公开(公告)号：US09479262B2

公开(公告)日：2016-10-25

申请号：US15048222

申请日：2016-02-19

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/00 ,  H04B10/556 ,  H04B10/564 ,  H04B10/079 ,  H04J14/02 ,  H04J14/00

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并向第 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

公开(公告)号：US20160294478A1

公开(公告)日：2016-10-06

申请号：US15096017

申请日：2016-04-11

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Robert J. Stone ,  Stephen B. Krasulick ,  Timothy Creazzo

IPC: H04B10/40 ,  H04B10/25 ,  H04J14/06 ,  H04B10/50

CPC classification number: H04B10/40 ,  H04B10/2504 ,  H04B10/272 ,  H04B10/503 ,  H04J14/02 ,  H04J14/0282 ,  H04J14/06

Abstract: An optical network unit includes a transmit/receive port and a silicon waveguide optically coupled to the transmit/receive port. The optical network unit also includes a tunable filter coupled to the silicon waveguide and providing a first output for a first frequency band and a second output for a second frequency band. The optical network unit further includes a polarization diverse receiver coupled to the tunable filter and a laser coupled to the tunable filter.

Abstract translation: 光网络单元包括发射/接收端口和光耦合到发射/接收端口的硅波导。 光网络单元还包括耦合到硅波导的可调谐滤波器，并为第一频带提供第一输出，为第二频带提供第二输出。 光网络单元还包括耦合到可调谐滤波器的偏振分集接收器和耦合到可调谐滤波器的激光器。

公开(公告)号：US20160170142A1

公开(公告)日：2016-06-16

申请号：US15051348

申请日：2016-02-23

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  Guoliang Li ,  John Zyskind ,  Stephen B. Krasulick

IPC: G02B6/14 ,  G02B6/136 ,  G02B6/132 ,  G02B6/122

CPC classification number: G02B6/14 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/305 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12152

Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.

Abstract translation: 一种制造波导模式扩展器的方法包括：提供包括波导的基板，在与波导的输出端相邻的安装区域中接合包括多个光学材料层的小芯片，以及选择性地去除所述小芯片的部分以形成逐渐增加的渐变级 从小头的近端到远端的数量和侧向尺寸。 第一光学材料层支持与离开波导的模式基本相同的大小的输入模式。 当与第一层组合时，一个或多个上覆层支持更大的输出光学模式尺寸。 模式扩张器的每个锥形阶段由小杯的相应层的一部分形成。 第一层和锥形阶段形成一个波导模式扩展器，其扩展了穿过小灯的光学模式。

公开(公告)号：US09337933B2

公开(公告)日：2016-05-10

申请号：US14057844

申请日：2013-10-18

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Robert J. Stone ,  Stephen B. Krasulick ,  Timothy Creazzo

IPC: H04B10/00 ,  H04B10/04 ,  H04B10/40 ,  H04B10/272 ,  H04J14/02 ,  H04J14/06

CPC classification number: H04B10/40 ,  H04B10/2504 ,  H04B10/272 ,  H04B10/503 ,  H04J14/02 ,  H04J14/0282 ,  H04J14/06

Abstract: An optical network unit includes a transmit/receive port and a silicon waveguide optically coupled to the transmit/receive port. The optical network unit also includes a tunable filter coupled to the silicon waveguide and providing a first output for a first frequency band and a second output for a second frequency band. The optical network unit further includes a polarization diverse receiver coupled to the tunable filter and a laser coupled to the tunable filter.

Abstract translation: 光网络单元包括发射/接收端口和光耦合到发射/接收端口的硅波导。 光网络单元还包括耦合到硅波导的可调谐滤波器，并为第一频带提供第一输出，为第二频带提供第二输出。 光网络单元还包括耦合到可调谐滤波器的偏振分集接收器和耦合到可调谐滤波器的激光器。

公开(公告)号：US09300406B2

公开(公告)日：2016-03-29

申请号：US13959107

申请日：2013-08-05

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/00 ,  H04B10/556 ,  H04B10/50 ,  H04J14/00

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

公开(公告)号：US20150097211A1

公开(公告)日：2015-04-09

申请号：US14509979

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L31/109 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0304

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

Abstract translation: 复合光子器件包括平台，芯片和接触层。 该平台包括硅。 该芯片由III-V材料制成。 接触层具有凹陷以帮助在平台与芯片的接合期间控制焊料的流动。 在一些实施例中，基座放置在光路下方以防止焊料在光路处在芯片和平台之间流动。

公开(公告)号：US20140179036A1

公开(公告)日：2014-06-26

申请号：US14135006

申请日：2013-12-19

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/00 ,  H01L25/16

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/167 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

Abstract translation: 制造复合集成光学器件的方法包括提供包括硅层的衬底，在硅层中形成波导，以及形成包含耦合到硅层的金属材料的层。 该方法还包括提供光学检测器，在金属材料和光学检测器的第一部分之间形成金属辅助结合，在波导与光学检测器的第二部分之间形成直接的半导体 - 半导体结合。

公开(公告)号：US20140112669A1

公开(公告)日：2014-04-24

申请号：US14057844

申请日：2013-10-18

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Robert J. Stone ,  Stephen B. Krasulick ,  Timothy Creazzo

IPC: H04B10/40

CPC classification number: H04B10/40 ,  H04B10/2504 ,  H04B10/272 ,  H04B10/503 ,  H04J14/02 ,  H04J14/0282 ,  H04J14/06

Abstract: An optical network unit includes a transmit/receive port and a silicon waveguide optically coupled to the transmit/receive port. The optical network unit also includes a tunable filter coupled to the silicon waveguide and providing a first output for a first frequency band and a second output for a second frequency band. The optical network unit further includes a polarization diverse receiver coupled to the tunable filter and a laser coupled to the tunable filter.

Abstract translation: 光网络单元包括发射/接收端口和光耦合到发射/接收端口的硅波导。 光网络单元还包括耦合到硅波导的可调谐滤波器，并为第一频带提供第一输出，为第二频带提供第二输出。 光网络单元还包括耦合到可调谐滤波器的偏振分集接收器和耦合到可调谐滤波器的激光器。

公开(公告)号：US20130210214A1

公开(公告)日：2013-08-15

申请号：US13745577

申请日：2013-01-18

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： John Dallesasse ,  Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena

IPC: H01L21/762

CPC classification number: H01L27/14689 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/0688 ,  H01L27/12 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/15

Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.