公开(公告)号：US11781237B2

公开(公告)日：2023-10-10

申请号：US17849370

申请日：2022-06-24

Applicant: ARCONIC TECHNOLOGIES LLC

Inventor： Ali Unal ,  June M. Epp ,  James M. Marinelli ,  Marissa Menanno

IPC: C25D11/24 ,  C25D11/08 ,  C25D11/16

CPC classification number: C25D11/24 ,  C25D11/08 ,  C25D11/16

Abstract: Methods of preparing 7xxx aluminum alloy products for adhesive bonding and products made therefrom are disclosed. Generally, the methods include preparing a 7xxx aluminum alloy product for anodizing, then anodizing the 7xxx aluminum alloy product, and then contacting the anodized 7xxx aluminum alloy product with an appropriate chemical to create a functionalized layer. The new 7xxx aluminum alloy products may realize improved shear bonding performance.

公开(公告)号：US20180305557A1

公开(公告)日：2018-10-25

申请号：US15769795

申请日：2016-10-21

Applicant: EPG (Engineered nanoProducts Germany) AG

Inventor： Ertugrul Arpac ,  Heike Schneider ,  Gunter Hoyer ,  Ralf Kockler ,  Sandra Arend

IPC: C09D5/08 ,  B05D1/02 ,  B05D3/02 ,  B05D7/14 ,  C09D5/02 ,  C09D4/06 ,  C09D175/06

CPC classification number: C09D5/08 ,  B05D1/02 ,  B05D3/0254 ,  B05D7/14 ,  C09D4/06 ,  C09D5/02 ,  C09D175/06 ,  C23C18/1216 ,  C23C18/122 ,  C23C18/1241 ,  C23C18/1254 ,  C25D11/08 ,  C25D11/16 ,  C25D11/246

Abstract: A process for producing a coated lightweight metal substrate, in particular, an aluminium substrate, by a wet-chemical application of a coating composition to the lightweight metal substrate and thermally curing the coating composition is provided. A coating material composition is also described that is formed from a sol-gel material.

公开(公告)号：US20180229263A1

公开(公告)日：2018-08-16

申请号：US15580175

申请日：2016-04-28

Applicant: NIPPON LIGHT METAL COMPANY, LTD.

Inventor： Yusuke Nishikori ,  Masanori Endo ,  Miyuki Yoshida

IPC: B05D3/10 ,  B05D7/14 ,  B05D7/24 ,  B29C45/14 ,  B32B15/085 ,  B32B15/20 ,  B32B27/34 ,  B32B27/36 ,  B32B38/00 ,  C25D11/04

CPC classification number: B05D3/107 ,  B05D1/02 ,  B05D1/06 ,  B05D7/14 ,  B05D7/24 ,  B05D2202/25 ,  B05D2507/02 ,  B29C45/14311 ,  B29C45/14811 ,  B29C2045/14327 ,  B29K2023/12 ,  B29K2069/00 ,  B32B15/085 ,  B32B15/20 ,  B32B27/34 ,  B32B27/365 ,  B32B38/0012 ,  B32B2038/002 ,  B32B2038/0052 ,  B32B2255/06 ,  B32B2307/728 ,  B32B2310/00 ,  B32B2311/24 ,  B32B2323/10 ,  B32B2369/00 ,  B32B2398/20 ,  C25D11/04 ,  C25D11/08

Abstract: A metal resin composite molded body wherein various metal bases and a resin molded body are integrally and firmly bonded with each other; and a versatile method for producing this metal resin composite molded body are provided. Particularly provided are: a metal resin composite molded body wherein an aluminum base and a polyolefin resin molded body are integrally and firmly bonded with each other; and a simple method for producing this metal resin composite molded body. A metal resin composite molded body comprises a metal base, a polypropylene resin layer and a thermoplastic resin molded body. The polypropylene resin layer is bonded to the metal base with a hydrophilic surface being interposed therebetween. The hydrophilic surface is formed on the metal base. The thermoplastic resin molded body is bonded to the polypropylene resin layer by means of anchoring effect and compatibilizing effect with the polypropylene resin layer.

公开(公告)号：US20180195196A1

公开(公告)日：2018-07-12

申请号：US15400635

申请日：2017-01-06

Applicant: MKS Instruments, Inc.

Inventor： Chiu-Ying Tai ,  Atul Gupta ,  Kevin Wenzel ,  Glenn Stanton

IPC: C25D11/12 ,  C25D11/02 ,  H01J37/32

CPC classification number: C25D11/12 ,  C23C16/4404 ,  C25D11/026 ,  C25D11/06 ,  C25D11/08 ,  C25D11/18 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  H01J37/32486 ,  H01J37/32495

Abstract: A method is introduced for creating a protective oxide layer over a surface of a metallic structure for use in a semiconductor processing system. The method includes providing the metallic structure, anodizing the surface of the metallic structure to form an anodization layer on the surface, and converting, using a plasma electrolytic oxidation process, at least a portion of the anodization layer to form the protective oxide layer.

公开(公告)号：US20180105939A1

公开(公告)日：2018-04-19

申请号：US15552226

申请日：2015-08-24

Applicant: GUANGDONG JANUS INTELLIGENT GROUP CORPORATION LIMITED ,  DONGGUAN JANUS ELECTRONIC PRECISION COMPONENTS CO., LTD.

Inventor： JIANMING YANG ,  SHOUDE XIE ,  CHANGMING WANG

IPC: C23C28/00 ,  B05D7/14 ,  C25D11/16 ,  C25D11/24

CPC classification number: C23C28/345 ,  B05D1/38 ,  B05D7/14 ,  B05D2202/25 ,  C23C14/024 ,  C23C14/16 ,  C23C14/5853 ,  C23C22/00 ,  C23C28/00 ,  C23C28/32 ,  C25D11/08 ,  C25D11/16 ,  C25D11/246

Abstract: Provided is a method for processing a die-cast aluminum alloy piece, comprising the following steps: performing a strengthening treatment on a die-cast aluminum alloy piece body (10) using a strengthening liquid, so as to form an organosilicon hardened layer (20) on the surface of the die-cast aluminum alloy piece body (10); forming an aluminum film layer (30) on the organosilicon hardened layer (20) by means of vacuum coating; performing an anodic oxidation treatment on the aluminum film layer (30), so that a part of the aluminum film layer (30) is oxidized to form an anodic oxidation layer (40), wherein the ratio of the thickness of the anodic oxidation layer (40) to that of the aluminum film layer (30) is (1-3):1; and performing a hole sealing treatment on the anodic oxidation layer (40). The invention further, relates to a die-cast aluminum alloy piece and a mobile terminal using the die-cast aluminum alloy piece.

公开(公告)号：US20180013148A1

公开(公告)日：2018-01-11

申请号：US15693551

申请日：2017-09-01

Applicant: FUJIFILM Corporation

Inventor： Atsushi MATSUURA ,  Hiroshi KOMATSU ,  Junji KAWAGUCHI ,  Hirokazu SAWADA

IPC: H01M4/80 ,  H01G11/70 ,  C25F3/04 ,  C25D11/20 ,  C25D11/08 ,  C22C21/00 ,  C22C1/02 ,  H01M10/0525 ,  B22D11/049

CPC classification number: H01M4/80 ,  B22D11/049 ,  C22C1/026 ,  C22C21/00 ,  C25D9/12 ,  C25D11/08 ,  C25D11/20 ,  C25F3/02 ,  C25F3/04 ,  H01G11/28 ,  H01G11/68 ,  H01G11/70 ,  H01M4/66 ,  H01M10/0525 ,  Y02E60/13 ,  Y02T10/7022

Abstract: An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.

公开(公告)号：US20170327964A1

公开(公告)日：2017-11-16

申请号：US15521992

申请日：2016-04-08

Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

Inventor： Yuanqing ZENG

IPC: C25D11/16 ,  C25D11/08 ,  C23F3/03 ,  C22C21/10 ,  B08B3/10 ,  C25D11/18 ,  B08B3/08

CPC classification number: C25D11/16 ,  B08B3/08 ,  B08B3/10 ,  C22C21/10 ,  C23F3/03 ,  C25D11/08 ,  C25D11/18

Abstract: An aluminum alloy is described and has compositions with mass percentage content consisting of: 5.0%-5.4% Zn; 0.9%-1.2% Mg; Cu

公开(公告)号：US20170292202A1

公开(公告)日：2017-10-12

申请号：US15092563

申请日：2016-04-06

Applicant: Apple Inc.

Inventor： James A. Curran ,  William A. Counts ,  Aaron D. Paterson

IPC: C25D11/18 ,  C25D11/20 ,  C25D11/12 ,  H05K5/04 ,  G06F1/16

CPC classification number: C25D11/18 ,  C25D11/04 ,  C25D11/08 ,  C25D11/10 ,  C25D11/12 ,  C25D11/20 ,  C25D11/243 ,  C25D11/246 ,  G06F1/1613 ,  G06F1/1656 ,  H05K5/04

Abstract: Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

公开(公告)号：US20170226651A1

公开(公告)日：2017-08-10

申请号：US15418235

申请日：2017-01-27

Applicant: Apple Inc.

Inventor： James A. Curran ,  Daniel T. McDonald ,  Sean R. Novak

IPC: C25D11/24

CPC classification number: C25D11/246 ,  C25D11/08 ,  C25D11/14 ,  C25D11/16 ,  C25D11/24 ,  C25D11/26

Abstract: The embodiments described herein relate to treatments for anodic layers. The methods described can be used to impart a white appearance for an anodized substrate. The anodized substrate can include a metal substrate and a porous anodic layer derived from the metal substrate. The porous anodic layer can include pores defined by pore walls and fissures formed within the pore walls. The fissures can act as a light scattering medium to diffusely reflect visible light. In some embodiments, the method can include forming fissures within the pore walls of the porous anodic layer. In some embodiments, exposing the porous anodic layer to an etching solution can form fissures. The method further includes removing a top portion of the porous anodic layer while retaining a portion of the porous anodic layer.

公开(公告)号：US20170167043A1

公开(公告)日：2017-06-15

申请号：US14967424

申请日：2015-12-14

Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE

Inventor： Li-Wen Weng ,  Chun-Chieh Tseng ,  Yue-Jun Wang ,  Ho-Chung Fu ,  Tzyy-Ker Sue

IPC: C25D11/08 ,  C25D11/16 ,  C25D11/24

CPC classification number: C25D11/08 ,  C25D11/026 ,  C25D11/16 ,  C25D11/24 ,  C25D11/26

Abstract: The present invention provides an electrolyte for surface treatment of a metal implant including 10-30 wt % of a sulfur-containing compound aqueous solution, 3-10 wt % of a phosphorous-containing compound aqueous solution, 0.5-2 wt % of an oxidant aqueous solution, and 0.5-5 wt % of a surfactant aqueous solution, with the rest being water. The concentration of the sulfur-containing compound aqueous solution is 0.1-3 M. The concentration of the phosphorous-containing compound aqueous solution is 0.05-2 M. The concentration of the oxidant aqueous solution is 0.05-1 M. The concentration of the surfactant aqueous solution is 0.05-5 M. As such, it is able to utilize the electrolyte for treating a surface of a metal implant, forming a porous oxide layer on the surface of the metal implant.