公开(公告)号：US20020165100A1

公开(公告)日：2002-11-07

申请号：US09798189

申请日：2001-03-02

Inventor： Hartmut Ulrich Bielefeldt ,  Barbel Martha Gotz ,  German Hammerl ,  Johannes Wilhelmus Maria Hilgenkamp ,  Jochen Dieter Mannhart ,  Andreas Fritz Albert Schmehl ,  Christof Walter Schneider ,  Robert Ralf Schulz

IPC: H01B001/00 ,  H01F001/00 ,  C04B002/00 ,  C10F005/00 ,  B32B001/00 ,  H01F006/00 ,  H01B012/00 ,  H01L039/00 ,  H01L039/24 ,  B23K001/00 ,  B28B001/00 ,  B29C031/00

CPC classification number: H01L39/128 ,  B32B18/00 ,  C04B35/45 ,  C04B35/4508 ,  C04B35/4512 ,  C04B35/4521 ,  C04B35/47 ,  C04B35/628 ,  C04B35/64 ,  C04B2235/3203 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3251 ,  C04B2235/3256 ,  C04B2235/3282 ,  C04B2235/3284 ,  C04B2235/3286 ,  C04B2235/3296 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/662 ,  C04B2235/85 ,  C04B2235/94 ,  Y10S505/78 ,  Y10S505/781

Abstract: The present invention concerns the improvement of the supercurrent carrying capabilities, i.e. the increase of critical current densities, of bicrystalline or polycrystalline superconductor structures, especially of high-Tc superconductors. By providing an appropriate predetermined dopant profile across the superconductor structure, in particular within or in the vicinity of the grain boundaries, the space-charge layers at the grain boundaries are reduced and thereby the current transport properties of the superconductor significantly improved. Simultaneously, the influence of magnetic fields on the critical current densities is significantly reduced, which in turn enhances the overall supercurrent carrying capabilities while keeping the supercurrent transport properties of the grains at good values.

Abstract translation: 本发明涉及双晶体或多晶超导体结构，特别是高Tc超导体的超导载体能力的提高，即临界电流密度的增加。 通过在超导体结构，特别是在晶界之内或附近提供适当的预定掺杂剂分布，晶界处的空间电荷层减少，从而显着提高超导体的电流传输性能。 同时，磁场对临界电流密度的影响显着降低，从而提高了整体超导载运能力，同时保持了晶粒的超导传输特性。

公开(公告)号：US20020084308A1

公开(公告)日：2002-07-04

申请号：US09811573

申请日：2001-03-20

Applicant: Fujitsu Limited, Kawasaki, Japan

Inventor： Kanako Imai ,  Nobutaka Ito ,  Fumihiko Ando

IPC: B23K001/00 ,  B23Q015/00 ,  B23K031/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11334 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/163 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract translation: 提供了一种评估安装在板上的BGA型带基半导体器件的焊接外部端子的配置，使得外部端子接合到设置在安装板上的焊盘的方法。 该方法包括以下步骤：获得与半导体器件的带基板的开口有关的几何数据，放置在与开口相对应的位置的焊球和安装板的焊盘以及焊接外部的起弧构造的步骤 终端基于几何日期。 该方法还包括计算在外部端子中产生的空隙体积的步骤，以补偿与带基板有关的几何数据。

公开(公告)号：US20020014515A1

公开(公告)日：2002-02-07

申请号：US09920006

申请日：2001-08-01

Inventor： Sreenivasan K. Koduri

IPC: B23K031/12 ,  B23K001/00

CPC classification number: H01L24/81 ,  H01L2224/45124 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/48

Abstract: A computerized system and method for identifying and correcting bond placement errors in a bonder pre-programmed to attach connecting bonds onto bond pads of an integrated circuit by first providing a sacrificial bond pad for a sacrificial bond, then using a vision system associated with the bonder to determine the actual center of the pad as the intended bond location, and instructing the bonder to place a bond in the pre-programmed center of the pad. Second, the vision system is used to determine the actual location of the bond. Next, the error between the intended location and the actual location is determined by computing distances and directions between the pre-programmed and actual centers and the actual bond location. Finally, a new command of the bonder is computed such that a repetition of the initial error would cause the bond to be located in the actual center of another pad. This new command is input to the bonder.

Abstract translation: 一种计算机化系统和方法，用于识别和校正预编程的接合器中的接合位置误差，以通过首先提供用于牺牲接合的牺牲接合焊盘将连接接合附接到集成电路的接合焊盘上，然后使用与接合器相关联的视觉系统 将焊盘的实际中心确定为预期的焊接位置，并指示焊接机将焊盘放置在焊盘的预编程中心。 第二，视觉系统用于确定债券的实际位置。 接下来，通过计算预编程和实际中心之间的距离和方向与实际的联系位置来确定预期位置与实际位置之间的误差。 最后，计算出粘合器的新命令，使得初始误差的重复将导致该键位于另一个焊盘的实际中心。 这个新命令被输入到焊接机。

公开(公告)号：US20010040029A1

公开(公告)日：2001-11-15

申请号：US08964260

申请日：1997-11-04

Applicant: donald verplancken

Inventor： ROBERT E. DAVENPORT ,  AVI TEPMAN

IPC: F28F007/00 ,  B23K001/00 ,  H02B001/00 ,  H02H001/00 ,  H05F001/00 ,  H01H001/00 ,  H01G002/00 ,  H01T023/00 ,  G05D023/00

CPC classification number: H01L21/67109 ,  C23C14/541 ,  C23C14/564 ,  H01L21/67103 ,  H01L21/68 ,  H01L21/6831 ,  Y10S269/903 ,  Y10S277/913 ,  Y10S277/922 ,  Y10S277/932 ,  Y10T279/23 ,  Y10T403/477 ,  Y10T403/479

Abstract: Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic. The seal forms a hermetic junction between the ceramic substrate support and the metal housing.

Abstract translation: 用于促进第一容积（室容积）和第二容积（可扩展的衬底支撑平台体积）之间的热传递的装置。 具体地说，该装置包括：限定腔室容积的室，其容纳室气氛，例如部分真空; 衬底支撑平台，其限定包含传热介质例如空气的可膨胀体积; 以及隔离室体积与传热介质的密封。 衬底支撑平台还包括：衬底支撑压板，其具有位于腔体内的第一表面和位于可膨胀体积内的第二表面; 密封到所述基板支撑台板的第二表面的壳体; 以及附接到壳体的可膨胀构件，例如波纹管，以提供由壳体和波纹管限定的可膨胀体积的膨胀。 壳体通常由金属制成，并且衬底支撑件通常由陶瓷制成。 密封件在陶瓷基板支撑件和金属外壳之间形成密封接合部。

公开(公告)号：US20010013534A1

公开(公告)日：2001-08-16

申请号：US09773663

申请日：2001-02-02

Applicant: YAZAKI CORPORATION

Inventor： Hideo Takahashi ,  Noboru Yamaguchi

IPC: B23K001/00 ,  B23K020/08 ,  B23K031/02 ,  B23K035/12

CPC classification number: B23K35/34 ,  B23K1/0008 ,  B23K2101/36 ,  H01M2/26 ,  H01M2/34 ,  H01M2200/103

Abstract: In a soldering method for soldering a thermit case 26 and a pair of bus bars 11a, 19a to be electrically connected to the thermit case 26, a portion to be heated P of the thermit case 26 which is spaced from the respective bus bars 11a, 19a by an approximately equal distance is heated by a gas burner 71, and solders are simultaneously supplied from solder wire supply portions 75a, 75b to a pair of solder joining faces 22 for joining the thermit case 26 and the pair of bus bars 11a, 19a, after the portion to be heated P has been heated. The temperatures of the pair of solder joining faces 22 are made substantially equal to each other by heating the portion to be heated P so that solders are simultaneously supplied to the pair of solder joining faces 22.

Abstract translation: 在将热电偶壳体26和一对母线11a，19a焊接到电连接到电热箱26的焊接方法中，与各个母线11a间隔开的热电容器26的被加热部分P， 19a通过气体燃烧器71加热，并且焊料同时从焊丝供给部75a，75b供给到一对焊接接合面22，用于接合热敏箱26和一对母线11a，19a 在被加热部分P被加热之后。 通过加热被加热部分P使一对焊接接合面22的温度基本上彼此相等，使得焊料同时供给到该对焊料接合面22。

公开(公告)号：US20040262364A1

公开(公告)日：2004-12-30

申请号：US10872960

申请日：2004-06-21

Inventor： P. David Halstead ,  Garry W. McNabb ,  David E. Wright

IPC: B23K001/00

CPC classification number: B21F15/08 ,  A42B3/20 ,  Y10S72/702 ,  Y10T29/49826 ,  Y10T29/49888

Abstract: A method of making a face mask including the steps of providing a plurality of lengths of Grade 2, commercially pure titanium wire, having a diameter of from about 0.21 to about 0.24 inches; forming each length at room temperature to a desired bend angle by bending the member at room temperature using rotary bending apparatus to a first bend angle that is from about 1.25 to about 1.35 times greater than the desired bend angle; and welding each of the thus formed lengths to at least one other of the lengths in an ambient, oxygen containing environment.

公开(公告)号：US20040245315A1

公开(公告)日：2004-12-09

申请号：US10454350

申请日：2003-06-04

Inventor： Roman Gr. Maev ,  Frank J. Ewasyshyn ,  Serguei A. Titov ,  John M. Paille ,  Elena Yu Maeva ,  Alexey A. Denisov ,  Fedar M. Seviaryn

IPC: B23K001/00

CPC classification number: G01N29/262 ,  G01N2291/02827 ,  G01N2291/02854 ,  G01N2291/044 ,  G01N2291/106 ,  G01N2291/2672

Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.

Abstract translation: 用于评估点焊的尺寸和/或质量的方法和装置。 该装置包括布置有延迟线的超声换能器的二维阵列，用于邻近焊缝的表面定位。 在延迟线和焊接表面之间放置一层凝胶。 换能器阵列发射超声波进入焊缝。 反射波被传感器接收并转发到中央处理单元，中央处理单元分析时间延迟，振幅和振幅衰减，以计算焊接熔核的边界，焊接材料的厚度，凝胶层的厚度和 其他因素有助于焊接质量。

公开(公告)号：US20040232207A1

公开(公告)日：2004-11-25

申请号：US10621600

申请日：2003-07-17

Inventor： Robert Andrew Alford ,  Johannis Josephus Den Boer ,  Anthony Thomas Cole ,  Klisthenis Dimitriadis ,  Michalakis Efthymiou ,  Rama Krishna Siva Gunturi ,  Robert Nicholas Worrall ,  Djurre Hans Zijsling ,  Ali Joseph Cox

IPC: B23K001/00

CPC classification number: B23K1/00 ,  B23K9/32 ,  B23K13/01 ,  B23K20/02 ,  B23K20/26 ,  B23K2101/06

Abstract: An automated method for forge welding tubulars including heating the tubular ends to be joined in a welding chamber while the heated tubular ends are maintained aligned and parallel relative to each other and at a small spacing, whereupon the heated tubular ends are pressed together while a reducing shield gas is injected into the chamber. The positions of the tubular ends are monitored by cameras which are coupled to a pyrometric and position monitoring system which automatically adjusts the position of the tubular ends relative to each other and the heat supplied to the tubular ends during the heating step until the tubular ends have reached a predetermined temperature, whereupon the tubular ends are moved towards each other along a distance which exceeds the spacing monitored between the tubular ends during the heating step with a selected extra distance, such that the tubular ends are firmly pressed against each other and the amount of external and/or internal upset of the tubular ends in the welding zone is limited to an acceptable level.

Abstract translation: 一种用于锻造焊接管子的自动化方法，包括在加热的管状端部相对于彼此保持对准且平行并且以小的间隔加热要接合在焊接室中的管状端部，然后将加热的管状端部压在一起，同时还原 保护气体被注入到腔室中。 管状末端的位置由耦合到高温测量位置监测系统的相机监测，该系统自动调节管状端部相对于彼此的位置，以及在加热步骤期间供应到管状端部的热量直到管状端部具有 达到预定温度，于是管状端部在加热步骤期间沿着超过在管状端部之间监测的间隔的距离朝向彼此移动，具有选定的额外距离，使得管状端部被牢固地压靠在彼此，并且量 在焊接区域中的管状端部的外部和/或内部镦锻被限制在可接受的水平。

公开(公告)号：US20040094599A1

公开(公告)日：2004-05-20

申请号：US10298422

申请日：2002-11-18

Inventor： Richard J. Luebs

IPC: B23K001/00

CPC classification number: B23K1/018 ,  H05K13/0486

Abstract: A rework nozzle comprises a rework duct adapted to direct a high temperature gas flow toward a rework component. The rework nozzle also comprises at least one cooling duct adapted to direct a low temperature gas flow to an area adjacent the component to maintain the adjacent area at a reduced temperature relative to a temperature of the high temperature gas flow.

Abstract translation: 返工喷嘴包括适于将高温气流引向返工部件的返修管道。 返工喷嘴还包括至少一个冷却管道，其适于将低温气体流引导到邻近部件的区域，以将相邻区域相对于高温气体流的温度保持在降低的温度。

公开(公告)号：US20040083601A1

公开(公告)日：2004-05-06

申请号：US10694665

申请日：2003-10-27

Applicant: Matsushita Electric Industrial Co., Ltd. ,  Toyota Jidosha Kabushiki Kaisha

Inventor： Shoji Karasawa ,  Yugo Nakagawa ,  Hiromi Kajiya

IPC: B23P019/00 ,  B23K001/00

CPC classification number: H01M2/266 ,  Y10T29/49108 ,  Y10T29/49114 ,  Y10T29/53135

Abstract: Positive and negative electrode plates, after being dried, are layered alternately upon one another with intervening separators therebetween to constitute electrode plate groups. These electrode plate groups are transferred in succession from one to another of a plurality of preliminary chambers, which are respectively constructed to be able to create vacuum of various levels and arranged so that the vacuum level is gradually increased, and finally introduced into a processing chamber in which the vacuum level is highest, where the welding of collector plates to the electrode plate groups is performed with an electronic beam irradiating device. After that, the electrode plate groups are taken out through a post-processing chamber.