COMPOSITE MAGNETIC BODY, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD USING THE SAME, AND ELECTRONIC APPARATUS USING THE SAME
    92.
    发明申请
    COMPOSITE MAGNETIC BODY, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD USING THE SAME, AND ELECTRONIC APPARATUS USING THE SAME 审中-公开
    复合磁性体,其制造方法,使用该组合物的电路板和使用其的电子装置

    公开(公告)号:US20100000769A1

    公开(公告)日:2010-01-07

    申请号:US12449019

    申请日:2008-01-22

    摘要: There are provided a composite magnetic body exhibiting a sufficiently low magnetic loss at frequencies of several hundreds of megahertz to several gigahertz, and a method of manufacturing the same. The composite magnetic body contains a magnetic powder dispersed in an insulating material. The magnetic powder is in a spherical shape or an elliptic shape. The composite magnetic body has any one of the following characteristics (a) to (c): (a) the relative magnetic permeability μr is larger than 1 and the loss tangent tan δ is 0.1 or less, at a frequency of 1 GHz or 500 MHz; (b) the real part μr′ of the complex permeability is more than 10 and the loss tangent tan δ is 0.3 or less, at a frequency of 1.2 GHz or less; and (c) the real part μr′ of the complex permeability is more than 1 at a frequency of 4 GHz or less, and the loss tangent tan δ is 0.1 or less at a frequency of 1 GHz or less.

    摘要翻译: 提供了一种在数百兆赫兹到几千兆赫的频率下具有足够低的磁损耗的复合磁体及其制造方法。 复合磁体包含分散在绝缘材料中的磁粉。 磁粉为球形或椭圆形。 复合磁体具有以下特征(a)〜(c)中的任一个:(a)相对磁导率μm大于1,损耗角正切tanδ为0.1以下,频率为1GHz或500 MHz; (b)在1.2GHz或更小的频率下,复合磁导率的实部部分大于10,损耗角正切tanδ为0.3或更小; 和(c)在4GHz或更小的频率下,复合磁导率的实部mur'大于1,而在1GHz或更小的频率下,损耗角正切tanδ为0.1或更小。

    Semiconductor Device
    93.
    发明申请
    Semiconductor Device 有权
    半导体器件

    公开(公告)号:US20090321832A1

    公开(公告)日:2009-12-31

    申请号:US11922197

    申请日:2006-06-16

    IPC分类号: H01L27/12

    CPC分类号: H01L27/1203 H01L29/045

    摘要: A semiconductor device according to this invention is provided with a MOS transistor of at least one type, wherein the MOS transistor has a semiconductor layer (SOI layer) provided on an SOI substrate and a gate electrode provided on the SOI layer and is normally off by setting the thickness of the SOI layer so that the thickness of a depletion layer caused by a work function difference between the gate electrode and the SOI layer becomes greater than that of the SOI layer.

    摘要翻译: 根据本发明的半导体器件设置有至少一种类型的MOS晶体管,其中MOS晶体管具有设置在SOI衬底上的半导体层(SOI层)和设置在SOI层上的栅电极,并且通常由 设置SOI层的厚度,使得由栅电极和SOI层之间的功函数差引起的耗尽层的厚度变得大于SOI层的厚度。

    Reduced Pressure Deposition Apparatus and Reduced Pressure Deposition Method
    95.
    发明申请
    Reduced Pressure Deposition Apparatus and Reduced Pressure Deposition Method 审中-公开
    减压沉积装置和减压沉积法

    公开(公告)号:US20090263566A1

    公开(公告)日:2009-10-22

    申请号:US11992225

    申请日:2005-09-21

    IPC分类号: B05D5/12 C23C14/00 B05D5/06

    摘要: In a deposited thin film for use in a semiconductor device or the like for which a high integration degree and ultrafine machining are required, adsorption of contaminant, and particularly, of organic substances on the deposited thin film has become a problem. A phenomenon has been found out that, in a case where a gas pressure in a chamber is maintained in a viscous flow region, the adsorption of the organic substances is significantly decreased as compared with a case where the gas pressure is maintained in a molecular flow region. Based on this phenomenon, the gas pressure is controlled so that the gas pressure can be set in the molecular flow region at a time of forming the deposited thin film and so that the gas pressure can be set in the viscous flow region while such deposition is not being performed, thus making it possible to form the deposited thin film with less contamination from the organic substances.

    摘要翻译: 在用于需要高集成度和超细加工的半导体器件等中的沉积薄膜中,污染物特别是有机物质在沉积的薄膜上的吸附已经成为问题。 已经发现,在室内的气体压力保持在粘性流动区域的情况下,与将气体压力保持在分子流中的情况相比,有机物质的吸附显着降低的现象 地区。 基于该现象,控制气体压力,使得在形成沉积的薄膜时可以在分子流动区域中设定气体压力,并且可以将气体压力设定在粘性流动区域中,同时沉积 不能进行,从而可以形成具有较少的有机物污染的沉积薄膜。

    Semiconductor Storage Device and Method for Manufacturing the Same
    97.
    发明申请
    Semiconductor Storage Device and Method for Manufacturing the Same 失效
    半导体存储装置及其制造方法

    公开(公告)号:US20090072327A1

    公开(公告)日:2009-03-19

    申请号:US11576499

    申请日:2005-09-30

    摘要: [Problems] To provide a semiconductor storage device with excellent electrical characteristics (write/erase characteristics) by means of favorable nitrogen concentration profile of a gate insulating film, and to provide a method for manufacturing such a device.[Means for Solving Problems] a semiconductor device fabricating method according to a first aspect of the invention, a method for fabricating a semiconductor storage device that operates by transferring charges through a gate insulating film formed between a semiconductor substrate and a gate electrode, includes a step for introducing an oxynitriding species previously diluted by plasma excitation gas, into a plasma processing apparatus, generating an oxynitriding species by means of a plasma, and forming an oxynitride film on the semiconductor substrate as the gate insulating film. The oxynitriding species contains NO gas at a ratio of 0.00001 to 0.01% to the total volume of gas introduced into the plasma processing apparatus.

    摘要翻译: [问题]通过栅极绝缘膜的有利的氮浓度分布,提供具有优异的电特性(写/擦除特性)的半导体存储装置,并提供制造这种器件的方法。 解决问题的手段根据本发明的第一方面的半导体器件制造方法,一种制造半导体存储器件的方法,所述半导体存储器件通过在半导体衬底和栅电极之间形成的栅极绝缘膜转移电荷而工作,包括: 将先前由等离子体激发气体稀释的氮氧化物质引入等离子体处理装置,通过等离子体产生氮氧化物质,并在半导体衬底上形成氧氮化物膜作为栅极绝缘膜的步骤。 氮氧化物质相对于引入等离子体处理装置的气体的总体积含有0.00001〜0.01%的NO气体。

    SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND DISPLAY UNIT
    98.
    发明申请
    SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND DISPLAY UNIT 审中-公开
    半导体制造方法,半导体制造装置和显示单元

    公开(公告)号:US20090050895A1

    公开(公告)日:2009-02-26

    申请号:US12195508

    申请日:2008-08-21

    摘要: In a semiconductor manufacturing method that manufactures a coplanar type thin film transistor, a microcrystalline film 10 that will become a channel region is formed on a glass substrate S, a sacrificial silicon oxide 20 film is formed on the microcrystalline film 10, and, in a state in which a surface boundary of the microcrystalline film 10 is protected by the sacrificial silicon oxide film 20, a doped silicon film 30 is built up that will become a source region and a drain region. A photoresist R film is applied on the doped silicon film 30 and planarized. With the sacrificial silicon oxide film 20 in an uncovered state, etching is performed until the microcrystalline film 10 and the doped silicon film 30 reside in approximately the same plane.

    摘要翻译: 在制造共面型薄膜晶体管的半导体制造方法中,在玻璃基板S上形成成为沟道区的微晶膜10,在微晶膜10上形成牺牲氧化硅20膜,在 由牺牲氧化硅膜20保护微晶膜10的表面边界的状态,构成将成为源极区域和漏极区域的掺杂硅膜30。 将光致抗蚀剂R膜施加在掺杂硅膜30上并平坦化。 在牺牲氧化硅膜20处于未覆盖状态下,进行蚀刻直到微晶膜10和掺杂硅膜30位于大致相同的平面中。

    Semiconductor device and method of manufacturing the same
    99.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07449719B2

    公开(公告)日:2008-11-11

    申请号:US10558760

    申请日:2004-05-31

    摘要: A gate insulating film is formed using a plasma on a three-dimensional silicon substrate surface having a plurality of crystal orientations. The plasma gate insulating film experiences no increase in interface state in any crystal orientations and has a uniform thickness even at corner portions of the three-dimensional structure. By forming a high-quality gate insulating film using a plasma, there can be obtained a semiconductor device having good characteristics.

    摘要翻译: 在具有多个晶体取向的三维硅衬底表面上使用等离子体形成栅极绝缘膜。 等离子体栅极绝缘膜在任何晶体取向中不会增加界面态,并且即使在三维结构的拐角部分也具有均匀的厚度。 通过使用等离子体形成高品质的栅极绝缘膜,可以获得具有良好特性的半导体器件。

    Method of Measuring Electronic Device and Measuring Apparatus
    100.
    发明申请
    Method of Measuring Electronic Device and Measuring Apparatus 失效
    电子装置和测量装置的测量方法

    公开(公告)号:US20080204050A1

    公开(公告)日:2008-08-28

    申请号:US11795247

    申请日:2006-01-17

    IPC分类号: G01R27/26

    CPC分类号: G01R31/2621 G01R27/2605

    摘要: In a method for measuring an electronic device which is an object to be measured, a passive element is connected to the electronic device in parallel, and electric parameters of the electronic device are extracted by measuring an impedance of the entire circuit.

    摘要翻译: 在作为测量对象的电子设备的测量方法中,无源元件并联连接到电子设备,并且通过测量整个电路的阻抗来提取电子设备的电参数。