Methods to resolve hard-to-erase condition in charge trapping non-volatile memory
    91.
    发明授权
    Methods to resolve hard-to-erase condition in charge trapping non-volatile memory 有权
    解决电荷捕获非易失性存储器中难擦除条件的方法

    公开(公告)号:US07355897B2

    公开(公告)日:2008-04-08

    申请号:US11773857

    申请日:2007-07-05

    IPC分类号: G11C16/04

    CPC分类号: G11C16/0475

    摘要: A method for operating a nitride trapping memory cell is provided to resolve hard-to-erase condition by employing a reset technique to eliminate or reduce the number of electrons in the middle of a junction region. When a hard-to-erase condition is detected after a series of program and erase cycles, such as 500 or 100 program and erase cycles, a substrate transient hot hole (STHH) reset operation is applied. The substrate transient hot hole reset injects holes that are far away junction than band-to-band tunneling hot hole (BTBTHH) injection such that the STHH reset on cycle endurance is able to maintain a desirable cycle window to eliminate or reduce the hard-to erase condition in subsequent program and erase cycles.

    摘要翻译: 提供了一种操作氮化物捕获存储单元的方法,通过采用复位技术来消除或减少接合区中间的电子数量来解决硬擦除条件。 当在一系列编程和擦除周期(例如500或100个编程和擦除周期)之后检测到难以擦除的条件时,应用基板瞬态热孔(STHH)复位操作。 衬底瞬态热孔复位注入与带 - 带隧道热孔(BTBTHH)注入相距较远的结的孔,使得周期耐久下的STHH复位能够保持期望的循环窗口以消除或减少难以 随后的编程和擦除周期中的擦除条件。

    METHOD FOR MANUFACTURING MEMORY CELL
    92.
    发明申请
    METHOD FOR MANUFACTURING MEMORY CELL 有权
    制造记忆细胞的方法

    公开(公告)号:US20080002477A1

    公开(公告)日:2008-01-03

    申请号:US11836142

    申请日:2007-08-09

    IPC分类号: G11C11/34 H01L21/36

    摘要: The invention is directed to a memory cell on a substrate having a plurality of shallow trench isolations form therein, wherein top surfaces of the shallow trench isolations are lower than a top surface of the substrate and the shallow trench isolations together define a vertical fin structure of the substrate. The memory comprises a straddle gate, a carrier trapping layer and at least two source/drain regions. The straddle gate is located on the substrate and straddles over the vertical fin structure. The carrier trapping layer is located between the straddle gate and the substrate. The source/drain regions are located in a portion of the vertical fin structure of the substrate exposed by the straddle gate.

    摘要翻译: 本发明涉及在其上形成有多个浅沟槽隔离物的衬底上的存储单元,其中浅沟槽隔离物的顶表面低于衬底的顶表面,并且浅沟槽隔离件一起限定垂直鳍状结构 底物。 存储器包括跨骑门,载体俘获层和至少两个源极/漏极区域。 跨门位于基板上,跨越垂直翅片结构。 载体捕获层位于跨门和基板之间。 源极/漏极区域位于由跨门暴露的衬底的垂直鳍结构的一部分中。

    Methods to resolve hard-to-erase condition in charge trapping non-volatile memory
    93.
    发明授权
    Methods to resolve hard-to-erase condition in charge trapping non-volatile memory 有权
    解决电荷捕获非易失性存储器中难擦除条件的方法

    公开(公告)号:US07242622B2

    公开(公告)日:2007-07-10

    申请号:US11359044

    申请日:2006-02-22

    IPC分类号: G11C16/04

    CPC分类号: G11C16/0475

    摘要: A method for operating a nitride trapping memory cell is provided to resolve hard-to-erase condition by employing a reset technique to eliminate or reduce the number of electrons in the middle of a junction region. When a hard-to-erase condition is detected after a series of program and erase cycles, such as 500 or 100 program and erase cycles, a substrate transient hot hole (STHH) reset operation is applied. The substrate transient hot hole reset injects holes that are far away junction than band-to-band tunneling hot hole (BTBTHH) injection such that the STHH reset on cycle endurance is able to maintain a desirable cycle window to eliminate or reduce the hard-to erase condition in subsequent program and erase cycles.

    摘要翻译: 提供了一种操作氮化物捕获存储单元的方法,通过采用复位技术来消除或减少接合区中间的电子数量来解决硬擦除条件。 当在一系列编程和擦除周期(例如500或100个编程和擦除周期)之后检测到难以擦除的条件时,应用基板瞬态热孔(STHH)复位操作。 衬底瞬态热孔复位注入与带 - 带隧道热孔(BTBTHH)注入相距较远的结的孔,使得周期耐久下的STHH复位能够保持期望的循环窗口以消除或减少难以 随后的编程和擦除周期中的擦除条件。

    METHODS TO RESOLVE HARD-TO-ERASE CONDITION IN CHARGE TRAPPING NON-VOLATILE MEMORY

    公开(公告)号:US20070133307A1

    公开(公告)日:2007-06-14

    申请号:US11359044

    申请日:2006-02-22

    IPC分类号: G11C16/04

    CPC分类号: G11C16/0475

    摘要: A method for operating a nitride trapping memory cell is provided to resolve hard-to-erase condition by employing a reset technique to eliminate or reduce the number of electrons in the middle of a junction region. When a hard-to-erase condition is detected after a series of program and erase cycles, such as 500 or 100 program and erase cycles, a substrate transient hot hole (STHH) reset operation is applied. The substrate transient hot hole reset injects holes that are far away junction than band-to-band tunneling hot hole (BTBTHH) injection such that the STHH reset on cycle endurance is able to maintain a desirable cycle window to eliminate or reduce the hard-to erase condition in subsequent program and erase cycles.

    NON-VOLATILE MEMORY, NON-VOLATILE MEMORY CELL AND OPERATION THEREOF
    95.
    发明申请
    NON-VOLATILE MEMORY, NON-VOLATILE MEMORY CELL AND OPERATION THEREOF 审中-公开
    非易失性存储器,非易失性存储器单元及其操作

    公开(公告)号:US20060131634A1

    公开(公告)日:2006-06-22

    申请号:US10905194

    申请日:2004-12-21

    IPC分类号: H01L21/8238 H01L29/06

    摘要: A non-volatile memory cell comprising a substrate, a charge-trapping layer, a control gate, a first conductive state of source and drain, a lightly doped region and a second conductive state of pocket-doped region. The charge-trapping layer and the control gate are disposed over the substrate. A dielectric layer is disposed between the substrate, the charge-trapping layer and the control gate. The source and drain are disposed in the substrate on each side of the charge-trapping layer. The lightly doped region is disposed on the substrate surface between the source and the charge-trapping layer. The pocket-doped region is disposed within the substrate between the drain and the charge-trapping layer. Because there are asymmetrical configuration and different doped conductive states of implant structures, the programming speed of the memory cell is increased, the neighboring cell disturb issue is prevented, and the area occupation of the bit line selection transistor is reduced.

    摘要翻译: 一种非易失性存储单元,包括衬底,电荷俘获层,控制栅极,源极和漏极的第一导电状态,轻掺杂区域和第二导电状态的袋掺杂区域。 电荷捕获层和控制栅极设置在衬底上。 电介质层设置在基板,电荷俘获层和控制栅极之间。 源极和漏极设置在电荷俘获层的每一侧上的衬底中。 轻掺杂区域设置在源极和电荷捕获层之间的衬底表面上。 掺杂阱区域设置在漏极和电荷捕获层之间的衬底内。 由于存在不对称配置和掺杂导体状态的不同,存储单元的编程速度增加,从而防止了相邻单元的干扰问题,并减少了位线选择晶体管的占用面积。

    3D polysilicon ROM and method of fabrication thereof
    96.
    发明申请
    3D polysilicon ROM and method of fabrication thereof 有权
    3D多晶硅ROM及其制造方法

    公开(公告)号:US20050124116A1

    公开(公告)日:2005-06-09

    申请号:US10728767

    申请日:2003-12-08

    CPC分类号: H01L27/0688

    摘要: A 3D polysilicon read only memory at least including: a silicon substrate, an isolated silicon dioxide (SiO2) layer, a N-Type heavily doped (N+) polysilicon layer, a first oxide layer, a dielectric layer, a P-Type lightly doped (P−) polysilicon layer, at least a neck structure, and a second oxide layer. The isolated SiO2 layer is deposited on the silicon substrate, and the N+ polysilicon layer is deposited on the isolated SiO2 layer. The N+ polysilicon layer is further defined a plurality of parallel, separate word lines (WL), and the first oxide layer is filled in the space between the word lines. The dielectric layer is deposited on the word lines and the first oxide layer. The P-Type lightly doped (P−) polysilicon layer is deposited on the dielectric layer and is further defined a plurality of parallel, separate bit lines (BL). The bit lines overlap the word lines, from a top view, to form a shape approximately as a cross. There are at least a neck structure individually formed between the first polysilicon layer and the second polysilicon layer by isotropy wet etching the dielectric layer, with using dilute hydrofluoric acid (HF) as the example. The second oxide layer is filled in the space between the bit lines and is on the word lines and the first oxide layer.

    摘要翻译: 至少包括硅衬底,隔离二氧化硅(SiO 2)层,N型重掺杂(N +)多晶硅层,第一氧化物层,电介质 层,P型轻掺杂(P)多晶硅层,至少颈部结构和第二氧化物层。 隔离的SiO 2层沉积在硅衬底上,并且N +多晶硅层沉积在隔离的SiO 2层上。 N +多晶硅层进一步限定多个平行的单独的字线(WL),并且第一氧化物层被填充在字线之间的空间中。 介电层沉积在字线和第一氧化物层上。 P型轻掺杂(P)多晶硅层沉积在电介质层上,并进一步限定多个平行的分开的位线(BL)。 位线从顶视图与字线重叠,以形成大致为十字形的形状。 通过使用稀氢氟酸(HF)作为实例,通过各向同性湿蚀刻介电层,至少在第一多晶硅层和第二多晶硅层之间形成颈部结构。 第二氧化物层填充在位线之间的空间中,并且位于字线和第一氧化物层上。

    Non-volatile memory and non-volatile memory cell having asymmetrical doped structure
    98.
    发明授权
    Non-volatile memory and non-volatile memory cell having asymmetrical doped structure 有权
    具有非对称掺杂结构的非易失性存储器和非易失性存储单元

    公开(公告)号:US08847299B2

    公开(公告)日:2014-09-30

    申请号:US12017064

    申请日:2008-01-21

    摘要: A non-volatile memory cell comprising a substrate, a charge-trapping layer, a control gate, a first conductive state of source and drain, a lightly doped region and a second conductive state of pocket-doped region. The charge-trapping layer and the control gate are disposed over the substrate. A dielectric layer is disposed between the substrate, the charge-trapping layer and the control gate. The source and drain are disposed in the substrate on each side of the charge-trapping layer. The lightly doped region is disposed on the substrate surface between the source and the charge-trapping layer. The pocket-doped region is disposed within the substrate between the drain and the charge-trapping layer. Because there are asymmetrical configuration and different doped conductive states of implant structures, the programming speed of the memory cell is increased, the neighboring cell disturb issue is prevented, and the area occupation of the bit line selection transistor is reduced.

    摘要翻译: 一种非易失性存储单元,包括衬底,电荷俘获层,控制栅极,源极和漏极的第一导电状态,轻掺杂区域和第二导电状态的袋掺杂区域。 电荷捕获层和控制栅极设置在衬底上。 电介质层设置在基板,电荷俘获层和控制栅极之间。 源极和漏极设置在电荷俘获层的每一侧上的衬底中。 轻掺杂区域设置在源极和电荷捕获层之间的衬底表面上。 掺杂阱区域设置在漏极和电荷捕获层之间的衬底内。 由于存在不对称配置和掺杂导体状态的不同,存储单元的编程速度增加,从而防止了相邻单元的干扰问题,并减少了位线选择晶体管的占用面积。

    Cell operation methods using gate-injection for floating gate NAND flash memory
    99.
    发明授权
    Cell operation methods using gate-injection for floating gate NAND flash memory 有权
    使用栅极注入的浮动栅极NAND闪存的单元操作方法

    公开(公告)号:US08325530B2

    公开(公告)日:2012-12-04

    申请号:US11542749

    申请日:2006-10-03

    IPC分类号: G11C11/34

    摘要: A method of performing an operation on a flash memory cell device, used when a gate coupling ratio between a floating gate and a control gate of less than 0.4. A potential is required to be applied across the control gate. Electrons are either injected to the floating gate from the control gate or ejected from the floating gate to the control gate. The operation associated with the injection or the ejection is determined by the nature of a silicon channel provided in the device. Devices using a bulk-tied FinFET-like structure are particularly suited to this method. The method is also particularly suited for use on cells in a NAND array.

    摘要翻译: 在浮动栅极和控制栅极之间的栅极耦合比小于0.4时使用的对闪存单元器件进行操作的方法。 需要在控制门上施加电位。 电子从控制栅极注入到浮动栅极或从浮动栅极喷射到控制栅极。 与注射或喷射相关联的操作由设备中提供的硅通道的性质决定。 使用大容量FinFET类结构的器件特别适用于该方法。 该方法还特别适用于NAND阵列中的单元。