公开(公告)号：US09713253B2

公开(公告)日：2017-07-18

申请号：US14006546

申请日：2011-03-29

申请人： Hideyo Osanai ,  Takayuki Takahashi ,  Satoru Ideguchi ,  Hirotaka Kotani

发明人： Hideyo Osanai ,  Takayuki Takahashi ,  Satoru Ideguchi ,  Hirotaka Kotani

IPC分类号： B21D39/00 ,  H05K1/05 ,  H05K3/02 ,  H01L23/373 ,  H01L21/48 ,  B22D19/00 ,  B22D19/04 ,  H05K1/03 ,  H05K3/00

CPC分类号： H05K1/053 ,  B22D19/0081 ,  B22D19/04 ,  H01L21/481 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/09136 ,  H05K2201/2009 ,  H05K2203/128 ,  Y10T428/12618 ,  Y10T428/2457 ,  Y10T428/2462 ,  Y10T428/24942 ,  H01L2924/00

摘要： A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

公开(公告)号：US20160281253A1

公开(公告)日：2016-09-29

申请号：US14778159

申请日：2014-02-18

申请人： DOWA METALTECH CO., LTD.

发明人： Keisuke SHINOHARA ,  Masafumi OGATA ,  Hiroshi MIYAZAWA ,  Akira SUGAWARA

IPC分类号： C25D5/10 ,  C25D5/34 ,  C25D3/46

CPC分类号： C25D5/10 ,  C25D3/46 ,  C25D5/34 ,  C25D7/00 ,  H01H1/025 ,  H01H11/041 ,  H01H2011/046 ,  H01R13/03

摘要： There is provided a silver-plated product which has good thermal resistance, bendability and wear resistance. In a silver-plated product wherein a surface layer of silver having a thickness of 10 μm or less is formed on a base material of copper or a copper alloy, the full-width at half maximum of a rocking curve on a preferred orientation plane (preferably {200} or {111} plane) of the surface layer is caused to be 2 to 8°, preferably 3 to 7°, to improve the out-of-plane orientation of the surface layer to improve the thermal resistance, bendability and wear resistance of the silver-plated product.

摘要翻译： 提供了具有良好的耐热性，弯曲性和耐磨性的镀银产品。 在铜或铜合金的基材上形成有厚度为10μm以下的银的表面层的镀银制品中，在优选取向面上的摇摆曲线的半高宽（ 优选为{200}或{111}面）为2〜8°，优选为3〜7°，以提高表面层的面外取向性，提高耐热性，弯曲性， 镀银产品的耐磨性。

公开(公告)号：US09396827B2

公开(公告)日：2016-07-19

申请号：US14211067

申请日：2014-03-14

申请人： DOWA METALTECH CO., LTD.

发明人： Weilin Gao ,  Motohiko Suzuki ,  Toshiya Kamada ,  Takashi Kimura ,  Fumiaki Sasaki ,  Akira Sugawara

IPC分类号： H01B1/02 ,  C22C9/00 ,  C22F1/08

CPC分类号： H01B1/026 ,  C22C9/00 ,  C22F1/08

摘要： A Cu—Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 105 number/mm2.

摘要翻译： Cu-Ti系铜合金板材以质量％计含有2.0％〜5.0％的Ti，0〜1.5％的Ni，0〜1.0％的Co，0〜0.5％的Fe，0〜1.2％的Sn ，0〜2.0％的Zn，0〜1.0％的Mg，0〜1.0％的Zr，0〜1.0％的Al，0〜1.0％的Si，0〜0.1％的P，0〜0.05％的B， 0至1.0％的Cr，0至1.0％的Mn和0至1.0％的V，余量基本上为Cu。 片材具有金属结构，其中在垂直于片材厚度方向的截面中，晶界反应型沉淀物的最大宽度不大于500nm，直径为100nm的粒状沉淀物的密度或 更多不超过105个/ mm2。

公开(公告)号：US20140116583A1

公开(公告)日：2014-05-01

申请号：US14068256

申请日：2013-10-31

申请人： DOWA METALTECH CO., LTD.

发明人： Toshiya KAMADA ,  Takashi KIMURA ,  Weilin GAO ,  Fumiaki SASAKI ,  Akira SUGAWARA

IPC分类号： H01B1/02 ,  C22F1/08

CPC分类号： H01B1/026 ,  C21D2201/05 ,  C21D2211/004 ,  C22C9/06 ,  C22F1/08

摘要： A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0  (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

摘要翻译： Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。 细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。 粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。 该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度 在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。

公开(公告)号：US20120279618A1

公开(公告)日：2012-11-08

申请号：US13552939

申请日：2012-07-19

申请人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

发明人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

IPC分类号： C22F1/08

CPC分类号： C22C9/00 ,  C22F1/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

摘要翻译： 铜合金的片材具有包含1.2〜5.0重量％的钛，余量为铜和不可避免的杂质的化学组成，该材料的平均结晶粒径为5〜25μm，（最大结晶粒径 - 最小值） 晶粒尺寸）/（平均晶粒尺寸）为0.20以下，假设平均值的最大值，最小值和平均值均为多个区域中的相应一个区域中的晶粒尺寸的平均值， 分别选自具有相同形状和大小的片材的表面，分别为最大，最小和平均晶粒尺寸，并且具有满足I {420} / I0 {420}的晶体取向的材料， > 1.0，假设材料表面的{420}晶面上的X射线衍射强度和纯铜的标准粉末分别为I {420}和I0 {420}。

公开(公告)号：US20120049130A1

公开(公告)日：2012-03-01

申请号：US12671259

申请日：2009-05-21

申请人： Tomotsugu Aoyama ,  Akira Sugawara

发明人： Tomotsugu Aoyama ,  Akira Sugawara

IPC分类号： H01B1/02 ,  C22F1/08

CPC分类号： C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： A copper alloy sheet has a chemical composition comprising 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9≦(f{220}+f{311}+f{420})/(0.27·f{220}+0.49·f{311}+0.49·f{420})≦4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f{hkl}.

摘要翻译： 铜合金板具有0.1〜5重量％的镍，0.1〜5重量％的锡，0.01〜0.5重量％的磷，余量为铜和不可避免的杂质的化学组成，其结晶取向为2.9＆nlE; （f {220} + f {311} + f {420}）/（0.27·f {220} + 0.49·f {311} + 0.49·f {420}）＆nlE; 4.0，假设 在铜合金板的轧制表面上通过粉末X射线衍射法测量的{hkl}晶面为f {hkl}。

公开(公告)号：US08097102B2

公开(公告)日：2012-01-17

申请号：US12314281

申请日：2008-12-08

申请人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

发明人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

IPC分类号： C22F1/08 ,  C22C9/00

CPC分类号： C22C9/00 ,  C22C1/002 ,  C22F1/08

摘要： Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 μm. I{420}/I0{420}>1.0  (1) I{220}/I0{220}≦3.0  (2)

摘要翻译： 提供了一种满足高强度，优异的弯曲加工性，耐应力松弛性等全部要求的Cu-Ti系铜合金板材，具有优异的耐回弹性。 铜合金板材的组成为，含有1.0〜5.0质量％的Ti，并且任选地含有至多0.5％的Fe，至多1.0％的Co和至多1.5％的Ni中的至少一种，以及 进一步任选地含有适当范围内的量的Sn，Zn，Mg，Zr，Al，Si，P，B，Cr，Mn和V中的至少一种，余量为Cu和不可避免的杂质，并且具有晶体取向 满足以下表达式（1），并且优选满足以下表达式（2）。 材料的平均结晶粒径控制在10〜60μm。 I {420} / I0 {420}> 1.0（1）I {220} / I0 {220}＆nlE; 3.0（2）

公开(公告)号：US08011416B2

公开(公告)日：2011-09-06

申请号：US11528425

申请日：2006-09-28

申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

IPC分类号： B22D19/00

CPC分类号： C04B37/026 ,  B22D19/00 ,  B32B2311/12 ,  B32B2311/24 ,  C04B2237/122 ,  C04B2237/402 ,  C04B2237/407 ,  H05K1/0306 ,  H05K3/101 ,  H05K2203/128 ,  Y10T428/24917

摘要： To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

摘要翻译： 提供一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件和制造方法。 制造金属 - 陶瓷复合构件的制造装置，该装置包括：多个处理区域，即气氛置换/加热部件11，熔融金属推出部件21和冷却部件31; 以及用于允许模具通过这些多个处理区域的引导件48，其中放置有陶瓷构件86的模具60被连续地插入到设置在该引导件48中的模具入口43中，以实质上穿过引导件48处于屏蔽状态 在熔融金属推出部21中注入熔融金属53，在冷却部31中使熔融金属53冷却固化，使金属与陶瓷结合，制造金属 - 陶瓷复合部件 。

公开(公告)号：US20090229987A1

公开(公告)日：2009-09-17

申请号：US12088448

申请日：2006-09-12

申请人： Hiroshi Miyazawa ,  Reki Yonezawa

发明人： Hiroshi Miyazawa ,  Reki Yonezawa

IPC分类号： C25D15/00

CPC分类号： C25D15/02 ,  C25D3/46

摘要： There is provided a method for producing a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate by using a composite plating solution wherein carbon particles treated by an oxidation treatment and a silver matrix orientation adjusting agent are added to a silver plating solution, the method being capable of preventing the wear resistance of the composite plated product from being deteriorated even if the current density in a plating process is increased. The molar ratio of silver to free cyanogen in the composite plating solution is adjusted so as not to be less than 0.7, preferably so as to be in the range of from 0.7 to 1.3. The silver matrix orientation adjusting agent contains selenium ions, and is preferably potassium selenocyanate. The concentration of the silver matrix orientation adjusting agent in the composite plating solution is adjusted so as to be in the range of from 5 mg/l to 20 mg/l.

摘要翻译： 提供了一种复合电镀产品的制造方法，其中通过使用复合电镀溶液在基板上形成含有银层中的碳颗粒的复合材料的涂层，其中通过氧化处理和银矩阵取向调整的碳颗粒 添加到镀银溶液中的方法，即使电镀处理中的电流密度增加，也能够防止复合镀层的耐磨性劣化的方法。 将复合镀液中的银与游离氰的摩尔比调整为0.7以下，优选为0.7〜1.3的范围。 银基取向调节剂含有硒离子，优选为硒氰化钾。 将复合镀液中的银基取向调整剂的浓度调整为5mg / l〜20mg / l的范围。

公开(公告)号：US07563408B2

公开(公告)日：2009-07-21

申请号：US11213986

申请日：2005-08-30

申请人： Kouichi Hatakeyama

发明人： Kouichi Hatakeyama

IPC分类号： C22C9/00

CPC分类号： C22F1/08 ,  C22C9/02 ,  C22C9/06 ,  H05K1/09 ,  H05K2201/0355

摘要： A copper alloy of superior flex durability is provided that is suitable for the conducting members of flexible printed circuits. This is a copper alloy where the integrated intensity ratio I{200}/I{111} found by x-ray diffraction of the rolled surface is 1.5 or less. Examples of its specific chemical composition are: a composition where, in percent by weight, Fe: 0.045-0.095%, P: 0.010-0.030%, the sum of all elements other than Fe, P and Cu is less than 1% and the balance is Cu, and a composition where, in percent by weight, Ni: 0.5-3.0%,Sn: 0.5-2.0%, P: 0.03-0.10%, the sum of all elements other than Ni, Sn, P and Cu is less than 1% and the balance is Cu. The copper alloy has a conductivity of 85% IACS or greater.

摘要翻译： 提供了具有优异的柔性耐久性的铜合金，其适用于柔性印刷电路的导电构件。 这是通过轧制表面的x射线衍射发现的积分强度比I {200} / I {111}的铜合金为1.5以下。 其特定化学组成的实例是：以重量百分比计的Fe：0.045-0.095％，P：0.010-0.030％，Fe，P和Cu以外的所有元素的总和小于1％ 余量为Cu，Ni：0.5-3.0％，Sn：0.5〜2.0％，P：0.03〜0.10％，Ni，Sn，P，Cu以外的所有元素的总和除以重量％ 小于1％，余量为Cu。 铜合金的电导率为85％IACS以上。