摘要:
A circuit topology for multiple loads includes a driving terminal, first and second signal receiving terminals, and a capacitor. The driving terminal is connected to a node through a first transmission line. The node is connected to the first and second signal receiving terminals through second and third transmission lines. The second transmission line is longer than the third transmission line, and a difference between lengths of the second and third transmission lines is greater than a product of a transmission speed and a rise time of signals from the driving terminal. A first terminal of the capacitor is connected to the third transmission line. A second terminal of the capacitor is grounded. A distance between the capacitor and the second signal receiving terminal is less than a distance between the capacitor and the node.
摘要:
A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
摘要:
In a method for testing serial attached SCSI (SAS) ports of a server using a computing device, the computing device connects to an oscilloscope and a mechanical arm that is equipped with a test fixture having a probe. The mechanical arm controls the probe to be plugged into one of the SAS ports. The method adjusts an intensity grade of the SAS signals through the SAS port, and controls the SAS port to generate a SAS signal corresponding to the intensity grade. The test fixture obtains the SAS signal from the SAS port, and the oscilloscope measures test parameters of the SAS signal. The method analyzes values of the test parameters to find an optimal SAS signal, determines an intensity grade of the optimal SAS signal as a driving parameter of the SAS port, and accordingly generates a test report of the SAS ports.
摘要:
A motherboard interconnection method includes positioning a first and a third electronic elements on a top layer of a motherboard interconnection device, and positioning a second and a fourth electronic elements on a bottom layer of the motherboard interconnection device. The method connects a first end of the first electronic element on the top layer to the first end of the second electronic element on the bottom layer with a first via hole, and connects the first end of the third electronic element on the top layer to the first end of the fourth electronic element on the bottom layer with a second via hole. The method further connects a second ends of the two electronic elements on the top layer to a first part, and connects the second ends of the two electronic elements on the bottom layer to a second part.
摘要:
An actuating mechanism includes first and second hollow outer shafts, two rotating wheels located between the first and second outer shafts, and an inner shaft received in the second outer shaft. Each of the first and second outer shafts forms a connecting portion at one end thereof. Each connecting portion defines two receiving holes. Each rotating wheel includes a body and a rod extending through the body. The bodies of the rotating wheels are in contact with each other. Two ends of the rod of each rotating wheel are correspondingly received in the receiving holes of the first and second outer shafts to connect the first and second outer shafts together. One end of the inner shaft contacts the rod of one rotating wheel. The inner shaft is rotatable in the second outer shaft to drive the two rotating wheels to rotate.
摘要:
In a method for optimizing an order in which certain points on a circuit board can be tested and evaluated, a coordinate system is established in a circuit diagram of a circuit board, and at least one locating point is preset. When an operator selects a signal path routing within the circuit diagram, the method can display the testing points in the selected signal path routing on a display device. After calculating the distance between each of the testing points and each of the at least one locating point, a group of distances is obtained. By comparing the distances, the minimum distance can be determined from the group of distances. The method further optimizes the order of the testing points according to the distance between each of the testing points and the locating point that consists of the minimum distance.
摘要:
A method for configuring setting values of oscilloscopes selects manufactures for a first oscilloscope and a second oscilloscope, and sends a command of acquiring a type respectively to the first oscilloscope and the second oscilloscope using the control codes of the selected manufacturers, to determine if the selected manufactures are the actual manufacturer. The method sends a command of acquiring setting values, respectively to the first oscilloscope and the second oscilloscope, using the control codes of the selected manufacturers, receives and compares the setting values of the first oscilloscope and the second oscilloscope. The method changes the setting values of the second oscilloscope to be same or similar with the first oscilloscope, and writes the changed setting values into the second oscilloscope.
摘要:
An exemplary actuating mechanism includes a driving shaft and a driven shaft. The driving shaft includes a connecting end. Engaging blocks are formed on the connecting end with a clearance defined between each two neighboring engaging blocks. The driven shaft includes a pivot end. Protruding blocks are formed on the pivot end with a gap defined between each two neighboring protruding blocks. The driving shaft is connected with the driven shaft via the engaging blocks of the connecting end respectively engaged in the gaps and the protruding blocks of the pivot end respectively engaged in the clearances.
摘要:
A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
摘要:
An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.