BRIGHTENING AND PASSIVATION OF STAINLESS STEEL SURFACES
    3.
    发明申请
    BRIGHTENING AND PASSIVATION OF STAINLESS STEEL SURFACES 审中-公开
    不锈钢表面的腐蚀和钝化

    公开(公告)号:US20150267307A1

    公开(公告)日:2015-09-24

    申请号:US14729431

    申请日:2015-06-03

    IPC分类号: C23F3/03 C23F1/28

    摘要: This invention relates to a composition for the brightening and/or passivating of stainless steel after pickling. The invention is based on the discovery that the presence of organic compounds containing multiple hydroxyl groups with at least 3, but not more than 8 carbon atoms as a further ingredient of passivating and brightening solution significantly increases the desmutting performance of pickled stainless steel surfaces. The compositions of the invention are especially useful for the passivating and brightening of stainless steel grades being alloyed with sulfur. The invention thus further encompasses a passivating and brightening process for pickled stainless steel surfaces wherein the stainless steel is alloyed with at least 0.10 at.-% of sulfur.

    摘要翻译: 本发明涉及酸洗后不锈钢的增白和/或钝化的组合物。 本发明基于以下发现:含有多个具有至少3个但不超过8个碳原子的羟基的有机化合物作为钝化和增亮溶液的另一成分的发现显着增加了酸洗的不锈钢表面的去污性能。 本发明的组合物对于与硫合金化的不锈钢等级的钝化和增亮是特别有用的。 因此,本发明进一步包括用于酸洗的不锈钢表面的钝化和增亮方法,其中不锈钢与至少0.10%(重量)的硫合金化。

    Chemical polishing of aluminum alloys
    5.
    发明授权
    Chemical polishing of aluminum alloys 失效
    铝合金化学抛光

    公开(公告)号:US4956022A

    公开(公告)日:1990-09-11

    申请号:US378464

    申请日:1989-07-12

    申请人: Issa S. Mahmoud

    发明人: Issa S. Mahmoud

    IPC分类号: C23F3/03 H05K1/05 H05K3/38

    CPC分类号: C23F3/03 H05K1/053 H05K3/382

    摘要: A chemical polishing bath and process are disclosed for pretreating aluminum and its alloys prior to plating or anodizing operations, which bath and process produce a mirrorlike finish.

    摘要翻译: 公开了用于在电镀或阳极氧化操作之前预处理铝及其合金的化学抛光浴和工艺,该浴和工艺产生镜面抛光。

    Silicon polishing solution preparation
    8.
    发明授权
    Silicon polishing solution preparation 失效
    硅抛光溶液制备

    公开(公告)号:US3930870A

    公开(公告)日:1976-01-06

    申请号:US429418

    申请日:1973-12-28

    申请人: Jagtar Singh Basi

    发明人: Jagtar Singh Basi

    CPC分类号: H01L21/30625

    摘要: An improved process for preparing a polishing solution for use in the chemical-mechanical polishing of silicon comprising copper nitrate, ammonium fluoride, nitric acid and ammonium nitrate. The latter two components are added to the copper nitrate, the system mixed well and then the ammonium fluoride added. The process eliminates the need for settling, decantation or filtration during solution preparation and permits substantially lowered amounts of copper nitrate to be used for silicon polishing. The silicon polishing solution is also described.