人： Dong-Soo Choi ,  Jang-Hyuk Kwon ,  Jin-Woo Park ,  Seung-Yong Song ,  Jong-Hyuk Lee ,  Yoon-Hyeung Cho

发明人： Dong-Soo Choi ,  Jang-Hyuk Kwon ,  Jin-Woo Park ,  Seung-Yong Song ,  Jong-Hyuk Lee ,  Yoon-Hyeung Cho

IPC分类号： H01L51/54 ,  B05D5/12

CPC分类号： H01L51/5259 ,  H01L2251/5315 ,  Y10S428/917 ,  Y10T428/239 ,  Y10T428/25 ,  Y10T428/258

摘要： An organic electroluminescent device and a method of preparing the same are provided. The organic electroluminescent device includes a sealing layer which is formed on a sealing substrate, and which includes a cohesion layer, a transparent polymer layer, and a transparent moisture absorption layer. Since the transparent moisture absorption layer of the organic electroluminescent device is provided to a sealing substrate using an attaching method, the organic electroluminescent device has an improved life span property due to a firm sealed structure and better light extraction efficiency due to the transparent moisture absorption layer below the sealing substrate.

摘要翻译： 提供一种有机电致发光器件及其制备方法。 有机电致发光器件包括形成在密封基板上的密封层，其包括内聚层，透明聚合物层和透明吸湿层。 由于使用附着方法将有机电致发光元件的透明吸湿层设置在密封基板上，所以有机电致发光器件由于透明的吸湿层而具有坚固的密封结构和更好的光提取效率，具有改善的寿命性能 在密封基板的下面。

公开(公告)号：US20110063186A1

公开(公告)日：2011-03-17

申请号：US12992630

申请日：2009-05-08

申请人： Jin-Woo Park

发明人： Jin-Woo Park

IPC分类号： H01Q1/12

CPC分类号： H01Q1/12 ,  H01Q1/244 ,  H01R12/718 ,  H01R13/2442 ,  H01R2101/00 ,  H01R2201/02

摘要： The present invention concerns an antenna connection device, and more particularly, an antenna connection device that effectively dissipates external load through two tension portions and a curved surface portion of a supporting end, without needing a rubber stopper. The antenna connection device according to the present invention comprises: a flat plate-shaped fixing part; a first tension portion extending from an end of the fixing part and bent around; a free part comprising a long oblique portion extending from an end of the first tension portion and bent and extended so as to oppose the fixing part, and a short oblique portion bent and extended from an end of the long oblique portion; a second tension portion extending from the other end of the fixing part and bent around; and a supporting part comprising a flat portion flatly extending from an end of the second tension portion, and a curved surface portion bent and extended from an end of the flat portion so as to oppose the fixing part and bent around and extended toward the first tension portion, the curved surface portion being disposed under the free part.

摘要翻译： 本发明涉及一种天线连接装置，更具体地说，涉及一种天线连接装置，其通过两个拉伸部分和支撑端的曲面部分有效地消散外部载荷，而不需要橡胶塞。 根据本发明的天线连接装置包括：平板状固定部; 第一张力部分，其从固定部分的一端延伸并弯曲; 自由部，其包括从所述第一张力部的端部延伸并且弯曲并延伸以与所述固定部相对的长的倾斜部，以及从所述长斜部的端部弯曲并延伸的短的倾斜部; 第二张力部分，其从固定部分的另一端延伸并弯曲; 以及支撑部，其包括从所述第二张力部的端部平坦地延伸的平坦部，以及从所述平坦部的端部弯曲并延伸的弯曲表面部，以与所述固定部相对并弯曲并朝向所述第一张力延伸 所述曲面部设置在所述自由部的下方。

公开(公告)号：US07867054B2

公开(公告)日：2011-01-11

申请号：US12473226

申请日：2009-05-27

申请人： Dong-Soo Choi ,  Jin-Woo Park ,  Seung-Yong Song

发明人： Dong-Soo Choi ,  Jin-Woo Park ,  Seung-Yong Song

IPC分类号： H01J9/00

CPC分类号： H01L51/56 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2251/566

摘要： A flat panel display and method of fabricating the same are disclosed. The flat panel display includes a first substrate having a pixel region; a light-emitting element located on the pixel region; a second substrate located opposite the first substrate; and a sealant located between the first and second substrates to cover the light-emitting element. At least one of the first and second substrates includes a groove formed around at least a portion of the circumference surrounding the pixel region. When the first and second substrates are pressed together with the sealant between them, the sealant spreads, covering the light-emitting element, and at least partially filling the groove.

摘要翻译： 公开了一种平板显示器及其制造方法。 平板显示器包括具有像素区域的第一基板; 位于像素区域上的发光元件; 位于与所述第一基板相对的第二基板; 以及密封剂，位于第一和第二基板之间以覆盖发光元件。 第一和第二基板中的至少一个包括围绕像素区域的圆周的至少一部分周围形成的凹槽。 当第一和第二基板与它们之间的密封剂一起挤压时，密封剂扩展，覆盖发光元件，并且至少部分地填充凹槽。

公开(公告)号：US20100304530A1

公开(公告)日：2010-12-02

申请号：US12788956

申请日：2010-05-27

申请人： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

发明人： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

IPC分类号： H01L21/56

CPC分类号： H01L23/04 ,  H01L23/3128 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2224/0401

摘要： Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a moulding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the moulding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously foamed.

摘要翻译： 提供一种形成半导体封装的方法。 在该方法中，形成包括在第一基板上的第一芯片的第一封装，在第二基板上形成包括第二芯片的第二封装，设置有通孔和凹陷结构的成型盖， 并且所述第二包装设置在所述第一包装上，所述模制帽在其间，使得所述凹部接收所述第一芯片。 通孔和凹槽结构同时发泡。

公开(公告)号：US07828618B2

公开(公告)日：2010-11-09

申请号：US11745815

申请日：2007-05-08

申请人： Jin-Woo Park ,  Jang-Hyuk Kwon ,  Ho-Kyoon Chung

发明人： Jin-Woo Park ,  Jang-Hyuk Kwon ,  Ho-Kyoon Chung

IPC分类号： H01J1/62 ,  H01J63/04 ,  H01J9/24 ,  H01J9/26

CPC分类号： H01L51/0096 ,  C03C15/00 ,  H01L25/048 ,  H01L27/3267 ,  H01L27/3286 ,  H01L51/52 ,  H01L51/5253 ,  H01L51/5281 ,  H01L2251/5338 ,  H01L2251/558 ,  H01L2924/0002 ,  Y02E10/549 ,  Y02P70/521 ,  H01L2924/00

摘要： A flat panel display includes a glass substrate, an organic light-emitting part, and a sealing part. The organic light-emitting part includes one or more organic light-emitting devices (OLED) formed on a surface of the glass substrate, which has a thickness of about 0.05 mm to about 0.5 mm. The sealing part seals the organic light-emitting part and protects it from damage during the manufacturing process. A method for manufacturing the flat panel display includes preparing a glass substrate of approximately 0.7 mm thickness or greater; forming a plurality of organic light-emitting devices on a surface of the glass substrate, wherein a group of one or more of the plurality of organic light-emitting devices constitutes an organic light-emitting part; sealing each organic light-emitting part; and etching the glass substrate to a predetermined thickness.

摘要翻译： 平板显示器包括玻璃基板，有机发光部件和密封部件。 有机发光部分包括形成在玻璃基板的表面上的一个或多个有机发光器件（OLED），其厚度为约0.05mm至约0.5mm。 密封部分密封有机发光部分，并在制造过程中保护其免受损坏。 制造平板显示器的方法包括制备大约0.7mm或更大的玻璃基板; 在所述玻璃基板的表面上形成多个有机发光元件，其中，所述多个有机发光元件中的一个以上的一组或多个构成有机发光部; 密封每个有机发光部分; 并将玻璃基板蚀刻到预定厚度。

公开(公告)号：US07783198B2

公开(公告)日：2010-08-24

申请号：US11646736

申请日：2006-12-28

申请人： Dae-Kwang Jung ,  Yun-Je Oh ,  Jin-Woo Park ,  Sang-Rok Lee ,  Il-Lae Kim

发明人： Dae-Kwang Jung ,  Yun-Je Oh ,  Jin-Woo Park ,  Sang-Rok Lee ,  Il-Lae Kim

IPC分类号： H04J14/00

CPC分类号： H04J14/0226 ,  H04J14/0246 ,  H04J14/0247 ,  H04J14/025 ,  H04J14/0252 ,  H04J14/0282

摘要： A passive optical network includes: a central office for generating multiplexed downstream optical signals and receiving an upstream optical signal; a plurality of optical network units for receiving a corresponding downstream optical signal and generating subcarrier channels carrying electrical data of an assigned frequency; and a remote node for photoelectrically converting the channels into electrical data, electro-optically converting the electrical data into at least one upstream optical signal.

摘要翻译： 无源光网络包括：用于产生多路复用下行光信号并接收上游光信号的中心局; 多个光网络单元，用于接收相应的下行光信号并产生承载指定频率的电数据的副载波信道; 以及用于将信道光电转换成电数据的远程节点，将电数据电光转换成至少一个上行光信号。