Abstract:
Organometallic precursors may be utilized to form titanium silicon nitride films that act as heaters for phase change memories. By using a combination of TDMAT and TrDMASi, for example in a metal organic chemical vapor deposition chamber, a relatively high percentage of silicon may be achieved in reasonable deposition times, in some embodiments. In one embodiment, two separate bubblers may be utilized to feed the two organometallic compounds in gaseous form to the deposition chamber so that the relative proportions of the precursors can be readily controlled.
Abstract:
A semiconductor integrated circuit includes a multi-mode control signal generating unit configured to control an activation of a up/down mat I/O switch control signal, which controls I/O switches in a up/down mat, according to a multi-test mode signal and a read/write discriminating signal, a multi-mode decoder configured to output multi-mat select signals to simultaneously activate a plurality of mats according to a multi-test mode active write signal, and a mat controller configured to enable word lines and the I/O switches according to the up/down mat I/O switch control signal and the multi-mat select signals.
Abstract:
A method includes forming a plurality of dummy gate structures on a substrate, each dummy gate structure including a dummy gate electrode and a dummy gate mask, forming a first insulation layer on the substrate and the dummy gate structures to fill a first space between the dummy gate structures, planarizing upper portions of the first insulation layer and the dummy gate structures, removing the remaining first insulation layer to expose a portion of the substrate, forming an etch stop layer on the remaining dummy gate structures and the exposed portion of the substrate, forming a second insulation layer on the etch stop layer to fill a second space between the dummy gate structures, planarizing upper portions of the second insulation layer and the etch stop layer to expose the dummy gate electrodes, removing the exposed dummy gate electrodes to form trenches, and forming metal gate electrodes in the trenches.
Abstract:
In one or more embodiments, methods of fabricating current-confining stack structures in a phase change memory switch (PCMS) cell are provided. One embodiment shows a method of fabricating a PCMS cell with current in an upper chalcogenide confined in the row and column directions. In one embodiment, methods of fabricating a PCMS cell with sub-lithographic critical dimension memory chalcogenide are shown. In another embodiment, methods of fabricating a PCMS cell with sub-lithographic critical dimension middle electrode heaters are disclosed.
Abstract:
Disclosed is an air conditioner having a control box assembly, which enhances the serviceability of a circuit board and reduces production costs. In the air conditioner, which has a casing unit forming an external appearance of the air conditioner, a heat exchanger, a blowing device, and a control box assembly provided in the casing, the control box assembly includes a mounting unit mounting a circuit board; a control box housing the circuit board and the mounting unit; and guide units provided in the control box to guide a rectilinear reciprocating motion of the mounting unit to allow the mounting unit to come into and out of the control box and guide a rotating motion of the mounting unit in the case that the mounting unit is located at a designated position.
Abstract:
In one embodiment of the present disclosure, a composite electrode for a battery is provided. The composite electrode includes silver vanadium oxide present in an amount from about 75 weight percent to about 99 weight percent and polypyrrole present in an amount from about 1 weight percent to about 25 weight percent.
Abstract:
A method includes forming a plurality of dummy gate structures on a substrate, each dummy gate structure including a dummy gate electrode and a dummy gate mask, forming a first insulation layer on the substrate and the dummy gate structures to fill a first space between the dummy gate structures, planarizing upper portions of the first insulation layer and the dummy gate structures, removing the remaining first insulation layer to expose a portion of the substrate, forming an etch stop layer on the remaining dummy gate structures and the exposed portion of the substrate, forming a second insulation layer on the etch stop layer to fill a second space between the dummy gate structures, planarizing upper portions of the second insulation layer and the etch stop layer to expose the dummy gate electrodes, removing the exposed dummy gate electrodes to form trenches, and forming metal gate electrodes in the trenches.
Abstract:
A semiconductor package includes a first substrate on which a first semiconductor chip is mounted, a second substrate spaced apart from the first substrate and on which a second semiconductor chip is mounted, first pads disposed on the first substrate, second pads disposed on the second substrate to be opposite to the first pads, and connection patterns electrically connecting the opposite first and second pads to each other, respectively. The first pads are disposed asymmetrically with respect to the central axis of the first substrate.
Abstract:
In one embodiment of the present disclosure, a composite electrode for a battery is provided. The composite electrode includes silver vanadium oxide present in an amount from about 75 weight percent to about 99 weight percent and polypyrrole present in an amount from about 1 weight percent to about 25 weight percent.
Abstract:
A semiconductor memory device is provided that is capable of reading out mode register information stored in a register adapted for LPDDR2 (Low Power DDR2), through DQ pads. The semiconductor memory device includes a mode register control unit configured to receive address signals, a mode register write signal and a mode register read signal and generate a flag signal and at least one output information signal, and a global I/O line latch unit for transferring the output information signal to a global I/O line in response to the flag signal.