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    Method and apparatus for hermetically sealing photonic devices
    98.
    发明授权
    Method and apparatus for hermetically sealing photonic devices 失效
    用于密封光子器件的方法和装置

    公开(公告)号：US06932522B2

    公开(公告)日：2005-08-23

    申请号：US10444796

    申请日：2003-05-22

    申请人： Ping Zhou

    发明人： Ping Zhou

    IPC分类号： H01L23/28 ,  H01L31/02 ,  H01S5/022 ,  H01S5/183 ,  G02B6/36

    CPC分类号： H01S5/02288 ,  H01S5/0222 ,  H01S5/183

    摘要： A hermetically sealed photonic device submount includes a photonic device mounted on a substrate material and sealed in a flexible hermetic seal. In one configuration, the photonic device is configured to emit or to receive light through the substrate material. In this configuration, the photonic device is covered with an adhesive layer and a metal layer depositd onto the adhesive layer. In another configuration, the photonic device is configured to emit or to receive light in a direction substantially vertically upward from the substrate material. In this configuration, a cover is placed over the photonic device, then the cover is hermetically sealed to the substrate material with an adhesive layer and a metal layer depositd onto the adhesive layer. In both configurations, the photonic device submounts are hermetically sealed according to various aspects of the present invention on the substrate material without using a separate package. Accordingly, any number of hermetically sealed photonic device submounts can be mass produced on wafers using the present invention.

    摘要翻译： 密封的光子器件底座包括安装在基底材料上并密封在柔性密封件中的光子器件。 在一种配置中，光子器件被配置为发射或接收穿过衬底材料的光。 在该配置中，光子器件被粘合剂层覆盖，金属层沉积到粘合剂层上。 在另一种配置中，光子器件被配置为发射或接收来自基底材料的基本垂直向上的方向的光。 在该配置中，将盖放置在光子器件上方，然后将盖密封到基底材料上，粘合剂层和金属层沉积在粘合剂层上。 在两种配置中，光子器件底座根据本发明的各个方面在衬底材料上气密密封，而不使用单独的封装。 因此，可以使用本发明在晶片上大量生产任何数量的密封的光子器件底座。