Feature printability optimization by optical tool
    91.
    发明授权
    Feature printability optimization by optical tool 失效
    通过光学工具优化可打印性优化

    公开(公告)号:US07566517B1

    公开(公告)日:2009-07-28

    申请号:US11271207

    申请日:2005-11-09

    CPC classification number: G03F7/70625 G03F1/36 G03F1/44 G03F1/68

    Abstract: Methods and apparatus, including computer program products, implementing and using techniques for optimizing feature printability on a semiconductor wafer. A reticle with a quasi-periodic structure is provided. The quasi-periodic structure includes several elements that each contribute to the printed feature to be printed on the wafer. Each element exhibits a slight variation in a reticle feature characteristic compared to an adjacent other element in the quasi-periodic structure. The reticle with the quasi-periodic structure is used to print several printed features on the semiconductor wafer. Each printed feature corresponds to a specific element in the quasi-periodic structure. A metrology process is performed on the semiconductor wafer to generate a signature for each of the printed features. The signature is used to determine an optimum reticle feature characteristic that results in an optimum printed feature.

    Abstract translation: 方法和装置,包括计算机程序产品,用于优化半导体晶片上的特征可印刷性的实现和使用技术。 提供了具有准周期性结构的掩模版。 准周期结构包括几个元件,每个元件都有助于印刷在晶片上的印刷特征。 与准周期结构中相邻的另一个元素相比,每个元件在掩模版特征特征上表现出轻微的变化。 具有准周期结构的掩模版用于在半导体晶片上印刷多个印刷特征。 每个打印的特征对应于准周期结构中的特定元素。 在半导体晶片上进行计量过程,以产生每个印刷特征的签名。 该签名用于确定导致最佳印刷特征的最佳掩模版特征。

    Systems and methods for measuring one or more characteristics of patterned features on a specimen
    92.
    发明授权
    Systems and methods for measuring one or more characteristics of patterned features on a specimen 有权
    用于测量样品上图案特征的一个或多个特征的系统和方法

    公开(公告)号:US07463369B2

    公开(公告)日:2008-12-09

    申请号:US11277856

    申请日:2006-03-29

    Abstract: Systems and methods for measuring one or more characteristics of patterned features on a specimen are provided. One system includes an optical subsystem configured to acquire measurements of light scattered from the patterned features on the specimen at multiple angles of incidence, multiple azimuthal angles, and multiple wavelengths simultaneously. The system also includes a processor configured to determine the one or more characteristics of the patterned features from the measurements. One method includes acquiring measurements of light scattered from the patterned features on the specimen at multiple angles of incidence, multiple azimuthal angles, and multiple wavelengths simultaneously. The method also includes determining the one or more characteristics of the patterned features from the measurements.

    Abstract translation: 提供了用于测量样本上的图案特征的一个或多个特征的系统和方法。 一个系统包括光学子系统,被配置为从多个入射角,多个方位角和多个波长同时获取从样本上的图案化特征散射的光的测量。 该系统还包括配置成从测量中确定图案化特征的一个或多个特性的处理器。 一种方法包括以多个入射角,多个方位角和多个波长同时从样本上的图案化特征散射的光的测量。 该方法还包括从测量中确定图案化特征的一个或多个特性。

    Serrated Fourier filters and inspection systems
    93.
    发明授权
    Serrated Fourier filters and inspection systems 有权
    锯齿傅立叶滤波器和检查系统

    公开(公告)号:US07397557B2

    公开(公告)日:2008-07-08

    申请号:US11145873

    申请日:2005-06-06

    CPC classification number: G01N21/95623

    Abstract: Serrated Fourier filters and inspection systems are provided. One Fourier filter includes one or more blocking elements configured to block a portion of light from a wafer. The Fourier filter also includes periodic serrations formed on edges of the one or more blocking elements. The periodic serrations define a transition region of the one or more blocking elements. The periodic serrations are configured to vary transmission across the transition region such that variations in the transmission across the transition region are substantially smooth. One inspection system includes a Fourier filter configured as described above and a detector that is configured to detect light transmitted by the Fourier filter. Signals generated by the detector can be used to detect the defects on the wafer.

    Abstract translation: 提供锯齿傅立叶滤波器和检测系统。 一个傅立叶滤波器包括被配置为阻挡来自晶片的一部分光的一个或多个阻挡元件。 傅立叶滤波器还包括形成在一个或多个阻挡元件的边缘上的周期性锯齿。 周期性锯齿限定了一个或多个阻挡元件的过渡区域。 周期性锯齿被配置为改变穿过过渡区域的传输,使得跨越过渡区域的透射率的变化基本上是平滑的。 一个检查系统包括如上所述构造的傅里叶滤波器和被配置为检测由傅里叶滤波器发送的光的检测器。 由检测器产生的信号可用于检测晶片上的缺陷。

    Methods for imperfect insulating film electrical thickness/capacitance measurement
    94.
    发明授权
    Methods for imperfect insulating film electrical thickness/capacitance measurement 失效
    绝缘膜电气厚度/电容测量不完美的方法

    公开(公告)号:US07397254B1

    公开(公告)日:2008-07-08

    申请号:US11277053

    申请日:2006-03-21

    CPC classification number: G01R31/2648 G01R27/26 G01R31/312

    Abstract: Methods for determining an electrical parameter of an insulating film are provided. One method includes measuring a surface potential of a leaky insulating film without inducing leakage across the insulating film and determining the electrical parameter from the surface potential. Another method includes applying an electrical field across the insulating film. Leakage across the insulating film caused by the electrical field is negligible. The method also includes measuring a surface potential of the specimen and determining a potential of the substrate. In addition, the method includes determining a pure voltage across the insulating film from the surface potential and the substrate potential. The method further includes determining the electrical parameter from the pure voltage. The electrical parameter may be capacitance or electrical thickness of the insulating film.

    Abstract translation: 提供了确定绝缘膜的电参数的方法。 一种方法包括测量泄漏绝缘膜的表面电位,而不会导致绝缘膜上的泄漏并且从表面电位确定电参数。 另一种方法包括在绝缘膜上施加电场。 由电场引起的绝缘膜上的泄漏可忽略不计。 该方法还包括测量样品的表面电位并确定衬底的电位。 此外,该方法包括从表面电位和衬底电位确定绝缘膜两端的纯电压。 该方法还包括从纯电压确定电参数。 电气参数可以是绝缘膜的电容或电气厚度。

    Methods and systems for reticle inspection and defect review using aerial imaging
    95.
    发明授权
    Methods and systems for reticle inspection and defect review using aerial imaging 有权
    使用航空成像进行掩模检查和缺陷检查的方法和系统

    公开(公告)号:US07379175B1

    公开(公告)日:2008-05-27

    申请号:US10679617

    申请日:2003-10-06

    Abstract: Methods and systems for inspecting a reticle are provided. In an embodiment, a system may include an inspection subsystem configured to form a first aerial image of the reticle. The first aerial image may be used to detect defects on the reticle. The system may also include a review subsystem coupled to the inspection subsystem. For example, the inspection and review subsystems may have common optics, separate optics and a common stage, or separate stages and a common handler. The review subsystem may be configured to form a second aerial image of the reticle. The second aerial image may be used to analyze the defects. In another embodiment, the system may include an image computer configured to receive image data from the inspection and review subsystems representing the first and second aerial images. The image computer may also be configured to perform one or more functions on the image data.

    Abstract translation: 提供了用于检查掩模版的方法和系统。 在一个实施例中,系统可以包括被配置为形成掩模版的第一空间图像的检查子系统。 第一个空间图像可用于检测光罩上的缺陷。 系统还可以包括耦合到检查子系统的检查子系统。 例如,检查和检查子系统可以具有共同的光学,单独的光学和共同的阶段,或者分离的阶段和公共处理器。 检查子系统可以被配置为形成掩模版的第二空间图像。 第二个空间图像可用于分析缺陷。 在另一个实施例中,系统可以包括被配置为从表示第一和第二空间图像的检查和查看子系统接收图像数据的图像计算机。 图像计算机还可以被配置为对图像数据执行一个或多个功能。

    Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes
    96.
    发明授权
    Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes 有权
    使用多个检测波长方式检查基板的方法和装置

    公开(公告)号:US07352456B2

    公开(公告)日:2008-04-01

    申请号:US10410126

    申请日:2003-04-08

    Inventor: Steven R. Lange

    CPC classification number: G01N33/54366 G01N21/9501

    Abstract: A surface inspection apparatus and method are disclosed. In particular, the method and apparatus are capable of inspecting a surface in two (or more) optical regimes thereby enhancing the defect detection properties of such method and apparatus. A method involves illuminating the surface with light in a first wavelength range and a second wavelength range. The first wavelength range selected so that the surface is opaque to the light of the first wavelength range so that a resultant optical signal is produced that is predominated by diffractive and scattering properties of the surface. The second wavelength range is selected so that the surface is at least partially transmissive to light in the second wavelength range so that another resultant optical signal is produced that is predominated by thin film optical properties of the surface. The resultant optical signals are detected and processed to detect defects in the surface. Devices for implementing such methods are also disclosed.

    Abstract translation: 公开了一种表面检查装置和方法。 特别地,该方法和装置能够在两个(或多个)光学方式中检查表面,从而增强了这种方法和装置的缺陷检测特性。 一种方法包括用在第一波长范围和第二波长范围内的光来照射该表面。 选择的第一波长范围使得表面对于第一波长范围的光是不透明的,使得产生以表面的衍射和散射性质为主的所得光信号。 选择第二波长范围使得表面对于第二波长范围中的光至少部分透射,从而产生以表面的薄膜光学性质为主的另外产生的光信号。 检测并处理所得到的光信号以检测表面中的缺陷。 还公开了用于实现这些方法的装置。

    Methods and Systems for Detecting Defects on a Specimen Using a Combination of Bright Field Channel Data and Dark Field Channel Data
    98.
    发明申请
    Methods and Systems for Detecting Defects on a Specimen Using a Combination of Bright Field Channel Data and Dark Field Channel Data 有权
    使用明场通道数据和暗场通道数据组合检测样本缺陷的方法和系统

    公开(公告)号:US20070286473A1

    公开(公告)日:2007-12-13

    申请号:US11422955

    申请日:2006-06-08

    CPC classification number: G01N21/9501 G01N2021/8825

    Abstract: Various methods, carrier media, and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data are provided. One computer-implemented method includes combining pixel-level data acquired for the specimen by a bright field channel and a dark field channel of an inspection system. The method also includes detecting defects on the specimen by applying a two-dimensional threshold to the combined data. The two-dimensional threshold is defined as a function of a threshold for the data acquired by the bright field channel and a threshold for the data acquired by the dark field channel.

    Abstract translation: 提供了使用明场通道数据和暗场通道数据的组合来检测样本上的缺陷的各种方法,载体介质和系统。 一种计算机实现的方法包括将通过亮场通道获取的像素级数据和检查系统的暗场通道组合。 该方法还包括通过对组合数据应用二维阈值来检测样本上的缺陷。 二维阈值被定义为由亮场通道获取的数据的阈值和由暗场通道获取的数据的阈值的函数。

    Systems and methods for measuring stress in a specimen
    99.
    发明授权
    Systems and methods for measuring stress in a specimen 有权
    用于测量样品中应力的系统和方法

    公开(公告)号:US07274440B1

    公开(公告)日:2007-09-25

    申请号:US10936019

    申请日:2004-09-08

    Abstract: Systems and methods for measuring stress in a specimen are provided. One system includes an optical subsystem configured to measure stress-induced birefringence in patterned structures formed on the specimen. In some embodiments, the optical subsystem may be configured as a spectroscopic ellipsometer, a multi-angle laser ellipsometer, a polarimeter, a polarized reflectometer, or some combination thereof. The system also includes a processor coupled to the optical subsystem. The processor is configured to determine stress in a material of the patterned structures using the stress-induced birefringence measurements. One method includes measuring stress-induced birefringence in patterned structures formed on the specimen using an optical technique. The method also includes determining stress in a material of the patterned structures using the stress-induced birefringence measurements.

    Abstract translation: 提供了用于测量样品中应力的系统和方法。 一个系统包括被配置为测量形成在样本上的图案化结构中的应力诱导双折射的光学子系统。 在一些实施例中,光学子系统可以被配置为分光椭偏仪,多角度激光椭偏仪,偏振计,偏振反射计或其某种组合。 该系统还包括耦合到光学子系统的处理器。 处理器被配置为使用应力诱导的双折射测量来确定图案化结构的材料中的应力。 一种方法包括使用光学技术来测量在样品上形成的图案化结构中的应力诱导双折射。 该方法还包括使用应力诱导的双折射测量来确定图案化结构的材料中的应力。

    Systems and Methods for Controlling Deposition of a Charge on a Wafer for Measurement of One or More Electrical Properties of the Wafer
    100.
    发明申请
    Systems and Methods for Controlling Deposition of a Charge on a Wafer for Measurement of One or More Electrical Properties of the Wafer 有权
    用于控制在晶片上沉积电荷以测量晶片的一个或多个电性能的系统和方法

    公开(公告)号:US20070069759A1

    公开(公告)日:2007-03-29

    申请号:US11465893

    申请日:2006-08-21

    Abstract: Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.

    Abstract translation: 提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源,其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。

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