Wafer with additional circuit parts in the kerf area for testing integrated circuits on the wafer
    101.
    发明授权
    Wafer with additional circuit parts in the kerf area for testing integrated circuits on the wafer 有权
    晶圆在切角区域附加电路部件,用于测试晶圆上的集成电路

    公开(公告)号:US06787801B2

    公开(公告)日:2004-09-07

    申请号:US10247574

    申请日:2002-09-19

    Abstract: Integrated circuits are tested on the wafer level through an additional circuit part that is electrically connected via at least one connecting line with the associated integrated circuit. The additional circuit part is integrated into an interspace between the integrated circuits of the wafer. Functions of the integrated circuit can be controlled via the connecting line. For example, in the case of a memory module such as a DRAM, internal voltages and/or currents of the integrated circuit can advantageously be measured even on internal lines which are otherwise only accessible with difficulty. Following the wafer-level testing and dicing of the integrated circuits into individual chips, the additional circuit part becomes unusable.

    Abstract translation: 通过经由至少一个连接线与相关联的集成电路电连接的附加电路部件在晶片级上测试集成电路。 附加电路部分集成在晶片的集成电路之间的间隙中。 集成电路的功能可以通过连接线控制。 例如,在诸如DRAM的存储器模块的情况下,集成电路的内部电压和/或电流即使在内部线路上也可以有利地被测量,否则这些线路将难以进入。 在将晶圆级测试和集成电路切割成单个芯片之后,附加电路部分变得不可用。

    Transistor configuration for a bandgap circuit
    102.
    发明授权
    Transistor configuration for a bandgap circuit 失效
    晶体管配置用于带隙电路

    公开(公告)号:US06768139B2

    公开(公告)日:2004-07-27

    申请号:US10217184

    申请日:2002-08-12

    CPC classification number: G05F3/30 H01L29/7327

    Abstract: A transistor configuration for a bandgap circuit is configured in the form of an npn transistor. An insulated p-type well, which is surrounded by a buried n-type well, is used as a base terminal. The n-type well constitutes the emitter terminal. A negatively doped region, which acts as a collector terminal, is formed in the p-type well. The structure that is used exists in DRAM processes, and it can therefore be used to form an npn transistor as a footprint diode in bandgap circuits.

    Abstract translation: 用于带隙电路的晶体管配置被配置为npn晶体管的形式。 被埋置的n型阱包围的绝缘p型阱用作基极端子。 n型阱构成发射极端子。 在p型阱中形成用作集电极端子的负掺杂区域。 所使用的结构存在于DRAM工艺中,因此可用于在带隙电路中形成npn晶体管作为覆盖二极管。

    Semiconductor memory and method for operating the semiconductor memory
    103.
    发明授权
    Semiconductor memory and method for operating the semiconductor memory 失效
    半导体存储器和半导体存储器的操作方法

    公开(公告)号:US06738309B2

    公开(公告)日:2004-05-18

    申请号:US10154597

    申请日:2002-05-23

    CPC classification number: G11C7/1066 G11C7/1051 G11C7/22 G11C7/222

    Abstract: A semiconductor memory is described which has a clock input, a signal input, a data output, a measuring device, a control circuit, and a latency. The latency elapses between the activation of the signal input and the availability of the data to be read at the data output. A clock signal is fed to the clock input. On the basis of the clock signal, the measuring device determines a value for the latency and the control circuit configures the semiconductor memory with the determined value for the operation of the semiconductor memory.

    Abstract translation: 描述了具有时钟输入,信号输入,数据输出,测量装置,控制电路和等待时间的半导体存储器。 在信号输入的激活和在数据输出端要读取的数据的可用性之间经过了延迟。 时钟信号被馈送到时钟输入。 基于时钟信号,测量装置确定延迟的值,并且控制电路以半导体存储器的操作的确定值配置半导体存储器。

    Circuit configuration for deactivating word lines in a memory matrix

    公开(公告)号:US06477106B2

    公开(公告)日:2002-11-05

    申请号:US09925170

    申请日:2001-08-08

    CPC classification number: G11C8/08 G11C8/00

    Abstract: A circuit configuration for deactivating word lines in a memory matrix. The circuit configuration contains controllable connection devices for connecting the relevant word line to a common supply line system carrying the deactivation potential for the word lines. The circuit configuration contains a control circuit that, in response to a deactivation command, produces a deactivation control signal that turns on the controllable connection devices. A reduction device is provided which can be switched on selectively and which, when switched on, limits the currents flowing through the turned-on connection devices to such an extent that the total current flowing via the supply line system does not exceed a prescribed value.

    Fusible link configuration in integrated circuits
    107.
    发明授权
    Fusible link configuration in integrated circuits 有权
    集成电路中的可熔链路配置

    公开(公告)号:US06407586B2

    公开(公告)日:2002-06-18

    申请号:US09781813

    申请日:2001-02-12

    CPC classification number: H01L23/5258 H01L2924/0002 H01L2924/00

    Abstract: The invention relates to a fusible link configuration in or on integrated circuits, in particular highly integrated memory chips, in which in each case one bank of fusible links (F1, F2, . . . ), together with an evaluation logic unit is configured beside and in association with a memory field segment. The evaluation logic unit is electrically connected to the fusible links (F1, F2, . . . ) and determines whether one or more of the fusible links (F1, F2, . . . ) is severed. One or more banks of the fusible links (F1, F2, . . . ) are divided up into smaller units while restricting the width(s) of the bank or banks. The units are grouped such that at least some of the fusible links (F1, F2, . . . ) are located beside one another transversely with respect to the width direction of the bank.

    Abstract translation: 本发明涉及集成电路中或其上的可熔链路配置,特别是高度集成的存储器芯片,其中在每种情况下,一组可熔链路(F1,F2,...)以及评估逻辑单元被配置在旁边 并且与存储器区段相关联。 评估逻辑单元电连接到可熔链路(F1,F2 ...),并确定是否断开了一个或多个可熔链路(F1,F2 ...)。 一个或多个可熔链节(F1,F2 ...)被划分成更小的单位,同时限制银行或银行的宽度。 这些单元被分组成使得至少一些可熔链节(F1,F2 ...)相对于堤的宽度方向横向彼此相邻。

    Process for producing a semiconductor device with a roughened semiconductor surface
    108.
    发明授权
    Process for producing a semiconductor device with a roughened semiconductor surface 有权
    用于生产具有粗糙化的半导体表面的半导体器件的工艺

    公开(公告)号:US06309953B1

    公开(公告)日:2001-10-30

    申请号:US09517299

    申请日:2000-03-02

    Abstract: A process for producing a semiconductor device includes the following sequential steps: producing a semiconductor body having an AlxGa1−xAs layer with an upper surface, where x≦0.40; applying a contact metallization made of a non-noble metallic material to the AlxGa1−xAs layer; precleaning a semiconductor surface to produce a hydrophilic semiconductor surface; roughening the upper surface of the AlxGa1−xAs layer by etching with an etching mixture of hydrogen peroxide ≧30% and hydrofluoric acid ≧40% (1000:6) for a period of from 1 to 2.5 minutes; and re-etching with a dilute mineral acid. According to another embodiment, 0≦x≦1 and the upper surface of the AlxGa1−xAs layer is roughened by etching with nitric acid 65% at temperatures of between 0° C. and 30° C.

    Abstract translation: 制造半导体器件的方法包括以下顺序步骤:制备具有上表面的Al x Ga 1-x As层的半导体本体,其中x <= 0.40; 将由非贵金属材料制成的接触金属化应用于Al x Ga 1-x As层; 预清洁半导体表面以产生亲水性半导体表面; 通过用过氧化氢> = 30%和氢氟酸≥40%(1000:6)的蚀刻混合物蚀刻1至2.5分钟来使Al x Ga 1-x As层的上表面粗糙化; 并用稀释的无机酸重新蚀刻。 根据另一个实施方案,通过在0℃至30℃的温度下用硝酸蚀刻65%使0≤x≤1并且Al x Ga 1-x As层的上表面被粗糙化。

    Process for producing a semiconductor device with a roughened
semiconductor surface
    109.
    发明授权
    Process for producing a semiconductor device with a roughened semiconductor surface 失效
    用于生产具有粗糙化的半导体表面的半导体器件的工艺

    公开(公告)号:US6140248A

    公开(公告)日:2000-10-31

    申请号:US918251

    申请日:1997-08-25

    Abstract: A process for producing a semiconductor device includes the following sequential steps: producing a semiconductor body having an Al.sub.x Ga.sub.1-x As layer with an upper surface, where x.ltoreq.0.40; applying a contact metallization made of a non-noble metallic material to the Al.sub.x Ga.sub.1-x As layer; precleaning a semiconductor surface to produce a hydrophilic semiconductor surface; roughening the upper surface of the Al.sub.x Ga.sub.1-x As layer by etching with an etching mixture of hydrogen peroxide.gtoreq.30% and hydrofluoric acid.gtoreq.40% (1000:6) for a period of from 1 to 2.5 minutes; and re-etching with a dilute mineral acid. According to another embodiment, 0.ltoreq.x.ltoreq.1 and the upper surface of the Al.sub.x Ga.sub.1-x As layer is roughened by etching with nitric acid 65% at temperatures of between 0.degree. C. and 30.degree. C.

    Abstract translation: 一种制造半导体器件的方法包括以下顺序步骤:制备具有上表面的Al x Ga 1-x As层的半导体本体,其中x <0.40; 将由非贵金属材料制成的接触金属化应用于Al x Ga 1-x As层; 预清洁半导体表面以产生亲水性半导体表面; 通过用过氧化氢> 30%和氢氟酸≥40%(1000:6)的蚀刻混合物进行1〜2.5分钟的时间,使Al x Ga 1-x As层的上表面粗糙化; 并用稀释的无机酸重新蚀刻。 根据另一个实施方案,通过在0℃至30℃的温度下用硝酸蚀刻65%使0≤x≤1并且Al x Ga 1-x As层的上表面被粗糙化。

    Lockable glove compartment cover arrangement for vehicles
    110.
    发明授权
    Lockable glove compartment cover arrangement for vehicles 失效
    用于车辆的可锁定手套箱盖布置

    公开(公告)号:US4896520A

    公开(公告)日:1990-01-30

    申请号:US237383

    申请日:1988-08-29

    Abstract: The invention relates to a lockable glove and auxiliary compartment cover system for motor cars having a lock which is transferable into its tripping position by the stressing of a tripping lever by means of an actuating element. A closing member is provided which can be rotated between positions permitting and blocking the operative connection between the actuating element and the lock to change the security condition of the system. The change of the security condition occurs by means of a toothed-wheel gear which comprises a spur gear element rotatable with the closing element and a further gear element meshing with the spur gear element. In order to permit a handier arrangement of the actuating elements, the further gear element is likewise constructed as a rotatably mounted spur gear element, at least one of the spur gear elements, which belongs to a push-button, is guided for axial sliding, and a tripping stud protrudes eccentrically from the spur gear elements guided for axial sliding by means of which the tripping lever is pivotable in order to trip the lock.

    Abstract translation: 本发明涉及一种用于机动车辆的可锁定手套和辅助舱盖系统,其具有通过致动元件对脱扣杆的应力可转移到其脱扣位置的锁。 提供闭合构件,其可以在允许和阻止致动元件和锁之间的操作连接的位置之间旋转以改变系统的安全状态。 安全条件的改变是通过齿轮齿轮发生的,该齿轮包括可与闭合元件一起旋转的正齿轮元件和与正齿轮元件啮合的另一个齿轮元件。 为了允许致动元件的更方便的布置,另外的齿轮元件同样被构造为可旋转地安装的正齿轮元件,属于按钮的至少一个正齿轮元件被引导用于轴向滑动, 并且跳闸螺栓从被引导用于轴向滑动的正齿轮元件偏心地突出,通过该螺栓将脱扣杆可枢转以便跳闸。

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